Patents by Inventor Hidehiko Andou

Hidehiko Andou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9696574
    Abstract: A transparent conductive laminate includes a coating film including a first transparent resin film and a coating layer or layers provided on one or both sides of the first transparent resin film; a transparent conductive film including a second transparent resin film and a transparent conductive layer provided on one side of the second transparent resin film; and a pressure-sensitive adhesive layer interposed between the coating film and the transparent conductive film, wherein the coating layer of the coating film is laminated with the pressure-sensitive adhesive layer to a side of the transparent conductive film where the transparent conductive layer is not provided, the pressure-sensitive adhesive layer has a storage elastic modulus of 80,000 Pa or less at 120° C., and the adhesive strength between the pressure-sensitive adhesive layer and the coating layer is from 5 N/25 mm to 20 N/25 mm.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: July 4, 2017
    Inventors: Mari Tanabe, Hidehiko Andou, Hideo Sugawara
  • Patent number: 9406415
    Abstract: A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H1?H2 of the dimensional change rate H1 of the pattern forming part and the dimensional change rate H2 of the pattern opening part in the heat treatment step is preferably less than 0.03%.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: August 2, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Mari Tanabe, Hidehiko Andou, Hideo Sugawara
  • Publication number: 20140078422
    Abstract: A transparent conductive laminate includes a coating film including a first transparent resin film and a coating layer or layers provided on one or both sides of the first transparent resin film; a transparent conductive film including a second transparent resin film and a transparent conductive layer provided on one side of the second transparent resin film; and a pressure-sensitive adhesive layer interposed between the coating film and the transparent conductive film, wherein the coating layer of the coating film is laminated with the pressure-sensitive adhesive layer to a side of the transparent conductive film where the transparent conductive layer is not provided, the pressure-sensitive adhesive layer has a storage elastic modulus of 80,000 Pa or less at 120° C., and the adhesive strength between the pressure-sensitive adhesive layer and the coating layer is from 5 N/25 mm to 20 N/25 mm.
    Type: Application
    Filed: May 1, 2012
    Publication date: March 20, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mari Tanabe, Hidehiko Andou, Hideo Sugawara
  • Publication number: 20140027405
    Abstract: A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H1?H2 of the dimensional change rate H1 of the pattern forming part and the dimensional change rate H2 of the pattern opening part in the heat treatment step is preferably less than 0.
    Type: Application
    Filed: September 30, 2013
    Publication date: January 30, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mari Tanabe, Hidehiko Andou, Hideo Sugawara
  • Patent number: 8568603
    Abstract: A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H1-H2 of the dimensional change rate H1 of the pattern forming part and the dimensional change rate H2 of the pattern opening part in the heat treatment step is preferably less than 0.03%.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: October 29, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Mari Tanabe, Hidehiko Andou, Hideo Sugawara
  • Publication number: 20130048597
    Abstract: A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H1-H2 of the dimensional change rate H1 of the pattern forming part and the dimensional change rate H2 of the pattern opening part in the heat treatment step is preferably less than 0.03%.
    Type: Application
    Filed: August 24, 2012
    Publication date: February 28, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mari Tanabe, Hidehiko Andou, Hideo Sugawara
  • Patent number: 8003200
    Abstract: A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: August 23, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Tomotake Nashiki, Hideo Sugawara, Hidehiko Andou, Hidetoshi Yoshitake
  • Patent number: 7763151
    Abstract: A process for producing a transparent conductive laminate having a completely crystallized, transparent conductive layer on a substrate comprising an organic polymer molding is provided. The transparent conductive layer is excellent in transparency and wet heat confidence, is not excessively low in specific resistivity, and has no variation on optical properties such as retardation characteristic. The transparent conductive laminate is obtained by sputter-film forming a transparent conductive layer on a substrate comprising an organic polymer molding under conditions of a substrate temperature of 80-150° C. and a degree of vacuum of 8×10?3 Pa or lower to form an amorphous transparent conductive layer comprising an In.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: July 27, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Tomonori Noguchi, Hidehiko Andou, Hidetoshi Yoshitake, Hideo Sugawara
  • Publication number: 20100136276
    Abstract: An object of the invention is to provide a transparent conductive film having good processability and to provide a method for production thereof. The pressure-sensitive adhesive layer-carrying transparent conductive film of the invention comprises: an amorphous transparent conductive laminate comprising a transparent plastic film substrate and an amorphous transparent conductive thin film provided on one side of the transparent plastic film substrate; a pressure-sensitive adhesive layer; and a release film that is provided on another side of the transparent plastic film substrate with the pressure-sensitive adhesive layer interposed therebetween and comprises at least a film substrate, wherein the release film is thicker than the amorphous transparent conductive laminate, and a value obtained by subtracting the thermal shrinkage percentage of the release film in the MD direction from the thermal shrinkage percentage of the amorphous transparent conductive laminate in the MD direction is from ?0.3% to 0.45%.
    Type: Application
    Filed: February 28, 2008
    Publication date: June 3, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hidehiko Andou, Hideo Sugawara, Tomotake Nashiki
  • Publication number: 20080096013
    Abstract: A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.
