Abstract: A clock signal generation device includes a variable voltage providing circuit, a fixed voltage providing circuit and a clock signal generating circuit. The variable voltage providing circuit provides a variable reference voltage based on a selection signal, a reference voltage and a temperature coefficient. The variable reference voltage is varied according to temperature. The fixed voltage providing circuit provides a fixed reference voltage that is determined according to the selection signal. The fixed reference voltage is a constant voltage. The clock signal generating circuit provides a clock signal based on the fixed reference voltage and the variable reference voltage. The performance of the clock signal generation device may be increased by providing the clock signal based on the variable reference voltage that is varied according to the temperature and based on the fixed reference voltage.

Abstract: A clock signal generation device includes a variable voltage providing circuit, a fixed voltage providing circuit and a clock signal generating circuit. The variable voltage providing circuit provides a variable reference voltage based on a selection signal, a reference voltage and a temperature coefficient. The variable reference voltage is varied according to temperature. The fixed voltage providing circuit provides a fixed reference voltage that is determined according to the selection signal. The fixed reference voltage is a constant voltage. The clock signal generating circuit provides a clock signal based on the fixed reference voltage and the variable reference voltage. The performance of the clock signal generation device may be increased by providing the clock signal based on the variable reference voltage that is varied according to the temperature and based on the fixed reference voltage.

Abstract: A high voltage generating circuit may include a pulse signal generator, a counter, a plurality of transmitters, and/or a plurality of pumpers. The pulse signal generator may be configured to be enabled in response to a refresh command signal to output a pulse signal. The counter may be configured to count the pulse signal and sequentially output a plurality of selection signals. The plurality of transmitters may be configured to be sequentially enabled in response to individual selection signals of the plurality of selection signals to transmit the pulse signal. The plurality of pumpers may correspond to the plurality of transmitters. Each of the plurality of pumpers may be configured to collectively generate a high voltage based on the transmitted pulse signal from a corresponding transmitter of the plurality of transmitters.

Abstract: A semiconductor chip package and a semiconductor chip fabricating method are provided. A semiconductor chip package comprises at least two semiconductor chips having a stacked configuration, the semiconductor chips at least one of: sharing DC signals of DC generating circuits provided by one of the semiconductor chips; and sharing a DLL clock signal of a DLL circuit provided by the semiconductor chip having the DC generating circuits or provided by another semiconductor chip. Power consumption can be reduced, and sharing a DLL clock is valid. In addition, a stabilized DC supply can be guaranteed and an increase for level trimming range and productivity can be improved.

Abstract: A high voltage generating circuit may include a pulse signal generator, a counter, a plurality of transmitters, and/or a plurality of pumpers. The pulse signal generator may be configured to be enabled in response to a refresh command signal to output a pulse signal. The counter may be configured to count the pulse signal and sequentially output a plurality of selection signals. The plurality of transmitters may be configured to be sequentially enabled in response to individual selection signals of the plurality of selection signals to transmit the pulse signal. The plurality of pumpers may correspond to the plurality of transmitters. Each of the plurality of pumpers may be configured to collectively generate a high voltage based on the transmitted pulse signal from a corresponding transmitter of the plurality of transmitters.

Abstract: In an embodiment, a semiconductor memory device includes a clock latency that can be controlled responsive to whether or not an output order of burst data is reordered. The semiconductor memory device may comprise a control unit and a latency control unit. The control unit may generate a latency control signal having a logic level that varies depending on whether or not an output order of burst data is reordered. The latency control unit may control a latency value in response to the latency control signal. The semiconductor memory device and the method of controlling the latency value responsive to a reordering of the burst data allow for an optimally fast memory access time.

Abstract: A voltage boosting circuit includes a first voltage boosting circuit configured to receive an external power supply voltage, and pump the external power supply voltage to a second boosting voltage higher than the external supply voltage in a single pumping stage, and a second voltage boosting circuit configured to receive the second boosting voltage and pump the second boosting voltage to a first boosting voltage higher than the second boosting voltage in two pumping stages.

Abstract: A high voltage generating circuit may include a pulse signal generator, a counter, a plurality of transmitters, and/or a plurality of pumpers. The pulse signal generator may be configured to be enabled in response to a refresh command signal to output a pulse signal. The counter may be configured to count the pulse signal and sequentially output a plurality of selection signals. The plurality of transmitters may be configured to be sequentially enabled in response to individual selection signals of the plurality of selection signals to transmit the pulse signal. The plurality of pumpers may correspond to the plurality of transmitters. Each of the plurality of pumpers may be configured to collectively generate a high voltage based on the transmitted pulse signal from a corresponding transmitter of the plurality of transmitters.

Abstract: A test circuit and method for use in a semiconductor memory device is provided. The test method for use in a semiconductor memory device including a plurality of memory blocks may include sequentially enabling a plurality of word lines by applying a stress to the wordlines and performing a test operation, in response to sequentially applied test addresses, each of the word lines being sequentially selected from the plurality of memory blocks and enabled.

Abstract: A word line driver for use in a semiconductor memory device includes a boosted voltage generator, a sub word line driver and a main word line driver. The boosted voltage generator generates a boosted voltage by receiving an internal power supply voltage and pumping electric charge. The sub word line driver receives the internal power supply voltage and activates a boosted voltage control signal after supplying the internal power supply voltage to a boost node in a command operating mode. The main word line driver enables a word line by supplying the boosted voltage to the boost node in response to the boosted voltage control signal in a normal operating mode, and enables the word line with the boosted voltage after boosting the word line to the internal power supply voltage by changing the boost node from the internal power supply voltage to the boosted voltage in the command operating mode.

