Patents by Inventor Hideaki Yamaji

Hideaki Yamaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip component and method of manufacturing the same
    Patent number: 11769705
    Abstract: Disclosed is a chip component including a substrate having a first surface and a second surface on an opposite side from the first surface, and a third surface connecting the first surface and the second surface to each other, an external surface resin configured to cover at least the third surface of the substrate, and a terminal electrode formed on the first surface of the substrate and exposed from the external surface resin. A recessed portion is formed in an end portion of the third surface of the substrate, the end portion being on the first surface side. The external surface resin is embedded in the recessed portion.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: September 26, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Katsuya Matsuura, Yasuhiro Kondo, Hideaki Yamaji
  • Chip part and manufacturing method thereof
    Patent number: 11270932
    Abstract: A chip part includes a chip main body which has a first main surface at one side, a second main surface at the other side and side surfaces that connect the first main surface and the second main surface and which includes a terminal electrode exposed from the first main surface, and an outer surface resin which exposes the first main surface of the chip main body and covers an outer surface of the chip main body.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: March 8, 2022
    Assignee: ROHM CO., LTD.
    Inventor: Hideaki Yamaji
  • CHIP COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210143074
    Abstract: Disclosed is a chip component including a substrate having a first surface and a second surface on an opposite side from the first surface, and a third surface connecting the first surface and the second surface to each other, an external surface resin configured to cover at least the third surface of the substrate, and a terminal electrode formed on the first surface of the substrate and exposed from the external surface resin. A recessed portion is formed in an end portion of the third surface of the substrate, the end portion being on the first surface side. The external surface resin is embedded in the recessed portion.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 13, 2021
    Inventors: Katsuya MATSUURA, Yasuhiro KONDO, Hideaki YAMAJI
  • CHIP PART AND MANUFACTURING METHOD THEREOF
    Publication number: 20200111733
    Abstract: A chip part includes a chip main body which has a first main surface at one side, a second main surface at the other side and side surfaces that connect the first main surface and the second main surface and which includes a terminal electrode exposed from the first main surface, and an outer surface resin which exposes the first main surface of the chip main body and covers an outer surface of the chip main body.
    Type: Application
    Filed: October 2, 2019
    Publication date: April 9, 2020
    Applicant: ROHM CO., LTD.
    Inventor: Hideaki YAMAJI
  • Marking method for semiconductor device and semiconductor device provided with markings
    Patent number: 8394676
    Abstract: A marking method is provided for putting markings on the surface of a packaged semiconductor device. The semiconductor device includes a semiconductor chip and a resin package for covering the semiconductor chip. The method includes the steps of forming a groove in the obverse surface of the resin package, and filling the groove with a resin that is visually distinguishable from the resin package.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: March 12, 2013
    Assignee: Rohm Co., Ltd.
    Inventor: Hideaki Yamaji
  • MARKING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PROVIDED WITH MARKINGS
    Publication number: 20100171214
    Abstract: A marking method is provided for putting markings on the surface of a packaged semiconductor device. The semiconductor device includes a semiconductor chip and a resin package for covering the semiconductor chip. The method includes the steps of forming a groove in the obverse surface of the resin package, and filling the groove with a resin that is visually distinguishable from the resin package.
    Type: Application
    Filed: January 4, 2010
    Publication date: July 8, 2010
    Applicant: ROHM CO., LTD.
    Inventor: Hideaki YAMAJI