Abstract: In order to detect a change in the temperature of a substrate (2) and a change of the distribution of oxygen radical concentration near a surface of the substrate (2), a lamp power in each zone of a heater (3) and a pressure in a reactor (1) are measured, the measured lamp power in each zone of the heater (3) and the measured pressure in the reactor (1) are inputted to the prediction equation of process model of a monitoring device (16)to predict the thickness profile of the substrate (2), and it is decided whether an abnormality occurs in thermal processing on the substrate (2) based on the predicted thickness profile.

Abstract: In order to detect a change in the temperature of a substrate (2) and a change of the distribution of oxygen radical concentration near a surface of the substrate (2), a lamp power in each zone of a heater (3) and a pressure in a reactor (1) are measured, the measured lamp power in each zone of the heater (3) and the measured pressure in the reactor (1) are inputted to the prediction equation of process model of a monitoring device (16)to predict the thickness profile of the substrate (2), and it is decided an abnormality occurs in thermal processing on the substrate (2) based on the predicted thickness profile.

Abstract: A chemical application apparatus includes: holding section for holding a substrate, and an application nozzle which is capable of moving over the substrate held by the holding section and which supplies a chemical onto the surface of the substrate. Further, it includes: storage section for storing pattern information for forming a pattern on the substrate; position computing section for computing a relative position of the application nozzle with respect to a measurement mark provided on the substrate; and control section for forming the pattern by applying the chemical onto the substrate through the application nozzle based on the relative position and the pattern information.

Abstract: A suction portion holds an area on the rear face corresponding to an area other than an electronic device formation area formed on the surface of a substrate. Thus, the temperature inside the electronic device formation area becomes uniform at the time a chemical liquid is applied, so that a chemical film having a constant thickness can be formed. As a result, yield improvements and quality improvements can be achieved in the process of manufacturing electronic devices.