Patents by Inventor Hideaki USUDA

Hideaki USUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11337597
    Abstract: An imaging module of the invention includes: an imaging element; and a substrate positioned on a rear surface opposite to an imaging surface of the imaging element and provided to extend from the rear surface to a side opposite to the imaging surface. An electrode pad provided on the rear surface of the imaging element and a front end portion of an electrode pad provided on a main surface of the substrate at a position close to the imaging element are electrically connected via a conductive connecting material portion. A notch portion recessed from a distal end of the front end portion is formed at the front end portion of the electrode pad of the substrate.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: May 24, 2022
    Assignee: FUJIKURA LTD.
    Inventors: Takeshi Ishizuka, Kenichi Ishibashi, Hideaki Usuda
  • Patent number: 10757309
    Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: August 25, 2020
    Assignee: Fujikura Ltd.
    Inventors: Yoshinobu Numasawa, Kenichi Ishibashi, Shingo Ishii, Daisuke Murakami, Takeshi Ishizuka, Hideaki Usuda
  • Patent number: 10757302
    Abstract: The imaging module includes: an image-sensing device, circuit substrate, fixing member, signal cable, and electroconductive member. The image-sensing device includes: a connection electrode. The circuit substrate includes: a substrate main body, electrode terminal, cable terminal, and connection wiring. The substrate main body has two surfaces and is an insulating member. The electrode terminal is on the first surface and is electrically connected to the connection electrode. The cable terminal is on the second surface. Inside the substrate main body, the connection wiring electrically connects the electrode terminal to the cable terminal. The fixing member has a through hole and a substrate connection face opposite the second surface. The signal cable is inserted into the through hole and is fixed by the fixing member. The electroconductive member connects the second surface to the substrate connection face and electrically connects the conductor end face to the cable terminal.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: August 25, 2020
    Assignee: Fujikura Ltd.
    Inventors: Hideaki Usuda, Takeshi Ishizuka
  • Patent number: 10690905
    Abstract: An imaging module of the invention includes: an image-sensing unit that includes an image-sensing device; a lens that has a front end and is optically connected to the image-sensing device; and a frame that is fixed in position with respect to the image-sensing device and includes a lens barrel having an insertion space, into which the front end is to be inserted in at least an optical axis direction. In a state where movement of the lens in a direction intersecting with the optical axis direction is limited, the insertion space is capable of receiving the lens in the direction such that the lens approaches the image-sensing device. The lens is fixed to the lens barrel at a position at which the lens is optically connected to the image-sensing device.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: June 23, 2020
    Assignee: FUJIKURA LTD.
    Inventors: Hideaki Usuda, Kenichi Nakatate
  • Patent number: 10560658
    Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: February 11, 2020
    Assignee: Fujikura Ltd.
    Inventors: Takeshi Ishizuka, Kenichi Ishibashi, Shingo Ishii, Daisuke Murakami, Yoshinobu Numasawa, Hideaki Usuda
  • Patent number: 10462342
    Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: October 29, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Hideaki Usuda, Kenichi Ishibashi, Daisuke Murakami, Takeshi Ishizuka, Yoshinobu Numasawa, Shingo Ishii
  • Patent number: 10429633
    Abstract: An imaging module of the invention includes: a connector including: a first implanted conductor; a second implanted conductor longer than the first implanted conductor; a first groove that includes a second mounting terminal constituting part of the first implanted conductor; a second groove that includes a third mounting terminal constituting part of the second implanted conductor; and a third groove that is located between the first groove and the second groove; and a coaxial cable including: an internal conductor that is provided in the first groove and is electrically connected to the second mounting terminal; a sheath conductor that is provided in the second groove and is electrically connected to the third mounting terminal; and a coated portion that is provided in the third groove.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: October 1, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Takeshi Ishizuka, Hideaki Usuda
  • Publication number: 20190068848
    Abstract: The imaging module includes: an image-sensing device, circuit substrate, fixing member, signal cable, and electroconductive member. The image-sensing device includes: a connection electrode. The circuit substrate includes: a substrate main body, electrode terminal, cable terminal, and connection wiring. The substrate main body has two surfaces and is an insulating member. The electrode terminal is on the first surface and is electrically connected to the connection electrode. The cable terminal is on the second surface. Inside the substrate main body, the connection wiring electrically connects the electrode terminal to the cable terminal. The fixing member has a through hole and a substrate connection face opposite the second surface. The signal cable is inserted into the through hole and is fixed by the fixing member. The electroconductive member connects the second surface to the substrate connection face and electrically connects the conductor end face to the cable terminal.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 28, 2019
    Applicant: FUJIKURA LTD.
    Inventors: Hideaki Usuda, Takeshi Ishizuka
  • Publication number: 20190068858
    Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 28, 2019
    Applicant: FUJIKURA LTD.
    Inventors: Hideaki Usuda, Kenichi Ishibashi, Daisuke Murakami, Takeshi Ishizuka, Yoshinobu Numasawa, Shingo Ishii
  • Publication number: 20190068917
    Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plaurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.
    Type: Application
    Filed: August 29, 2018
    Publication date: February 28, 2019
    Applicant: FUJIKURA LTD.
    Inventors: Takeshi Ishizuka, Kenichi Ishibashi, Shingo Ishii, Daisuke Murakami, Yoshinobu Numasawa, Hideaki Usuda
  • Publication number: 20190068859
    Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.
    Type: Application
    Filed: August 29, 2018
    Publication date: February 28, 2019
    Applicant: FUJIKURA LTD.
