Patents by Inventor Hideaki Sakaguchi
Hideaki Sakaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8777638Abstract: A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.Type: GrantFiled: September 7, 2012Date of Patent: July 15, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hideaki Sakaguchi, Akinori Shiraishi, Mitsutoshi Higashi
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Patent number: 8759685Abstract: A wiring substrate includes a substrate body including first and second surfaces on opposite sides and a substrate side surface; a penetration electrode penetrating through the substrate body; a first wiring pattern on the first surface and including a first pad; a second wiring pattern on the second surface and including a second pad; a first insulating resin layer covering the first wiring pattern except for an area corresponding to the first pad and having a first resin side surface; a second insulating resin layer covering the second wiring pattern except for an area corresponding to the second pad and having a second resin side surface that is flush with the first resin side surface; a notch part encompassing at least apart of the substrate body and having a resin material provided therein. The substrate side surface is located more inward than the first and second resin side surfaces.Type: GrantFiled: October 30, 2009Date of Patent: June 24, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hideaki Sakaguchi, Akinori Shiraishi
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Patent number: 8671561Abstract: A substrate manufacturing apparatus 100 has a substrate delivery path 120 through which a multi-unit substrate 110 is delivered and a mask delivery path 140 through which an individual mask 130 is delivered. The substrate delivery path 120 has a pad detecting device 160 for detecting a position of a pad 112 formed on a surface of the substrate 110. The mask delivery path 140 has a mask hole detecting device 220 for detecting a position of a conductive ball inserting hole 132 of the individual mask 130. A moving position of an adsorbing head 212 is adjusted in such a manner that the position of the conductive ball inserting hole 132 is coincident with that of the pad 112 of the substrate 110 based on pad position information of the pad detecting device 160 and mask hole position information of the mask hole detecting device 220.Type: GrantFiled: May 23, 2008Date of Patent: March 18, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kiyoaki Iida, Kazuo Tanaka, Hideaki Sakaguchi, Mitsutoshi Higashi
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Patent number: 8669643Abstract: A wiring board includes a silicon substrate with a through hole communicating with first and second substrate surfaces. A capacitor includes a capacitor part mounted on an insulating film covering the substrate first surface and including a first electrode on the insulating film, a first dielectric layer on the first electrode, and a second electrode on the first dielectric layer. A multilayer structure arranged on a wall surface defining the through hole includes the insulating film on the through hole wall surface, a first metal layer on the insulating film formed from the same material as the first electrode, a second dielectric layer on the first metal layer formed from the same material as the first dielectric layer, and a second metal layer on the second dielectric layer formed from the same material as the second electrode. The multilayer structure covers a penetration electrode in the through hole.Type: GrantFiled: April 17, 2012Date of Patent: March 11, 2014Assignees: Shinko Electric Industries Co., Ltd., Taiyo Yuden Co., Ltd.Inventors: Akihito Takano, Masahiro Sunohara, Hideaki Sakaguchi, Mitsutoshi Higashi, Kenichi Ota, Yuichi Sasajima
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Patent number: 8564077Abstract: A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.Type: GrantFiled: December 21, 2009Date of Patent: October 22, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventors: Akinori Shiraishi, Masahiro Sunohara, Hideaki Sakaguchi, Yuichi Taguchi, Mitsutoshi Higashi
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Patent number: 8536714Abstract: At least one embodiment provides an interposer including: a lower wiring substrate; an upper wiring substrate disposed over the lower wiring substrate via a gap; and through-electrodes which penetrate through the upper wiring substrate and the lower wiring substrate across the gap to thereby link the upper wiring substrate and the lower wiring substrate, portions of the through-electrodes being exposed in the gap.Type: GrantFiled: June 20, 2012Date of Patent: September 17, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventor: Hideaki Sakaguchi
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Patent number: 8350390Abstract: A wiring substrate includes a wiring layer, an insulating layer formed on the wiring layer, a connection pad formed on the insulating layer, and a via conductor formed to penetrate the insulating layer, and connecting the wiring layer and the connection pad, wherein the wiring layer located under the connection pad is formed to have via receiving electrode portion whose area is smaller than an area of the connection pad, and a wiring portion separated from the via receiving electrode portion, in an area corresponding to the connection pad, and the via receiving electrode portion is connected to the connection pad via the via conductor.Type: GrantFiled: December 2, 2010Date of Patent: January 8, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kei Murayama, Masahiro Sunohara, Akinori Shiraishi, Hideaki Sakaguchi