Abstract: A semiconductor memory device and method thereof are provided. The example semiconductor memory device may include a plurality of comparators receiving output data signals from each of a plurality of sub-array blocks, comparing the output data signals from each of the plurality of sub-array blocks and outputting a plurality of comparison result signals and a test circuit receiving the plurality of comparison result signals from the plurality of comparators, respectively, the test circuit configured to selectively output one of a given one of the plurality of comparison result signals on a given data input/output pad and a given signal obtained by performing a logical operation on at least two of the plurality of comparison result signals on the given data input/output pad in response to a select signal.

Abstract: A voltage boosting circuit includes a first voltage boosting circuit configured to receive an external power supply voltage, and pump the external power supply voltage to a second boosting voltage higher than the external supply voltage in a single pumping stage, and a second voltage boosting circuit configured to receive the second boosting voltage and pump the second boosting voltage to a first boosting voltage higher than the second boosting voltage in two pumping stages.

Abstract: A semiconductor memory device may include a memory cell array and at least one fuse box. The memory cell array may include a plurality of sub-array blocks, and a fuse box may include a plurality of fuse groups, each group corresponding to a sub-array block. Each fuse group may have a plurality of fuses, wherein the fuses are intermittently arranged such that fuses of the same fuse group are not adjacent to each other. Each fuse group may further include a master fuse and a fuse mode determining circuit for determining a fuse-on-mode or a fuse-off-mode for the repair operation of a sub-array block. Consequently, during a repair operation using a conventional laser having a relatively large beam spot, the designated fuse of one fuse group as well as adjacent fuses of a different group may be cut without hindering the repair operation of the sub-array block.

Abstract: The present invention provides a semiconductor memory device comprising a memory cell array including a plurality of memory regions, an address decoding portion for decoding an address applied from an external portion for simultaneously selecting all of the plurality of memory regions during a test read operation, a data IO control portion for receiving test pattern data and writing the test pattern data to each of the plurality of memory regions during a test write operation, and reading the test pattern data from one of the plurality of memory regions and outputting the test pattern data during the test read operation, a data IO portion for receiving the test pattern data from the external portion and applying the test pattern data to the data IO control portion during the test write operation, and receiving the test pattern data output from the data IO control portion and conditionally outputting the test pattern data as test status data to the external portion in response to an output control signal durin

Abstract: A word line driver for use in a semiconductor memory device includes a boosted voltage generator, a sub word line driver and a main word line driver. The boosted voltage generator generates a boosted voltage by receiving an internal power supply voltage and pumping electric charge. The sub word line driver receives the internal power supply voltage and activates a boosted voltage control signal after supplying the internal power supply voltage to a boost node in a command operating mode. The main word line driver enables a word line by supplying the boosted voltage to the boost node in response to the boosted voltage control signal in a normal operating mode, and enables the word line with the boosted voltage after boosting the word line to the internal power supply voltage by changing the boost node from the internal power supply voltage to the boosted voltage in the command operating mode.

Abstract: An integrated circuit device includes a test circuit and at least one flag generator circuit. The test circuit is configured to generate first and second sets of test results in parallel in response to a memory test operation. The first and second sets of test results respectively correspond to first and second memory banks. The test circuit is further configured to merge respective ones of the first set of test results with respective ones of the second set of test results to provide a set of merged test results to respective ones of a set of output terminals of the integrated circuit device. The at least one flag generator circuit is configured to generate a first flag signal that indicates a presence of at least one memory test error in the first set of test results, and a second flag signal that indicates a presence of at least one memory test error in the second set of test results.

Abstract: A semiconductor device for generating a test voltage for a wafer burn-in test and method thereof is disclosed. To generate the test voltage for a wafer burn-in test, a control signal may be generated in response to a supply voltage from an external wafer burn-in test device. A supplementary voltage may be generated in response to the control signal by using an internal voltage driving circuit. The test voltage may be generated by combining the supply voltage and the supplementary voltage.

Abstract: A delay-locked loop (DLL) circuit includes a standby signal generating circuit, a front stage circuit, and a back stage circuit. The standby signal generating circuit generates a first standby signal and a second standby signal in response to an active signal, a crock enable signal, a first column address strobe (CAS) latency signal, and a second CAS latency signal. The front stage circuit compares the phase of an external clock signal and the phase of a feedback signal and delays the external clock signal based on the phase difference between the external clock signal and the feedback signal to generate a first clock signal. The back stage circuit executes interpolation and duty-cycle correction on the first clock signal.

Abstract: A test circuit and method for use in a semiconductor memory device is provided. The test method for use in a semiconductor memory device including a plurality of memory blocks may include sequentially enabling a plurality of word lines by applying a stress to the wordlines and performing a test operation, in response to sequentially applied test addresses, each of the word lines being sequentially selected from the plurality of memory blocks and enabled.

Abstract: A semiconductor memory device and a read data skew control method thereof, in which a point of time when read data is output can he controlled using pad bonding in stack packages. The semiconductor memory device includes a bonding option pad and a delay control circuit that controls the point of time when data is output from an output buffer depending on logic states of a signal applied to the bonding option pad. Thus, when using the semiconductor memory device in stack packages, the read data skew generated as a result of a load on a bonding wire can be compensated by connecting the bonding option pad to ground voltage or a supply voltage.