Patents by Inventor Herve Sik

Herve Sik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10904460
    Abstract: An imaging instrument for controlling a target designation makes it possible to visualise a target designation spot (SP) within a scene (SC), while using only one image sensor. To do this, a filter is arranged on the image sensor, in a restricted area (ZC) of same. The filter makes it possible to increase a contrast and a signal-to-noise ratio for an image of the target designation spot, when a misalignment (DP) is produced in order to bring the image of the target designation spot into the area of the filter.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: January 26, 2021
    Assignee: Safran Electronics & Defense
    Inventors: Patrick Robert, Hervé Sik
  • Publication number: 20200236304
    Abstract: An imaging instrument for controlling a target designation makes it possible to visualise a target designation spot (SP) within a scene (SC), while using only one image sensor. To do this, a filter is arranged on the image sensor, in a restricted area (ZC) of same. The filter makes it possible to increase a contrast and a signal-to-noise ratio for an image of the target designation spot, when a misalignment (DP) is produced in order to bring the image of the target designation spot into the area of the filter.
    Type: Application
    Filed: July 11, 2018
    Publication date: July 23, 2020
    Applicant: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Patrick ROBERT, Hervé SIK
  • Patent number: 9972727
    Abstract: The present invention relates to a method for manufacturing a bispectral matrix detector comprising the following steps: providing a monotype matrix detector; depositing, on the sensitive surface (3) of the monotype matrix detector, a dual-band interference filter (5) allowing the radiation in the first and second frequency bands to pass therethrough; depositing a first interference filter (4a) vertically in line with photosites (31a) intended for sensing in the first frequency band; depositing a second interference filter (4b) vertically in line with photosites (31b) intended for sensing in the second frequency band, one of the first (4a) and second (4b) interference filters being a low-pass filter cutting the second frequency band, and the other a high-pass filter cutting the first frequency band.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: May 15, 2018
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Herve Sik, Joel Fleury, Patrice Laprat
  • Publication number: 20170125614
    Abstract: The present invention relates to a method for manufacturing a bispectral matrix detector comprising the following steps: providing a monotype matrix detector; depositing, on the sensitive surface (3) of the monotype matrix detector, a dual-band interference filter (5) allowing the radiation in the first and second frequency bands to pass therethrough; depositing a first interference filter (4a) vertically in line with photosites (31a) intended for sensing in the first frequency band; depositing a second interference filter (4b) vertically in line with photosites (31b) intended for sensing in the second frequency band, one of the first (4a) and second (4b) interference filters being a low-pass filter cutting the second frequency band, and the other a high-pass filter cutting the first frequency band.
    Type: Application
    Filed: June 12, 2015
    Publication date: May 4, 2017
    Inventors: Herve SIK, Joel FLEURY, Patrice LAPRAT
  • Publication number: 20110233609
    Abstract: The invention relates to a method for producing an infrared radiation sensor, said sensor comprising an infrared photodiode array formed in a first material and a reading circuit formed in a second material, said method comprising the steps of: sticking, through molecular adhesion, a first material side surface onto an optically transparent crystalline material side surface having infrared radiation and a coefficient of thermal expansion similar to that of the second material, give or take 20%; thinning the body of the first material side surface so that the latter is less that 25 ?m; producing infrared-sensitive photodiodes onto the thus-thinned first material side surface; depositing contact ball bearings onto the infrared photodiodes; and mounting the reading circuit onto the first material side surface through flip chip technology.
    Type: Application
    Filed: November 27, 2009
    Publication date: September 29, 2011
    Applicant: Sagem Defense Securite
    Inventors: Arnaud Cordat, Herve Sik, Stéphane Demiguel