Patents by Inventor Hideaki Tagaya

Hideaki Tagaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for packaging a photosensitive film roll, resin case therefor, method for recovering and reusing the case, and photosensitive film roll package and method for conveying the same
    Patent number: 7677014
    Abstract: A method of increasing manufacturing efficiency of printed wiring boards is provided that includes packaging a photosensitive film roll with a resin case, wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer comprises a photosensitive resin composition that contains a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: March 16, 2010
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshihiro Watanabe, Katsutoshi Itagaki, Tomoyuki Haga, Hideaki Tagaya
  • Method for packaging a photosensitive film roll, resin case therefor, method for recovering and reusing the case, and photosensitive film roll package and method for conveying the same
    Patent number: 7597195
    Abstract: A method for packaging a photosensitive film roll, which includes packaging the photosensitive film roll with a resin case. The photosensitive film roll is formed in a step by winding around a core, a photosensitive film comprising a supporting film and a photosensitive resin composition layer formed on the supporting film. The resin case is collapsible without generating any waste materials after the case is collapsed. The photosensitive resin layer includes a photosensitive resin composition containing a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: October 6, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshihiro Watanabe, Katsutoshi Itagaki, Tomoyuki Haga, Hideaki Tagaya
  • METHOD FOR PACKAGING A PHOTOSENSITIVE FILM ROLL, RESIN CASE THEREFOR, METHOD FOR RECOVERING AND REUSING THE CASE, AND PHOTOSENSITIVE FILM ROLL PACKAGE AND METHOD FOR CONVEYING THE SAME
    Publication number: 20080149514
    Abstract: A method of increasing manufacturing efficiency of printed wiring boards is provided that includes packaging a photosensitive film roll with a resin case, wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer comprises a photosensitive resin composition that contains a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiatior, and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.
    Type: Application
    Filed: February 21, 2008
    Publication date: June 26, 2008
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yoshihiro WATANABE, Katsutoshi ITAGAKI, Tomoyuki HAGA, Hideaki TAGAYA
  • Method of packaging photosensitive film roll, resin case for the packaging method, method for collection and re-use of the case, and packaging material and transportation method for photosensitive film roll
    Publication number: 20040079664
    Abstract: A method for packaging a photosensitive film roll, comprising packaging the photosensitive film roll with a resin case.
    Type: Application
    Filed: December 30, 2003
    Publication date: April 29, 2004
    Inventors: Yoshihiro Watanabe, Katsutoshi Itagaki, Tomoyuki Haga, Hideaki Tagaya