Abstract: An ultrasonic transducer includes: piezoelectric elements; a pair of clamping members which clamp said piezoelectric elements; and a cover member which is crimped to at least one of said pair of clamping members in a state where said cover member cooperates with said pair of clamping members to surround said piezoelectric elements.

Abstract: An ultrasonic transducer (101, 102, 103) includes: a front member (1, 1a) having a front side on which an ultrasonic radiating surface (11) is provided and a back side which is opposite to the front side; a side member (2, 2a); a backing member (3, 3a); and a piezoelectric ceramic body (4), which are provided axially integrally, wherein one end side of the side member (2, 2a) is fitted to the back side of the front member (1, 1a), one end side of the backing member (3, 3a) is fitted to another end side of the side member (2, 2a), and the piezoelectric ceramic body (4) is interposed between the front member (1, 1a) and the backing member (3, 3a).

Abstract: An ultrasonic transducer includes: piezoelectric elements; a pair of clamping members which clamp said piezoelectric elements; and a cover member which is crimped to at least one of said pair of clamping members in a state where said cover member cooperates with said pair of clamping members to surround said piezoelectric elements.

Abstract: An ultrasonic transducer (101, 102, 103) includes: a front member (1, 1a) having a front side on which an ultrasonic radiating surface (11) is provided and a back side which is opposite to the front side; a side member (2, 2a); a backing member (3, 3a); and a piezoelectric ceramic body (4), which are provided axially integrally, wherein one end side of the side member (2, 2a) is fitted to the back side of the front member (1, 1a), one end side of the backing member (3, 3a) is fitted to another end side of the side member (2, 2a), and the piezoelectric ceramic body (4) is interposed between the front member (1, 1a) and the backing member (3, 3a).

Abstract: The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability. The resin composition for semiconductor encapsulation comprises: (A) an epoxy resin; (B) a phenolic resin; (C) a latent curing accelerator; and D) an inorganic filler, and has a viscosity of 7,000 poise or more at 25° C. and 5,000 poise or less at 80° C.

Abstract: A dielectric filter includes a plurality of resonators provided in a dielectric block in parallel to each other. Each resonator is formed through providing an inner conductor on a wall surface of a through-hole extending between first and second end surfaces of the block. An outer conductor is provided on end and side surfaces of the block except for the first end surface. The inner conductor and the outer conductor are connected together so that the second end surface serves as a short circuit end surface, and the first end surface serves as an open end surface. A pair of input-output terminals are provided on a side surface of the block so that the input-output terminals are located adjacent to the open end surface at respective positions corresponding to open ends of two of the resonators. Insulating sections on the side surface isolate corresponding input-output terminals from the outer conductor formed on the side surface of the block.

Abstract: A dielectric filter includes a plurality of resonators provided in a dielectric block in parallel to each other. Each resonator is formed through providing an inner conductor on a wall surface of a through-hole extending between first and second end surfaces of the block. An outer conductor is provided on end and side surfaces of the block except for the first end surface. The inner conductor and the outer conductor are connected together so that the second end surface serves as a short circuit end surface, and the first end surface serves as an open end surface. A pair of input-output terminals are provided on a side surface of the block so that the input-output terminals are located adjacent to the open end surface at respective positions corresponding to open ends of two of the resonators. Insulating sections on the side surface isolate corresponding input-output terminals from the outer conductor formed on the side surface of the block.

Abstract: A method for manufacturing a flexible printed circuit in which a resin solution is applied onto a circuit substrate having a wiring pattern on its surface so as to form a resin cover layer, having the steps of: wetting the surface of the circuit substrate with a solvent which is capable of dissolving the resin; applying the resin solution onto the surface wetted with the solvent; and drying the resin solution to thereby form the resin cover layer. A flexible printed circuit obtained in the manufacturing method.