Abstract: A cutting system for cutting a workpiece by laser emission relies upon local cooling of the workpiece at the point at which cutting starts and ends. Optionally, local cooling can also be provided at a cross point where two cutting lines intersect. Relying upon the difference in thermal stress between the laser beam incidence point and the surrounding cooled portion, an initial crack can be generated in a specified direction, whereby the initial crack is propagated to form the desired cutting line. In one embodiment, the cooling is provided by a low temperature solid such as a Peltier cooling plate and the temperature of the workpiece near a point of incidence of the laser beam is determined. The determination can be made by measuring the temperature of a plasma generated near the point of incidence, or by directly measuring the temperature of the portion of the workpiece near the point of incidence.

Abstract: A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Abstract: The present invention provides a process for efficiently dephosphorizing, dephosphorizing and decarbonizing, or desulfurizing, dephosphorizing and decarbonizing a hot metal in a converter. The amount of flux to be charged and the amount of bottom-blown gas are adjusted so that the bottom-blowing agitation power and the CaO/SiO.sub.2 ratio subsequent to the treatment become at least 0.1 kW/ton and from 0.7 to 2.5, respectively and the hot metal temperature at the treatment end point becomes from 1,200.degree. to 1,450.degree. C. Furthermore, the operation of the process is controlled so that the sum of a T.Fe concentration and a MnO concentration in the slag subsequent to the treatment becomes from 10 to 35% by weight by adjusting the top-blown oxygen feed rate, the flow rate of bottom-blown gas or the top-blowing lance height.

Abstract: An input video signal is written into alternate field memories M1 and M2, according to a timing clock from an input video clock generator. A display video signal is alternately read from those field memories, according to a timing clock from a display video clock generator. In switching a read memory, an address observation circuit judges whether or not a read/write address passes by a write/read address, referring to the condition of reading and writing operations. In this event, the circuit makes a judgement, based on the lag between a vertical synchronizing signals of an input video signal and of a display video signal, and a change of the lag with time. If it is judged that one address will pass by the other, the same read/write memory is again accessed for reading/writing. With this arrangement, there is provided a circuit having a relatively simple structure for preventing a match of read and write addresses.

Abstract: A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

Abstract: A soldering is performed in such a manner that two solder portions having different melting points are put between a metallization on a substrate for joining and a part. The chip portion having a higher melting point is made thicker than a solder foil portion having a lower melting point. Initially, the part is held to the metallization by the solder chip having the higher melting point. The solder foil having the lower melting point is first melted in such a state and, after that, the solder chip having the higher melting point is melted. By such a soldering method, a reliable soldering can be performed, without causing a void on the undersurface of a part joint section, by one soldering operation, so that a presoldering operation becomes unnecessary.

Abstract: A flexible film-like member having conductive metals filled in tapered holes extending through the thickness is positioned such that the holes of the member face to respective pad patterns on a circuit board on which bumps are to be formed, the conductive metals are then heated and fused so that they are joined and transferred to the pad patterns on the circuit board, and the film-like member is then removed by heating or cleaning liquid.

Abstract: A drilling method and a drilling apparatus of a hard brittle material in which a core drill is used for abrasive grinding of high accuracy and high durability.

Abstract: A balance adjustment method of an end mill for increasing the accuracy of the machined surface and also for lengthening the tool lifetime, in which mass unbalance between an end gash part of a primary cutting edge and an end gash part of a secondary cutting edge of the end mill having asymmetric cutting parts is balanced by decreasing an end gash angle, an end gash part, a clearance angle or a corner of tooth face of the secondary cutting edge.

Abstract: A grinding method and a grinding machine of reduced grinding resistance, in which letting f [mm] denote the diamond particle size of a diamond grindstone, V [m/min] denote the peripheral speed of the diamond grindstone, and f [m/min] denote the feed speed of a workpiece made of Aluminum nitride ceramic, the peripheral speed of the diamond grindstone and the feed speed of the workpiece are set so as to satisfy V.gtoreq.35 .phi.+2000 and V/f.gtoreq.70 .phi.+800.

