Patents by Inventor Hesham M. Enshasy

Hesham M. Enshasy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11879835
    Abstract: A method for detecting for a presence of a toxic element in a sample includes emitting UV light from an UV-VIS LED illuminator onto a sample as incident light. Capturing a portion of the incident light being reflected from the sample using a frinGOe interferometer and converting the reflected light to an interferogram spectrum. Collecting the interferogram spectrum using a camera. Retrieving the interferogram spectrum from the camera and transforming it to absorption wavelength spectrum using Fourier transformation via a microcontroller. Comparing and normalizing the absorption strength peak wavelength using the microcontroller. Comparing the normalized absorption strength peak wavelength spectrum with stored allowable toxic chemical absorption strength peak wavelength thresholds. Sending a message indicating that the sample is safe or not safe to use to a LCD screen and a speaker based on the comparison between the normalized absorption strength peak wavelength spectrum and the stored allowable thresholds.
    Type: Grant
    Filed: August 11, 2023
    Date of Patent: January 23, 2024
    Assignee: KING FAISAL UNIVERSITY
    Inventors: Kaouther Chebbi, Hesham M. Enshasy
  • Publication number: 20030080832
    Abstract: The present invention provides a surface acoustic wave (SAW) device. The SAW device provides a SAW die made from a piezoelectric material and has an active region. The active region has metallized and interdigitated electrodes attached to it. The interdigitated electrodes are attached to metallized I/O pads on the SAW die. The SAW device also provides a substrate having top substrate pads on a first surface thereof and bottom substrate pads on an opposing surface thereof and vias filled with a conductive material to electrically connect the top substrate pads to the bottom substrate pads. Also provided are means for attaching the SAW die to the substrate, the means having a size and shape such that it surrounds the active region of the SAW die and hermetically seals the active region of the SAW, and means for electrically connecting each top ubstrate pad to a corresponding I/O pad.
    Type: Application
    Filed: May 21, 2002
    Publication date: May 1, 2003
    Inventor: Hesham M. Enshasy