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Publication number: 20130000955Abstract: A wiring board includes a main body, a piercing electrode piercing the main body, a first wiring pattern provided at a first surface side of the main body, the first wiring pattern having a pad being electrically connected to one end of the piercing electrode and being where an electronic component is mounted, and a second wiring pattern provided at a second surface side of the main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an external connection pad being electrically connected to another end of the piercing electrode. A recess and a resin covering the recess are provided at an external circumferential part of the wiring board to surround the first and second wiring patterns and the piercing electrode, the recess piercing the main body of a part positioned at the external circumferential part.Type: ApplicationFiled: September 12, 2012Publication date: January 3, 2013Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Hideaki SAKAGUCHI, Akinori Shiraishi
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Publication number: 20120326334Abstract: At least one embodiment provides an interposer including: a lower wiring substrate; an upper wiring substrate disposed over the lower wiring substrate via a gap; and through-electrodes which penetrate through the upper wiring substrate and the lower wiring substrate across the gap to thereby link the upper wiring substrate and the lower wiring substrate, portions of the through-electrodes being exposed in the gap.Type: ApplicationFiled: June 20, 2012Publication date: December 27, 2012Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Hideaki SAKAGUCHI
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Publication number: 20120325529Abstract: A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.Type: ApplicationFiled: September 7, 2012Publication date: December 27, 2012Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Hideaki SAKAGUCHI, Akinori SHIRAISHI, Mitsutoshi HIGASHI
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Publication number: 20120327574Abstract: At least one embodiment provides an electronic component including: connection electrodes; and flexible electrode terminals connected to the respective connection electrodes so that spaces are formed under the respective flexible electrode terminals, each flexible electrode terminal having a main body and a connection projection provided on a top surface of the main body, each flexible electrode terminal being elastically deformable when receiving pressure.Type: ApplicationFiled: June 20, 2012Publication date: December 27, 2012Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Hideaki SAKAGUCHI, Akinori Shiraishi
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Publication number: 20120319289Abstract: A semiconductor package includes a semiconductor chip having plural electrode pads, and a wiring substrate having plural electrode pads to mount the semiconductor chip on the wiring substrate, wherein the plural electrode pads of the semiconductor chip include a first electrode pad, and a second electrode pad arranged on an outer periphery side of the first electrode pad, the plural electrode pads of the wiring substrate include a third electrode pad, and a fourth electrode pad arranged on an outer periphery side of the third electrode pad, the first electrode pad and the third electrode pad are connected via a first connecting portion, and the second electrode pad and the fourth electrode pad are connected via a second connecting portion including a pin.Type: ApplicationFiled: June 11, 2012Publication date: December 20, 2012Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kenichi MORI, Hideaki SAKAGUCHI
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Patent number: 8330050Abstract: A wiring board comprises a first pad which is provided on a first surface side of a substrate and on which a first electronic component is to be mounted, and a second pad which is provided on the first surface side of the substrate and on which a second electronic component having a larger amount of heat generation in an operation than that of the first electronic component is to be mounted, a first through electrode which penetrates the substrate and has one of ends connected electrically to the first pad, a second through electrode which penetrates the substrate and has one of ends connected electrically to the second pad, a through trench penetrating the substrate in a portion positioned between a first mounting region for the first electronic component and a second mounting region for the second electronic component, and a heat intercepting member provided in the through trench.Type: GrantFiled: October 20, 2009Date of Patent: December 11, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hideaki Sakaguchi, Kei Murayama