Abstract: A method of supplying parts in a system for assembling a printed circuit board by mounting the parts on a substrate at corresponding predetermined positions thereof. One or more kinds of substrates and at least one group of parts, to be mounted on the corresponding substrates, are introduced into the system lot by lot. The introduced parts on one or more previously prepared parts containers are placed so as to correspond to the substrates on which the individual parts are to be mounted, thereby providing one or more sets of the parts, each set corresponding to a respective one of the substrates. The sets of parts are supplied to a parts mounting station of the system.

Abstract: The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.

Abstract: A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relative position of the pad and the ball. The bonding head will move downward again, and an ultrasonic wave is applied to heat the ball and the bonding head so that the ball and the pad are welded. If necessary, a portion of the wire to be bent is moved to a desired position of the wiring board, by a supporting apparatus. A free end of the wire which is not welded is moved by a jig to bend the portion of the wire for routing.

Abstract: A production management system for managing production by using a plurality of working devices arranged in the production processes includes a host management device for managing control data necessary for producing a product, working device managing terminals provided in correspondence with working devices used for the production for processing information necessary in managing the working devices, and a terminal information management device for integrally managing information items which are processed at individual working device management terminals. Each working device management terminal is connected with the terminal information management device through a network to enable transfer of information between each working device terminal and the terminal information management device and between individual working device terminals.

Abstract: An electronic circuit apparatus in which electronic circuit components are mounted to multiwiring substrate or the like for use with electronic circuits such as an LSI are sealed airtight by sealing units. The sealing unit is sealed by an upper board designated as an upper board sealing unit and a side board designated as a side board sealing unit, and the shape of the edge on cross section of the side board is convex or circular. Metallization is applied to solder joint portions between a substrate and a side board and between the side board and the upper board, and a predetermined solder joint height is provided by a support post to effect solder joining.

Abstract: A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling system uses in the horizontal direction a coolant supply pipe having straight tube sections and flexible bellows sections alternately disposed in the axial direction of the pipe. The straight tube sections of the aforesaid coolant supply pipe are brought into contact with the upper faces of the chips by a spring force so as to cool continuously the plurality of chips with the coolant flowing in one coolant supply pipe thereby providing a simply structured cooling system for chips. Such a structured cooling system enables the collective assembly of cooling parts for a plurality of chips with only a small number of parts and produces highly reliable effects thereby being able to implement the miniaturization of a main frame computer.

Abstract: An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.

Abstract: Method of forming a positive-positive type image is disclosed, which is characterized in that a photosensitive layer is formed on a substrate using a composition comprising water-soluble photo-crosslinking agent, water-soluble resin and synthetic resin emulsion and further coloring agent, if necessary, said photosensitive layer is exposed to active rays through manuscript, then this is immersed into warm water of 30.degree. to 60.degree. C. for not less than 3 seconds to allow the exposed area to swell and soften sufficiently with warm water and simultaneously to allow almost all water-soluble photo-crosslinking agent in the nonexposed area to dissolve out into warm water, and successively the swollen and softened exposed area is rubbed out to form an image having no coloring originating from water-soluble photo-crosslinking agent without using the development chemicals except water.

Abstract: A metal layer other than gold is formed on a ceramic substrate, a gold layer is further formed on said metal layer, and then a high density beam is applied to the treated substrate member. Thereby, the metal of the underlayer diffused through the grain boundaries of gold up to the surface of the gold layer by heat treatment or the like is uniformly mixed with gold to form an alloyed layer excellent in wettability to a solder. At the same time, nonmetallic impurities such as carbon adhering onto the surface of the gold layer are melted and removed.

Abstract: A vapor tank for processing a product by heating the same through exposure to vapor serving as a heat transfer medium. The vapor tank includes at least one partition wall separating a vapor chamber filled with vapor and a heating chamber for processing the product by heating the same for supplying a sufficient saturated vapor to the product. The partition wall is formed with openings for allowing the saturated vapor to be injected therethrough from the vapor chamber into the heating chamber where the product is enveloped by the saturated vapor. The vapor tank is provided with a recovery device for recovering the vapor flowing out of the tank through an inlet and an outlet for introducing and discharging the product into and out of the tank with a high degree of vapor recovering efficiency and with a minimum loss of energy. The vapor tank is also provided with a mechanism for externally supplying air currents to prevent the vapor from flowing out of the tank through the inlet and the outlet.