Abstract: Methods and apparatuses for manufacturing a composite part are provided. One method includes cutting a material into a plurality of pieces and marking each of the plurality of pieces of material with a unique indicium. This method also includes placing one of the pieces of material in a mold cavity, detecting a signal from the indicium on the piece of material, and verifying that the piece of material was placed in the mold cavity in the correct location based on the signal from the indicium. The placing, detecting, and verifying steps are performed for each of the plurality of pieces of material. The pieces of material are then molded together to form the composite part.

Abstract: The invention relates to an electronic circuit including a sub-module assembly (2) connected to the rest of the circuit, the sub-module assembly including a secret sub-module (4) for performing a function, scan chains; a built-in self test circuit including a pattern generator (5) to apply input signals to the scan chains, and a signature register (6) to check output signals from the scan chains. In order to keep the sub-module secret, the scan chains are not connected to the rest of the circuit.

Abstract: The invention relates to an electronic circuit including a sub-module assembly (2) connected to the rest of the circuit, the sub-module assembly including:—a secret sub-module (4) for performing a function, and comprising scan chains,—a built-in self test circuit including a pattern generator (5) to apply input signals to the scan chains, and a signature register (6) to check output signals from the scan chains. In order to keep the sub-module secret, the scan chains are not connected to the rest of the circuit.