Patents by Inventor Hideaki Sakurai

Hideaki Sakurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131848
    Abstract: A liquid ejecting apparatus includes a liquid ejection head to eject liquid, a recovery unit, a housing, a discharge unit, a casing including the discharge unit and the housing, and a liquid receptacle. The recovery unit maintains liquid ejecting performance of the liquid ejection head. The housing houses a container that accommodates liquid received by the recovery unit. The discharge unit discharges the liquid received by the recovery unit to the container. The liquid receptacle is disposed below the discharge unit in a direction of gravity in the casing and includes a first groove extending in a first direction crossing the direction of gravity and a second groove extending in a second direction crossing the direction of gravity and the first direction.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 25, 2024
    Inventors: HIROMASA TSUTSUMI, HIDEAKI MATSUMURA, TSUYOSHI SAEKI, NORIO SAKURAI, DAIJU TAKEDA, SHOTA ASADA, TAIJI MARUYAMA
  • Publication number: 20240109333
    Abstract: A liquid storage container includes a storage portion configured to store liquid, an opening portion provided on a first surface and configured to allow injection of the liquid into the storage portion, a receiving portion consisting of the first surface and a wall disposed around the opening portion on the first surface, and a liquid holding unit configured to hold the liquid guided by a guiding portion from the liquid receiving portion to outside of the liquid receiving portion. The liquid holding unit includes a second surface different from the first surface of the liquid storage container and a flexible member.
    Type: Application
    Filed: September 27, 2023
    Publication date: April 4, 2024
    Inventors: TAIJI MARUYAMA, HIDEAKI MATSUMURA, TSUYOSHI SAEKI, NORIO SAKURAI, DAIJU TAKEDA, SHOTA ASADA, HIROMASA TSUTSUMI
  • Publication number: 20240109330
    Abstract: A printing apparatus includes a liquid tank unit, a printing head, and a supply tube unit. The liquid tank unit includes first and second liquid tanks that store liquid and are arranged in parallel to each other. The printing head ejects liquid from the first and second tanks while moving in a main scanning direction. The supply tube unit includes a first supply tube connecting the first liquid tank to the printing head and includes a second supply tube coupled in parallel to the first supply tube and connecting the second liquid tank to the printing head. The second supply tube transitions from a connected tube state in which the second and first supply tubes are coupled in parallel to a single tube state by being separated from the first supply tube, passes across the first supply tube, and is connected to a connection port of the second liquid tank.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 4, 2024
    Inventors: Dauu TAKEDA, Hideaki MATSUMURA, Tsuyoshi SAEKI, Norio SAKURAI, Hiromasa TSUTSUMI, Shota ASADA, Taiji MARUYAMA
  • Publication number: 20240096601
    Abstract: A target processing method includes: importing a target into a processing chamber; forming a film including carbon on the target using at least one of first ion including carbon and a first plasma including carbon; and removing the film by a reaction between a second plasma and the film, wherein the forming of the film and the removing of the film are alternately performed a number of times in the processing chamber without removing the target from the processing chamber.
    Type: Application
    Filed: February 3, 2023
    Publication date: March 21, 2024
    Inventors: Takeharu MOTOKAWA, Noriko SAKURAI, Hideaki SAKURAI
  • Patent number: 11931923
    Abstract: A method of manufacturing a template, has: preparing a substrate containing quartz and having a surface, the surface including a protrusion and a depression; and processing the depression. The processing of the depression includes: a first step of forming a film on the surface, the film including a first region and a second region, the first region being provided on the protrusion, and the second region being provided on a bottom of the depression and being thinner than the first region; a second step of removing the second region with the first region partly remaining to expose the bottom of the depression; and a third step of processing the exposed part of the depression using a mask made of the remainder of the first region.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: March 19, 2024
    Assignee: Kioxia Corporation
    Inventors: Takeharu Motokawa, Hideaki Sakurai, Noriko Sakurai, Ryu Komatsu
  • Patent number: 11789365
    Abstract: A method for processing a substrate includes forming a pattern on a substrate, supplying water to cover the pattern, and after the supplying the water, irradiating the pattern with light having a wavelength longer that which causes dissociation of water. A substrate processing apparatus of an embodiment includes a transfer chamber to receive a patterned substrate, a water supplying chamber to cover the pattern with water, and an irradiating chamber to irradiate a portion of the pattern with near-field light.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: October 17, 2023
    Assignee: Kioxia Corporation
    Inventors: Ryu Komatsu, Takeharu Motokawa, Noriko Sakurai, Hideaki Sakurai
  • Publication number: 20230307233
    Abstract: An example of an etching method according to the present disclosure, includes: performing a first process which includes forming a first layer containing halogen or holding the substrate in a gas atmosphere containing halogen; and performing a second process which includes removing a portion of the first layer and a portion of the substrate under the portion of the first layer by supplying the portion of the first layer with ions sourced from a solid material.
    Type: Application
    Filed: September 8, 2022
    Publication date: September 28, 2023
    Applicant: Kioxia Corporation
    Inventors: Noriko SAKURAI, Takeharu MOTOKAWA, Hideaki SAKURAI
  • Publication number: 20230296979
    Abstract: A template according to the present embodiment includes a substrate, a light transmissive film, and a plurality of convex parts. The substrate has a first surface. The light transmissive film is provided on the first surface, has a second surface on a side opposite to the substrate, and has a composition different from the composition of the substrate. The plurality of convex parts are provided on the second surface and have different heights.
