Patents by Inventor Hi Gon Lee

Hi Gon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9285125
    Abstract: A prefabricated heat-insulation panel has two hot water flow paths installed separately inside a panel, with primary and secondary connection parts provided in the panel and connected to a boiler or allowing hot water to circulate to adjacent panels. A polybutene layer with rosin as an activator is formed on the inner surface of the hot water supply pipe made of thermoplastic elastomer, and reduces the diameter and the length of the hot water supply pipes installed in the panel and the panel thickness and minimizes the boiler load.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: March 15, 2016
    Inventors: Hi Gon Lee, Ha Rim Kim
  • Publication number: 20110168794
    Abstract: The present invention relates to a prefabricated heat-insulation panel with two hot water flow paths. The prefabricated heat-insulation panel comprises a panel; primary and secondary hot water supply pipes which are installed separately inside the panel to provide at least two hot water flow paths; and primary and secondary connection parts which are provided in the panel and connected to a boiler or primary and secondary hot water supply pipes installed in another panel to allow hot water to circulate in the primary and secondary hot water supply pipes.
    Type: Application
    Filed: September 21, 2009
    Publication date: July 14, 2011
    Inventors: Hi Gon Lee, Ha Rim Kim