Abstract: Spacing elements are integrally formed on the constituent surfaces of conductive interfaces of electronic circuit device components for providing uniform thickness solder or other bonding film between the surfaces. The interfaces may be electrically conductive interfaces such as those defined between leads and substrate contact pads as well as thermally conductive interfaces such as those defined between heat sinks and substrates. Any suitable spacers which maintain the constitutent surfaces a selected distance apart when the components are pressed together may be employed such as edge and corner flanges, convex dimples, annular protrusions, tangs, among others. A tool is disclosed for forming the annular protrusions that is advantageously employed with comparatively thick electronic circuit device components and with laminated electronic circuit device components having a comparatively hard layer.

Abstract: A high power semiconductor package having a unitary extruded metal housing which serves as an efficient thermal heat sink and which includes integral constituents for retaining an encapsulating material. The extruded housing has open sides and an open top to facilitate installation of the semiconductor die assemblies and associated electronic components and terminals prior to enclosure in a molded or otherwise formed encapsulant.

Abstract: The present invention discloses a plurality of severable alignment fingers integrally formed with a leadframe for selectively aligning one or more electronic circuit device components, that may be of different physical dimensions, positioned on the leadframe. Upstanding positioning tabs are integrally formed on the sides, on the ends, or on both the sides and on the ends of corresponding alignment fingers that abut the confronting surfaces of the one or more electronic circuit device components positioned on the leadframe to selectively align the components. The upstanding positioning tabs may be so spaced apart on corresponding alignment fingers as to provide a supporting surface for partially supporting the confronting bottom surface of the electronic circuit device component positioned on the leadframe.

Abstract: A high power semiconductor package which includes a substantially continuous mounting surface for efficient thermal mounting to a heat sink and which can be electrically isolated or non-isolated. The package includes a metal header having a cylindrical section and a peripheral mounting flange. The cylindrical section has an annular portion adjacent to the mounting flange into which is press fitted a thermally conductive disk having an outer surface which is substantially coplanar with the mounting surface of the flange. One or more semiconductor devices are mounted within the cylindrical section in thermal communication with the conductive disk, and are electrically connected to leads which outwardly extend from the top of the header. An encapsulant can be provided within the header to enclose the semiconductor devices, and an electrically insulating cap can be secured to the cylindrical section and through which the leads extend.

Abstract: A high power semiconductor package having an extruded metal housing which includes electrical terminals integrally formed with the housing and which, after assembly and encapsulation of the package, are electrically isolated by selected removal of intermediate sections of a housing wall.