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Patent number: 8314344Abstract: A wiring board, includes a substrate main body; a piercing electrode configured to pierce the substrate main body; a first wiring pattern provided at a first surface side of the substrate main body, the first wiring pattern having a pad, the pad being electrically connected to one end part of the piercing electrode, the pad being where an electronic component is mounted; and a second wiring pattern provided at a second surface side of the substrate main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an outside connection pad, the outside connection pad being electrically connected to another end part of the piercing electrode.Type: GrantFiled: October 5, 2009Date of Patent: November 20, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hideaki Sakaguchi, Akinori Shiraishi
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Patent number: 8309860Abstract: A method of manufacturing an electronic component built-in substrate, includes the steps of mounting a chip-like electronic component having a connection pad and a metal protection layer formed on a whole of one surface to cover the connection pad, on a wiring substrate to direct the connection pad upward; embedding the electronic component with the insulating layer; processing the insulating layer in a thickness direction to leave the insulating layer in a side of the electronic component and to expose the metal protection layer of the electronic component; and forming an upper wiring layer having an in-chip wiring part which is connected to the connection pad and contacts an upper surface of the electronic component and is constructed by an underlying metal pattern layer formed by patterning the metal protection layer and a conductive pattern layer formed thereon, and an extended wiring part which is connected to the in-chip wiring part to extend onto the insulating layer and is formed by an identical layerType: GrantFiled: October 26, 2009Date of Patent: November 13, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Masahiro Sunohara, Hideaki Sakaguchi, Hiroshi Shimizu
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Patent number: 8304862Abstract: A semiconductor package includes: a wiring board; and a semiconductor device which is formed on the wiring board; wherein the semiconductor device includes: a semiconductor chip; and a penetration electrode, one end of which is fixed on one plane of the semiconductor chip, and the other end of which penetrates the semiconductor chip and is fixed on the other plane of the semiconductor chip, the penetration electrode penetrating the semiconductor chip in such a manner that the penetration electrode is not contacted to a wall plane of the semiconductor chip by a space portion formed in the semiconductor chip; and the wiring board and the semiconductor device are electrically connected via the penetration electrode.Type: GrantFiled: December 22, 2009Date of Patent: November 6, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Yuichi Taguchi, Mitsutoshi Higashi, Akinori Shiraishi, Hideaki Sakaguchi, Masahiro Sunohara
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Patent number: 8299628Abstract: There is provided a method of mounting conductive balls on pads on a substrate. The method includes: (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container; and (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads. Step (b) is repeatedly performed.Type: GrantFiled: October 7, 2010Date of Patent: October 30, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hideaki Sakaguchi, Kiyoaki Iida, Kazuo Tanaka
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Patent number: 8299370Abstract: A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.Type: GrantFiled: February 22, 2010Date of Patent: October 30, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hideaki Sakaguchi, Akinori Shiraishi, Mitsutoshi Higashi
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Publication number: 20120261832Abstract: A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part.Type: ApplicationFiled: April 17, 2012Publication date: October 18, 2012Applicants: TAIYO YUDEN CO., LTD., SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Akihito TAKANO, Masahiro SUNOHARA, Hideaki SAKAGUCHI, Mitsutoshi HIGASHI, Kenichi OTA, Yuichi SASAJIMA
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Publication number: 20120261801Abstract: A wiring board includes a silicon substrate with a through hole communicating with first and second substrate surfaces. A capacitor includes a capacitor part mounted on an insulating film covering the substrate first surface and including a first electrode on the insulating film, a first dielectric layer on the first electrode, and a second electrode on the first dielectric layer. A multilayer structure arranged on a wall surface defining the through hole includes the insulating film on the through hole wall surface, a first metal layer on the insulating film formed from the same material as the first electrode, a second dielectric layer on the first metal layer formed from the same material as the first dielectric layer, and a second metal layer on the second dielectric layer formed from the same material as the second electrode. The multilayer structure covers a penetration electrode in the through hole.Type: ApplicationFiled: April 17, 2012Publication date: October 18, 2012Applicants: TAIYO YUDEN CO., LTD., SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Akihito TAKANO, Masahiro SUNOHARA, Hideaki SAKAGUCHI, Mitsutoshi HIGASHI, Kenichi OTA, Yuichi SASAJIMA