Patents by Inventor Hideaki Kanazawa

Hideaki Kanazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240149593
    Abstract: An image forming apparatus includes a housing, a feeding tray inserted into and pulled out from the housing, an image forming unit, and first and second guide members. The feeding tray includes a first accommodation part in which a roll body having a configuration where a sheet-shaped medium is rolled in a roll shape is accommodated and a second accommodation part in which stacked sheet-shaped media are accommodated. The first guide member guides a sheet-shaped medium to a conveying path. The second guide member guides a roll medium unrolled from the roll body to the conveying path. The second guide member is movable between a guide position for guiding the roll medium to the conveying path, and a retreat position further distant from the first guide member than the guide position and where the second guide member does not interfere with a sheet-shaped medium accommodated in the second accommodation part.
    Type: Application
    Filed: September 18, 2023
    Publication date: May 9, 2024
    Inventors: Masatomo Yamaguchi, Satoshi Miyase, Yuya Tatematsu, Hideaki Yoshimune, Gakuro Kanazawa
  • Patent number: 11932506
    Abstract: The present invention provides a sheet stacking device, a counter-ejector, and a carton former and is provided with: a hopper unit that stacks cardboard boxes; feed rollers that feed a cardboard box to the hopper unit; a first blower device that blows air from above the hopper unit toward the cardboard box fed by the feed rollers; and a second blower device that blows air between the cardboard box stacked in the hopper unit and the cardboard box fed by the feed roller.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: March 19, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD.
    Inventors: Hiroyuki Kanazawa, Yoshitomo Noda, Tomohiro Akaki, Koshi Tanimoto, Hideaki Nagai, Makoto Shimohatsubo
  • Publication number: 20220062573
    Abstract: A speech valve to be connected to a respiration opening of a tracheostomy tube includes: a passage portion communicating with the respiration opening; a balloon disposed within the passage portion, and configured to deform from a shrink state, in which the passage portion is opened, to a bloat state, in which at least a part of the passage portion is closed so as to inhibit discharging of exhaled air through the passage portion; an automatic pump switching between supplying and stopping in accordance with an operation of an operation unit, and continuously supplying air to the balloon when supplying; and a coupling tube connecting the automatic pump and the balloon.
    Type: Application
    Filed: October 25, 2019
    Publication date: March 3, 2022
    Applicant: SENKO MEDICAL INSTRUMENT Mfg. Co., Ltd.
    Inventors: Mitsuru CHIBA, Hideaki KANAZAWA
  • Publication number: 20210170112
    Abstract: An injection instrument set includes a tubular injection instrument in which an injection liquid is contained, and a guide member disposed on a surface of an injection target of the injection liquid. The injection instrument includes an injection needle which is inserted into the injection target to inject the injection liquid into the injection target. The guide member includes a guide passage which is disposed at a predetermined angle with respect to a surface of the guide member which comes into contact with the injection target and which allows the injection needle to be inserted and guides the injection needle onto the surface of the injection target, and an anti-slip portion disposed at a portion at which the guide member comes into contact with the surface of the injection target.
    Type: Application
    Filed: July 8, 2019
    Publication date: June 10, 2021
    Inventors: Hideaki Kanazawa, Keiichi Fukuda, Jun Fujita
  • Publication number: 20180015246
    Abstract: A speaking valve which is applied to a respiration opening of a tracheostomy tube comprises: a main body portion which has a passage portion communicating with the respiration opening; a balloon which makes a motion between an opened state for opening the passage portion of the main body portion and a closed state for closing the passage portion; a syringe which is provided away from the main body portion and accepts a pushing operation to a plunger by a patient; and a coupling tube which couples the syringe and the balloon with each other and makes the balloon in a shrink state transform to a bloat state by the operation to the syringe, so that the motion from the opened state to the closed state is made.
    Type: Application
    Filed: January 29, 2016
    Publication date: January 18, 2018
    Applicant: SENKO MEDICAL INSTRUMENT Mfg. Co., Ltd.
    Inventors: Hideaki KANAZAWA, Mitsuru CHIBA, Tomoaki OKADA, Chinami ABE
  • Patent number: 8338298
    Abstract: The present inventors have found that a wafer process of VLSI (Very Large Scale Integration) has the following problem, that is, generation of foreign matters due to moisture from a wafer as a result of degassing when a barrier metal film or a first-level metal interconnect layer is formed by sputtering as a preliminary step for the formation of a tungsten plug in a pre-metal step. To overcome the problem, the present invention provides a manufacturing method of a semiconductor integrated circuit device including, in a plasma process, in-situ monitoring of moisture in a processing chamber by receiving an electromagnetic wave generated from plasma.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: December 25, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Kazuyuki Fujii, Toshihiko Minami, Hideaki Kanazawa
  • Publication number: 20100087064
    Abstract: The present inventors have found that a wafer process of VLSI (Very Large Scale Integration) has the following problem, that is, generation of foreign matters due to moisture from a wafer as a result of degassing when a barrier metal film or a first-level metal interconnect layer is formed by sputtering as a preliminary step for the formation of a tungsten plug in a pre-metal step. To overcome the problem, the present invention provides a manufacturing method of a semiconductor integrated circuit device including, in a plasma process, in-situ monitoring of moisture in a processing chamber by receiving an electromagnetic wave generated from plasma.