    Type: Application
    Filed: September 27, 2005
    Publication date: April 24, 2008
    Applicant: Nitto Denko Corporation
    Inventors: Tomotake Nashiki, Hideo Sugawara, Hidehiko Andou, Hidetoshi Yoshitake
  • Patent number: 6982432
    Abstract: A touch type liquid-crystal display device has a liquid-crystal display panel having flexibility, a touch panel provided to adhere closely to a back side, opposite to a visual side, of the liquid-crystal display panel, and electrodes disposed to be opposite to each other through a gap. The electrodes are capable of coming into partial contact with each other by a pressing force to thereby detect an input position.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: January 3, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Seiji Umemoto, Tomonori Noguchi, Tadayuki Kameyama, Kiichi Shimodaira, Hideo Sugawara, Hidehiko Andou
  • Publication number: 20050045471
    Abstract: A process for producing a transparent conductive laminate having a completely crystallized, transparent conductive layer on a substrate comprising an organic polymer molding is provided. The transparent conductive layer is excellent in transparency and wet heat confidence, is not excessively low in specific resistivity, and has no variation on optical properties such as retardation characteristic. The transparent conductive laminate is obtained by sputter-film forming a transparent conductive layer on a substrate comprising an organic polymer molding under conditions of a substrate temperature of 80-150° C. and a degree of vacuum of 8×10?3 Pa or lower to form an amorphous transparent conductive layer comprising an In.
    Type: Application
    Filed: August 26, 2004
    Publication date: March 3, 2005
    Inventors: Tomonori Noguchi, Hidehiko Andou, Hidetoshi Yoshitake, Hideo Sugawara
  • Patent number: 6720955
    Abstract: A transparent conductive laminated body comprising a transparent dielectric substance thin film having two layers and furthermore a transparent conductive thin film being formed on one face of a transparent film substrate with thickness of 2 to 120 &mgr;m, and a transparent substrate being adhered on another face of the film substrate through a transparent pressure sensitive adhesive layer, wherein a relationship of n3<n1<=n2 <n4 is satisfied where a light index of refraction of the film substrate is defined as n1, a light indexes of refraction of the two layers of the dielectric substance thin films are defined as n2 and n3 from the film substrate side respectively, and a light index of refraction of the conductive thin film is defined as n4 is excellent in transparency and scratch-proof property of the conductive thin film, and, moreover, excellent also in flexibility. A touch panel using the transparent conductive laminated body concerned has an improved dotting property.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: April 13, 2004
    Assignee: Nitto Denko Corporation
    Inventors: Hideo Sugawara, Tomonori Noguchi, Hidehiko Andou
  • Publication number: 20020158853
    Abstract: A transparent conductive laminated body comprising a transparent dielectric substance thin film having two layers and furthermore a transparent conductive thin film being formed on one face of a transparent film substrate with thickness of 2 to 120 &mgr;m, and a transparent substrate being adhered on another face of the film substrate through a transparent pressure sensitive adhesive layer, wherein a relationship of n3<n1<=n2 <n4 is satisfied where a light index of refraction of the film substrate is defined as n1, a light indexes of refraction of the two layers of the dielectric substance thin films are defined as n2 and n3 from the film substrate side respectively, and a light index of refraction of the conductive thin film is defined as n4 is excellent in transparency and scratch-proof property of the conductive thin film, and, moreover, excellent also in flexibility. A touch panel using the transparent conductive laminated body concerned has an improved dotting property.
    Type: Application
    Filed: January 31, 2002
    Publication date: October 31, 2002
    Inventors: Hideo Sugawara, Tomonori Noguchi, Hidehiko Andou
  • Patent number: 6407788
    Abstract: A film for protecting a display surface of a liquid crystal display is provided, which contains a polymer film having a coefficient of bending stress k as expressed by the formula: k=Eh3, wherein E is a tensile elastic modulus (N/mm2) in a machine direction and h is a thickness (mm), of not less than 0.01 (N·mm), and which shows an amount of moisture permeation at 35° C., 80% RH (relative humidity) for 72 hours of not less than 100 g/m2·72 hr. According to the present invention, the protection film can be applied to the display surface of a liquid crystal module with superior workability during assembling. The film prevents occurrence of changes in optical hue (color shading) on the display surface in the state of actual use upon peeling off of the protection film after distribution process.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: June 18, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Kazuhito Okumura, Hidehiko Andou
  • Publication number: 20010022632
    Abstract: A touch type liquid-crystal display device has a liquid-crystal display panel having flexibility, a touch panel provided to adhere closely to a back side, opposite to a visual side, of the liquid-crystal display panel, and electrodes disposed to be opposite to each other through a gap. The electrodes are capable of coming into partial contact with each other by a pressing force to thereby detect an input position.
    Type: Application
    Filed: April 17, 2001
    Publication date: September 20, 2001
    Inventors: Seiji Umemoto, Tomonori Noguchi, Tadayuki Kameyma, Kiichi Shimodaira, Hideo Sugawara, Hidehiko Andou