Patents by Inventor Hideharu Nagai

Hideharu Nagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10290959
    Abstract: Provided is a cable mounting substrate for mounting plural cables each of which includes a center conductor, an insulation covering the center conductor and an outer conductor covering the insulation. The cable mounting substrate includes a plate-shaped base, a ground pattern that is arranged on the base and electrically connected to the outer conductor, and a solder member that is provided on the ground pattern and is melted to electrically connect and fix the outer conductor to the ground pattern. The solder member includes a recessed portion having a shape along an outer shape of the outer conductor.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: May 14, 2019
    Assignee: Hitachi Metals, Ltd.
    Inventors: Takashi Kumakura, Hideharu Nagai
  • Publication number: 20180248279
    Abstract: Provided is a cable mounting substrate for mounting plural cables each of which includes a center conductor, an insulation covering the center conductor and an outer conductor covering the insulation. The cable mounting substrate includes a plate-shaped base, a ground pattern that is arranged on the base and electrically connected to the outer conductor, and a solder member that is provided on the ground pattern and is melted to electrically connect and fix the outer conductor to the ground pattern. The solder member includes a recessed portion having a shape along an outer shape of the outer conductor.
    Type: Application
    Filed: February 12, 2018
    Publication date: August 30, 2018
    Applicant: Hitachi Metals, Ltd.
    Inventors: Takashi KUMAKURA, Hideharu NAGAI
  • Patent number: 5469962
    Abstract: This invention relates to packing methods and materials for packing electrolytic capacitors and the like. This invention provides packing methods whereby capacitors are held in a container tray with a good order and with no rotational movement of capacitor and packing materials wherein packing of electrolytic capacitors solves the problem of capacitor rotation and allows the capacitors to be easily taken out of the container tray. According to this invention, an electrolytic capacitor loaded container tray is taken out of a receptacle and the electrolytic capacitors held in the container tray in an orderly manner can be smoothly picked up for automatic mounting on printed wiring boards.
    Type: Grant
    Filed: June 24, 1994
    Date of Patent: November 28, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Kitagawa, Hideharu Nagai, Junkichi Kawamura, Hitoshi Mizuguchi
  • Patent number: 5099991
    Abstract: Electrolytic capacitors 14 having terminals 15, 16 on one base face and a fixing frame at the other end part are inserted in bags made of air-bubble plastic sheet of tubular shape whose one end is welded to form an end and further having a terminal-protection part 13 made by folding the end part of the bag and welded to the welded part 12, and the bags 11 containing the electrolytic capacitor 14 are compactly packed in a box 18 of corrugated cardboard in alternating direction and flaps 191, 191, 192, 192 are closed and sealed; the electrolytic capacitors 14 having delicate terminals 15, 16 are safely and compactly packed in the box 18, and the terminals 15, 16 and the bent part of the fixing frames 17, are safely isolated by the bag.
    Type: Grant
    Filed: October 3, 1990
    Date of Patent: March 31, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Kitagawa, Hideharu Nagai, Tooru Yamaguchi, Fumiaki Kawaguchi