    Type: Application
    Filed: September 9, 2009
    Publication date: April 8, 2010
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Kazuyuki FUJII, Toshihiko MINAMI, Hideaki KANAZAWA
  • Patent number: 7132341
    Abstract: In a high-performance semiconductor integrated circuit, the standby current is reduced by preventing current leakage in a semiconductor integrated circuit device, for example, the memory cell of an SRAM. A gate electrode G is formed on semiconductor substrate 1 and n+-type semiconductor regions 17 (source/drain regions) are formed in the semiconductor substrate on both sides of this gate electrode. Within the same apparatus and under near-vacuum conditions, a depth of 2.5 nm or less is etched away from the surfaces of the source/drain regions and gate electrode, a film of Co is then formed on the source/drain regions, and thermal processing is applied to form CoSi2 layer 19a. As a result, current leakage in the memory cell can be prevented and this method can be applied to semiconductor integrated circuit devices that have low current consumption or are battery-driven.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: November 7, 2006
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.
    Inventors: Masashi Sahara, Fumiaki Endo, Masanori Kojima, Katsuhiro Uchimura, Hideaki Kanazawa, Masakazu Sugiura
  • Publication number: 20020048947
    Abstract: To provide a high-performance semiconductor integrated circuit in which the standby current is reduced by preventing current leakage in a semiconductor integrated circuit device, for example, the memory cell of an SRAM.
    Type: Application
    Filed: October 12, 2001
    Publication date: April 25, 2002
    Inventors: Masashi Sahara, Fumiaki Endo, Masanori Kojima, Katsuhiro Uchimura, Hideaki Kanazawa, Masakazu Sugiura
  • Patent number: 6353955
    Abstract: The pressure control valve is structured such that a first port is formed on one side of a casing, a second port is formed on the other side, and, in the casing, there are disposed not only a positive pressure valve which, when the pressure on the first port side becomes high, can be moved to the second port side to thereby communicate with the second port side, but also a negative pressure valve which, when the pressure on the first port side becomes low, can be moved to the first port side to thereby communicate with the second port side. In the pressure control valve, there is provided flow passage expanding means which, which the positive pressure valve has moved to the second port side beyond a given distance, allows the first port side to communicate with the second port side.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: March 12, 2002
    Assignee: Calsonic Kansei Corporation
    Inventors: Shinji Araki, Satoshi Kimura, Hideaki Kanazawa
  • Publication number: 20020017282
    Abstract: The pressure control valve is structured such that a first port is formed on one side of a casing, a second port is formed on the other side, and, in the casing, there are disposed not only a positive pressure valve which, when the pressure on the first port side becomes high, can be moved to the second port side to thereby communicate with the second port side, but also a negative pressure valve which, when the pressure on the first port side becomes low, can be moved to the first port side to thereby communicate with the second port side. In the pressure control valve, there is provided flow passage expanding means which, which the positive pressure valve has moved to the second port side beyond a given distance, allows the first port side to communicate with the second port side.
    Type: Application
    Filed: January 26, 2001
    Publication date: February 14, 2002
    Inventors: Shinji Araki, Satoshi Kimura, Hideaki Kanazawa
  • Patent number: 6196258
    Abstract: The pressure control valve is structured such that a first port is formed on one side of a casing, a second port is formed on the other side, and, in the casing, there are disposed not only a positive pressure valve which, when the pressure on the first port side becomes high, can be moved to the second port side to thereby communicate with the second port side, but also a negative pressure valve which, when the pressure on the first port side becomes low, can be moved to the first port side to thereby communicate with the second port side. In the pressure control valve, there is provided flow passage expanding means which, which the positive pressure valve has moved to the second port side beyond a given distance, allows the first port side to communicate with the second port side.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: March 6, 2001
    Assignee: Calsonic Corporation
    Inventors: Shinji Araki, Satoshi Kimura, Hideaki Kanazawa
  • Patent number: D683264
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: May 28, 2013
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Hideaki Kanazawa, Kenichi Noda, Ryosuke Matsuoka, Atsushi Goto