Abstract: A charge coupled device package with a glass lid is provided. The package includes a charge coupled device having a plurality of conductive bumps on its bond pads, an insulating tape bonded to the inside of the conductive bumps on the charge coupled device, a plurality of metal lines each connected at an end thereof to each of the conductive bumps and at the outer end thereof to a signal terminal of a circuit board and adapted for transmitting an electric signal of the charge coupled device to the outside, and a glass lid provided with the plurality of metal lines on opposite sides of its lower surface and bonded to an upper surface of the insulating tape on the charge coupled device. The sealing part of a sealing resin is provided between a lower periphery of the glass lid and an upper surface of the charge coupled device.

Abstract: A Multi-chip semiconductor package having the thinnest structure. The package includes a chip set including a first bare chip and a second bare chip which are connected to each other by solder interposed therebetween and a plurality of TAB tapes each having an inner lead and an outer lead, the first bare chip and the second bare chip being provided with a plurality of solder bumps at opposite sides of surfaces thereof facing to each other, each of the inner leads being bonded between each corresponding the solder bump of the first bare chip and each corresponding the solder bump of the second bare chip, and a lead frame bonded to the outer leads of the TAB tapes. The chip set of the multi-chip semiconductor package may be connected to other chip set so that the package has four bare chips. Therefore, the thinnest multi-chip semiconductor package can be achieved and an integration of the package is improved.