    Inventors: Yoshinobu Numasawa, Kenichi Ishibashi, Shingo Ishii, Daisuke Murakami, Takeshi Ishizuka, Hideaki Usuda
  • Publication number: 20190021581
    Abstract: An imaging module of the invention includes: an imaging element; and a substrate positioned on a rear surface opposite to an imaging surface of the imaging element and provided to extend from the rear surface to a side opposite to the imaging surface. An electrode pad provided on the rear surface of the imaging element and a front end portion of an electrode pad provided on a main surface of the substrate at a position close to the imaging element are electrically connected via a conductive connecting material portion. A notch portion recessed from a distal end of the front end portion is formed at the front end portion of the electrode pad of the substrate.
    Type: Application
    Filed: July 17, 2018
    Publication date: January 24, 2019
    Applicant: Fujikura Ltd.
    Inventors: Takeshi Ishizuka, Kenichi Ishibashi, Hideaki Usuda
  • Patent number: 10122953
    Abstract: An imaging module of the invention includes: a solid-state image sensing device including an imaging-device terminal; a connector having a first end face, a second end face located opposite to the first end face, and a side face orthogonal to the first end face, the connector including: a main body serving as an insulating member, an implanted conductor that is implanted in an inside of the main body, a first mounting terminal that is electrically connected to the imaging-device terminal and the implanted conductor and is provided on the first end face, a second mounting terminal that is provided on the side face and constitutes part of the implanted conductor, and a third mounting terminal that is provided on the second end face and constitutes part of the implanted conductor; and a signal cable electrically connected to the second mounting terminal.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: November 6, 2018
    Assignee: FUJIKURA LTD.
    Inventors: Takeshi Ishizuka, Hideaki Usuda
  • Publication number: 20170269349
    Abstract: An imaging module of the invention includes: an image-sensing unit that includes an image-sensing device; a lens that has a front end and is optically connected to the image-sensing device; and a frame that is fixed in position with respect to the image-sensing device and includes a lens barrel having an insertion space, into which the front end is to be inserted in at least an optical axis direction. In a state where movement of the lens in a direction intersecting with the optical axis direction is limited, the insertion space is capable of receiving the lens in the direction such that the lens approaches the image-sensing device. The lens is fixed to the lens barrel at a position at which the lens is optically connected to the image-sensing device.
    Type: Application
    Filed: February 16, 2017
    Publication date: September 21, 2017
    Applicant: Fujikura Ltd.
    Inventors: Hideaki USUDA, Kenichi NAKATATE
  • Publication number: 20170153441
    Abstract: An imaging module of the invention includes: a connector including: a first implanted conductor; a second implanted conductor longer than the first implanted conductor; a first groove that includes a second mounting terminal constituting part of the first implanted conductor; a second groove that includes a third mounting terminal constituting part of the second implanted conductor; and a third groove that is located between the first groove and the second groove; and a coaxial cable including: an internal conductor that is provided in the first groove and is electrically connected to the second mounting terminal; a sheath conductor that is provided in the second groove and is electrically connected to the third mounting terminal; and a coated portion that is provided in the third groove.
    Type: Application
    Filed: October 6, 2016
    Publication date: June 1, 2017
    Applicant: FUJIKURA LTD.
    Inventors: Takeshi ISHIZUKA, Hideaki USUDA
  • Publication number: 20170155860
    Abstract: An imaging module of the invention includes: a solid-state image sensing device including an imaging-device terminal; a connector having a first end face, a second end face located opposite to the first end face, and a side face orthogonal to the first end face, the connector including: a main body serving as an insulating member, an implanted conductor that is implanted in an inside of the main body, a first mounting terminal that is electrically connected to the imaging device terminal and the implanted conductor and is provided on the first end face, a second mounting terminal that is provided on the side face and constitutes part of the implanted conductor, and a third mounting terminal that is provided on the second end face and constitutes part of the implanted conductor; and a signal cable electrically connected to the second mounting terminal.
    Type: Application
    Filed: November 29, 2016
    Publication date: June 1, 2017
    Applicant: FUJIKURA LTD.
    Inventors: Takeshi ISHIZUKA, Hideaki USUDA
  • Publication number: 20160287060
    Abstract: An imaging module of the invention including a flexible wiring substrate that includes: a first end portion including a connector; a second end portion including a mount portion; a mounting portion on which an imaging device is mounted; a first bend portion bended and provided between the mounting portion and the first end portion; and a second bend portion bended and provided between the mounting portion and the second end portion. The first end portion and the second end portion overlap each other at a rear side opposite to an imaging surface of the imaging device, a cable is connected to a surface of the first end portion on the opposite side of the second end portion, and a capacitor is mounted on a surface of the second end portion on the opposite side of the first end portion.
    Type: Application
    Filed: March 15, 2016
    Publication date: October 6, 2016
    Applicant: FUJIKURA LTD.
    Inventors: Hideaki USUDA, Kazuhiro DOMOTO, Kenichi ISHIBASHI
  • Patent number: D875930
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: February 18, 2020
    Assignee: FUJIKURA LTD.
    Inventors: Takao Sato, Kazuhiro Domoto, Hideo Shiratani, Takahiro Shimono, Hideaki Usuda, Takeshi Ishizuka, Wataru Oishi
  • Patent number: D877333
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: March 3, 2020
    Assignee: FUJIKURA LTD.
    Inventors: Takao Sato, Masanobu Saruta, Hideo Shiratani, Takahiro Shimono, Hideaki Usuda, Takeshi Ishizuka, Wataru Oishi