Patents by Inventor Hideaki Seuzaki

Hideaki Seuzaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of resin sealing semiconductor devices
    Patent number: 5059379
    Abstract: A method of resin sealing semiconductor devices wherein semiconductor devices, such as semiconductor chips, are placed in cavities provided in a pair of chase blocks which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks to resin seal the semiconductor devices.
    Type: Grant
    Filed: December 8, 1989
    Date of Patent: October 22, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasutsugu Tsutsumi, Sueyoshi Tanaka, Tatsuro Takahashi, Yutaka Morita, Hideaki Seuzaki, Hiromichi Yamada