    Type: Application
    Filed: June 16, 2022
    Publication date: September 21, 2023
    Applicant: Kioxia Corporation
    Inventors: Takeharu MOTOKAWA, Noriko SAKURAI, Hideaki SAKURAI
  • Publication number: 20230290619
    Abstract: According to one embodiment, a plasma treatment apparatus includes a first chamber, an electrode provided in the first chamber and having a surface, and a conveyance mechanism that places a carrier structure holding a treatment target in the first chamber such that a ferromagnetic body of the carrier structure is disposed between the surface of the electrode and the treatment target. The ferromagnetic body has a single polarity within a plane substantially parallel to the surface of the electrode.
    Type: Application
    Filed: September 2, 2022
    Publication date: September 14, 2023
    Inventors: Takeharu MOTOKAWA, Noriko Sakurai, Hideaki Sakurai
  • Publication number: 20230260780
    Abstract: According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.
    Type: Application
    Filed: April 6, 2023
    Publication date: August 17, 2023
    Inventors: Minako INUKAI, Hideaki SAKURAI, Kyo OTSUBO, Tetsuo TAKEMOTO
  • Patent number: 11682566
    Abstract: According to one embodiment, a processing apparatus for processing substrates having different base shapes includes a stage comprising a first portion having a substrate facing surface and an opening extending therethough connected to a source of a cooling fluid, and a second portion located outwardly of the first portion, a substrate support, having a substrate support surface thereon, extending over the second portion, a process fluid outlet overlying the first portion, and a driving unit coupled to one of the stage and the first portion, wherein the driving unit is configured to move at least one of the substrate support surface and the substrate facing surface such that the relative locations of the substrate support surface and the substrate facing surface of the stage are changeable based on the shape of a substrate to be processed in the apparatus.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: June 20, 2023
    Assignee: Kioxia Corporation
    Inventors: Kosuke Takai, Mana Tanabe, Hideaki Sakurai
  • Patent number: 11651953
    Abstract: According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 16, 2023
    Assignee: Kioxia Corporation
    Inventors: Minako Inukai, Hideaki Sakurai, Kyo Otsubo, Tetsuo Takemoto
  • Publication number: 20230105202
    Abstract: This punched-workpiece with the insulating film includes a punched-workpiece having a cut surface, a plating layer formed on at least the cut surface of the punched-workpiece, and an insulating film formed on the surface of the plating layer.
    Type: Application
    Filed: February 24, 2021
    Publication date: April 6, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nagisa Shishinai, Hideaki Sakurai
  • Patent number: 11581127
    Abstract: There is provided an insulated electric wire formed by covering a rectangular conductor wire having a rectangular cross-sectional shape with an insulating film. The insulating film is formed of an inner layer covering a surface of the rectangular conductor wire, and an outer layer covering a surface of the inner layer. A thickness (t1) of a section of the inner layer, which covers one short side of two facing short sides of the same length of a rectangular cross section of the rectangular conductor wire, is greater than a thickness (t2) (including that t2=0) of a section of the inner layer which covers the other short side. An elastic modulus and/or a yield stress of the inner layer are less than an elastic modulus and/or a yield stress of the outer layer.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: February 14, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Makoto Urushihara, Yasuhiko Kudo, Shintaro Iida, Hideaki Sakurai
  • Patent number: 11555254
    Abstract: An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: January 17, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Patent number: 11493846
    Abstract: According to one embodiment, a pattern forming method includes forming a resist film including a first core material pattern and a second core material pattern, on a first film laminated on a substrate; forming a second film at least on sidewalls of the first and second core material patterns; removing the first core material pattern while not removing the second core material pattern and the second film; and processing the first film by using, as a mask, the second core material pattern and the second film.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: November 8, 2022
    Assignee: Kioxia Corporation
    Inventors: Takeharu Motokawa, Noriko Sakurai, Ryu Komatsu, Hideaki Sakurai
  • Patent number: 11450452
    Abstract: There is provided an insulated flat rectangular conductor including: a flat rectangular conductor; and an insulating film coating the flat rectangular conductor, in which the flat rectangular conductor has a first surface and a second surface opposite to the first surface, and the first surface is rougher than the second surface.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: September 20, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Makoto Urushihara, Hideaki Sakurai
  • Publication number: 20220291581
    Abstract: A template according to an embodiment includes a substrate and a first layer. The substrate includes a first face having a pattern, and contains a first element. The first layer is in contact with the first face, and contains a compound having the first element and a second element different from the first element, the density of the compound in the first layer being higher than the density of the compound in the substrate.
    Type: Application
    Filed: September 7, 2021
    Publication date: September 15, 2022
    Applicant: Kioxia Corporation
    Inventors: Takeharu MOTOKAWA, Noriko SAKURAI, Hideaki SAKURAI
  • Patent number: 11430585
    Abstract: An insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a fluorine-containing resin composition layer including a cured product of a thermosetting resin and a fluororesin and a fluorine concentration gradient layer which is disposed between the conductor and the fluorine-containing resin composition layer. The fluorine-containing resin composition layer includes a cured product of a thermosetting resin and a fluororesin, and is provided with a concentration gradient in which a fluorine atom content decreases from the fluorine-containing resin composition layer side toward the conductor.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: August 30, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Publication number: 20220206382
    Abstract: According to one embodiment, a pattern formation method includes patterning a first film on a substate to have a plurality of lines extending in a first direction and a second pattern portion extending in a second direction intersecting the first direction. Each line having at least a first width and being spaced from an adjacent line in the second direction by a least three times the first width and spaced from ends of the lines in the first direction by twice or less the first width. A conformal film is then formed on the patterned first film. The conformal film having a thickness equal to the first width. The patterned first film is then removed while leaving portions of the conformal film that were previously on sidewalls of the plurality of lines behind.
    Type: Application
    Filed: August 31, 2021
    Publication date: June 30, 2022
    Inventors: Noriko SAKURAI, Takeharu MOTOKAWA, Ryu KOMATSU, Hideaki SAKURAI