Patents by Inventor Hermes T. Apale
Hermes T. Apale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230307335Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.Type: ApplicationFiled: May 22, 2023Publication date: September 28, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: Hermes T. Apale, KyuWon Lee, Mark Sackett
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Patent number: 11764136Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.Type: GrantFiled: August 19, 2021Date of Patent: September 19, 2023Assignee: STATS ChipPAC Pte. Ltd.Inventors: Hermes T. Apale, KyuWon Lee, Mark Sackett
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Publication number: 20230059429Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.Type: ApplicationFiled: August 19, 2021Publication date: February 23, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: Hermes T. Apale, KyuWon Lee, Mark Sackett
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Patent number: 6960493Abstract: An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area.Type: GrantFiled: August 9, 2004Date of Patent: November 1, 2005Assignee: ST Assembly Test Services, LTDInventors: Virgil C. Ararao, Hermes T. Apale, Il Kwon Shim
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Patent number: 6875634Abstract: A method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof as part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.Type: GrantFiled: March 18, 2004Date of Patent: April 5, 2005Assignee: ST Assembly Test Services PTE LTDInventors: Il Kwon Shim, Hermes T. Apale, Weddie Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo
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Patent number: 6825067Abstract: A new method is provided for the creation of a mold cap. The mold cap anchoring feature of the invention is designed and incorporated from the start of the design and fabrication of the substrate. Various design options of the mold anchor of the invention can be implemented. The mold anchor of the invention allows the mold compound to flow underneath the substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities surrounding and being accessible from the mold anchor of the invention where the mold compound will remain in place and harden. After hardening, the mold compound surrounding the mold anchor will support the anchored area.Type: GrantFiled: December 10, 2002Date of Patent: November 30, 2004Assignee: St Assembly Test Services PTE LTDInventors: Virgil C. Ararao, Hermes T. Apale, Il Kwon Shim
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Patent number: 6818981Abstract: A PBGA package is provided. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A solder bump is further provided over the surface of the copper pad. Thermally conductive solder is deposited over the opening of the heat spreader and over the copper pad. If the heat spreader stand-off is aligned with contact pads, thermally conductive epoxy is deposited over the contact pads.Type: GrantFiled: January 26, 2004Date of Patent: November 16, 2004Assignee: St Assembly Test Services PTE LTDInventors: Il Kwon Shim, Hermes T. Apale, Gerry Balanon
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Publication number: 20040180525Abstract: A new method and assembly is provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package, these anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.Type: ApplicationFiled: March 18, 2004Publication date: September 16, 2004Applicant: ST Assembly Test Services Ltd.Inventors: Il Kwon Shim, Hermes T. Apale, Weddie Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo
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Publication number: 20040155338Abstract: A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate.Type: ApplicationFiled: January 26, 2004Publication date: August 12, 2004Inventors: Il Kwon Shim, Hermes T. Apale, Gerry Balanon
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Publication number: 20040108601Abstract: A new method is provided for the creation of a mold cap. The mold cap anchoring feature of the invention is designed and incorporated from the start of the design and fabrication of the substrate. Various design options of the mold anchor of the invention can be implemented. The mold anchor of the invention allows the mold compound to flow underneath the substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities surrounding and being accessible from the mold anchor of the invention where the mold compound will remain in place and harden. After hardening, the mold compound surrounding the mold anchor will support the anchored area.Type: ApplicationFiled: December 10, 2002Publication date: June 10, 2004Applicant: St Assembly Test Services Pte LtdInventors: Virgil C. Ararao, Hermes T. Apale, Il Kwon Shim
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Patent number: 6737298Abstract: A new method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.Type: GrantFiled: January 23, 2002Date of Patent: May 18, 2004Assignee: St Assembly Test Services LtdInventors: Il Kwon Shim, Hermes T. Apale, Weddle Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo
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Patent number: 6706563Abstract: A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate.Type: GrantFiled: April 10, 2002Date of Patent: March 16, 2004Assignee: ST Assembly Test Services PTE LTDInventors: Il Kwon Shim, Hermes T. Apale, Gerry Balanon
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Publication number: 20030197195Abstract: A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate.Type: ApplicationFiled: April 10, 2002Publication date: October 23, 2003Applicant: St Assembly Test Services Pte LtdInventors: Il Kwon Shim, Hermes T. Apale, Gerry Balanon
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Publication number: 20030138994Abstract: A new method and assembly is provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package, these anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.Type: ApplicationFiled: January 23, 2002Publication date: July 24, 2003Applicant: St Assembly Test Services Pte LtdInventors: Il Kwon Shim, Hermes T. Apale, Weddle Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo