Patents by Inventor Hideaki Abe
Hideaki Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11920609Abstract: An axial fan rotates around a rotating shaft. The axial fan includes a hub, and a plurality of blades extending in a radial direction from the hub. Each blade includes a leading edge, a trailing edge including a depression, and a reinforcing protrusion located at least forwardmost and having a wall thickness thicker than a surrounding portion. As viewed along a rotating shaft direction, when a first virtual line and a second virtual line perpendicular to the radial direction are drawn, the reinforcing protrusion extends radially inside of the first virtual line and extends radially outside of the second virtual line, the first virtual line and the second virtual line respectively pass through a rearmost first endpoint in the rotation direction on a radially inside of a rear end that substantially overlaps the depression, and a rearmost second endpoint on a radially outside of the rear end.Type: GrantFiled: February 7, 2022Date of Patent: March 5, 2024Assignee: Daikin Industries, Ltd.Inventors: Hideaki Konishi, Naomi Abe
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Patent number: 11910528Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.Type: GrantFiled: January 18, 2022Date of Patent: February 20, 2024Assignee: Japan Display Inc.Inventor: Hideaki Abe
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Publication number: 20230380063Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.Type: ApplicationFiled: August 3, 2023Publication date: November 23, 2023Inventors: Youhei IWAI, Hideaki ABE
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Patent number: 11815955Abstract: According to one embodiment, a display device including a display panel including a mount side curved to correspond to the curved shape of a display surface, a flat circuit board, and a first flexible wiring board mounted on the display panel in a first end side while being connected to the circuit board in a second end side, wherein the first flexible wiring board includes a first base member including a first surface and a second surface, a first line positioned in the first surface side, and a first protection layer covering the first line, and includes a first bending part to be bent between a first bending boundary and a second bending boundary, the second bending boundary is inclined with respect to the first bending boundary, and the first base member includes a first groove positioned in the first bending part and formed in the second surface.Type: GrantFiled: October 15, 2021Date of Patent: November 14, 2023Assignee: Japan Display Inc.Inventors: Hideaki Abe, Kazuyuki Yamada, Keisuke Asada, Kota Uogishi
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Publication number: 20230350470Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.Type: ApplicationFiled: July 5, 2023Publication date: November 2, 2023Applicant: Japan Display Inc.Inventors: Keisuke ASADA, Hideaki ABE, Kota UOGISHI, Kazuyuki YAMADA
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Patent number: 11765829Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.Type: GrantFiled: July 2, 2021Date of Patent: September 19, 2023Assignee: Japan Display Inc.Inventors: Youhei Iwai, Hideaki Abe
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Patent number: 11740668Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.Type: GrantFiled: April 26, 2022Date of Patent: August 29, 2023Assignee: Japan Display Inc.Inventors: Keisuke Asada, Hideaki Abe, Kota Uogishi, Kazuyuki Yamada
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Patent number: 11668984Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.Type: GrantFiled: April 7, 2022Date of Patent: June 6, 2023Assignee: Japan Display Inc.Inventors: Hideaki Abe, Yasuhito Aruga, Hiroyuki Onodera, Hiroki Kato, Yasushi Nakano, Hitoshi Kawaguchi, Keisuke Asada
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Patent number: 11665822Abstract: An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.Type: GrantFiled: January 4, 2022Date of Patent: May 30, 2023Assignee: Japan Display Inc.Inventors: Youhei Iwai, Hideaki Abe
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Patent number: 11497232Abstract: [Problem to be Solved] The present invention provides a method for producing fried noodles having a reduced sodium content and excellent noodle making properties, texture, and flavor. [Solution] Fresh noodles having excellent noodle making properties, texture, and flavor can be produced not by adding salt but by adding 1 to 3% by weight of potassium lactate relative to a main raw material powder such as wheat flour. Further, fried noodles having a reduced sodium content and excellent texture and flavor can be produced by steaming the fresh noodles and fry drying.Type: GrantFiled: August 29, 2017Date of Patent: November 15, 2022Assignee: NISSIN FOODS HOLDINGS CO., LTD.Inventors: Hideaki Abe, Toshio Yoshinuma
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Patent number: 11497231Abstract: The present invention provides a method for producing non-fried noodles having a reduced sodium content and excellent noodle making properties, texture, and flavor. Fresh noodles having excellent noodle making properties, texture, and flavor can be produced by adding 1 to 3% by weight of potassium lactate relative to a main raw material powder such as wheat flour even without adding salt. Further, non-fried noodles having a reduced sodium content and excellent texture and flavor can be produced by steaming the fresh noodles and then drying the noodles by hot air. Moreover, after drying, the non-fried noodles dried by hot air to have a moisture of 7 to 14% by weight is further subjected to a heating process with high-temperature hot air, a gas mixture of high-temperature hot air and water vapor, or superheated steam at 120 to 200° C. until the moisture of the non-fried noodles is reduced to 3 to 6% by weight, which can consequently reduce a harsh taste derived from potassium lactate.Type: GrantFiled: August 29, 2017Date of Patent: November 15, 2022Assignee: NISSIN FOODS HOLDINGS CO., LTD.Inventors: Hideaki Abe, Mitsuru Tanaka
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Publication number: 20220262665Abstract: An element transfer device includes an elastic sheet including a through hole and a pickup portion including a shaft portion, a first head portion at a first end of the shaft portion, and a second head portion at a second end of the shaft portion. The first head portion includes a pickup surface for adhering an element. The shaft portion is inserted into the through hole. The first head portion and the second head portion sandwich the elastic sheet. An outer diameter of the first head portion and an outer diameter of the second head portion are larger than an opening diameter of the through hole.Type: ApplicationFiled: February 10, 2022Publication date: August 18, 2022Applicant: Japan Display Inc.Inventor: Hideaki ABE
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Publication number: 20220253111Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.Type: ApplicationFiled: April 26, 2022Publication date: August 11, 2022Applicant: Japan Display Inc.Inventors: Keisuke ASADA, Hideaki ABE, Kota UOGISHI, Kazuyuki YAMADA
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Patent number: 11410976Abstract: A display device includes a substrate, a first pixel region including a first light emitting element group over the substrate, a second pixel region including a second light emitting element group over the substrate and adjacent to the first light emitting element group, and a partition wall between the first light emitting element group and the second light emitting element. A height of the partition wall is larger than heights of a plurality of emitting elements included in each of the first light emitting element group and the second light emitting element group.Type: GrantFiled: August 6, 2020Date of Patent: August 9, 2022Assignee: Japan Display Inc.Inventor: Hideaki Abe
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Publication number: 20220229324Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.Type: ApplicationFiled: April 7, 2022Publication date: July 21, 2022Applicant: Japan Display Inc.Inventors: Hideaki ABE, Yasuhito ARUGA, Hiroyuki ONODERA, Hiroki KATO, Yasushi NAKANO, Hitoshi KAWAGUCHI, Keisuke ASADA
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Publication number: 20220209081Abstract: An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.Type: ApplicationFiled: March 17, 2022Publication date: June 30, 2022Applicant: Japan Display Inc.Inventors: Hideaki ABE, Kazuyuki YAMADA, Keisuke ASADA, Kota UOGISHI, Kenichi TAKEMASA, Daiki ISONO
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Patent number: 11342300Abstract: The purpose of the invention is to counter measure a disconnection between the driver IC and the terminal when the terminal area of the electronic device is curved. One of the structures is as follows. An electronic device comprising: a driver IC installed in a terminal area, the terminal area being curved, wherein the driver IC has a circuit and plural bumps, the driver IC has a tapered portion formed on an opposite surface from a surface that the plural bumps are formed, the tapered portion overlaps with an outer most bump of the plural bumps.Type: GrantFiled: August 25, 2020Date of Patent: May 24, 2022Assignee: JAPAN DISPLAY INC.Inventors: Youhei Iwai, Hideaki Abe
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Patent number: 11340667Abstract: An electronic device includes a substrate including an input terminal arranged a plurality of terminals, a wiring substrate having a flexibility connected to the input terminal part. The wiring substrate includes a base film, a cover film covering the base film, a plurality of wirings between the base film and the cover film, a connection part, and a first region bent in a first the one side and a second region adjacent to the first region. The second region of the connection part includes a first connection terminal group connected to the plurality of wirings, a second connection terminal group, and a dummy terminal group between the first connection terminal group. The first region is provided with an opening through the base film and the cover film, the second region overlaps the input terminal part, and the dummy terminal group and the opening are adjacent to each other.Type: GrantFiled: June 12, 2020Date of Patent: May 24, 2022Assignee: Japan Display Inc.Inventors: Keisuke Asada, Hideaki Abe, Kota Uogishi, Kazuyuki Yamada
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Patent number: 11327373Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals is the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.Type: GrantFiled: January 6, 2021Date of Patent: May 10, 2022Assignee: Japan Display Inc.Inventors: Hideaki Abe, Yasuhito Aruga, Hiroyuki Onodera, Hiroki Kato, Yasushi Nakano, Hitoshi Kawaguchi, Keisuke Asada
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Publication number: 20220141957Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.Type: ApplicationFiled: January 18, 2022Publication date: May 5, 2022Inventor: Hideaki ABE