Patents by Inventor Hidehiro Iwase

Hidehiro Iwase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive resin composition and molded product using the same
    Patent number: 4882227
    Abstract: There is provided an electric conductive resin composition formed into a pellet, which includes an electric conductive filler comprising electric conductive fibers and a low-melting point metal, and being coated on the surface thereof with a thermoplastic resin. Flux and/or a phosphorus-based antioxidant may be added to the filler. There is also provided an electromagnetic wave shielding molded product prepared by using the electric conductive resin composition mentioned above, wherein the electric conductive fibers dispersed within the molded product are fixed each other through the low-melting point metal.
    Type: Grant
    Filed: March 9, 1988
    Date of Patent: November 21, 1989
    Assignee: Toshiba Chemical Corporation
    Inventors: Hidehiro Iwase, Keiichi Habata
  • Conductive synthetic resin molding material
    Patent number: 4530779
    Abstract: A conductive synthetic resin composition, which is suited for manufacturing a molded product having an excellent electromagnetic shielding effect, and comprises master pellets consisting of a cylindrical synthetic resin layer and a bundle of a number of strands of fibrous conductive filler filled inside said synthetic resin layer in a longitudinal direction thereof, the master pellets being cut in the form of pellets; and natural pellets consisting of a synthetic resin.
    Type: Grant
    Filed: October 11, 1983
    Date of Patent: July 23, 1985
    Assignee: Toshiba Chemical Products Co., Ltd.
    Inventors: Toshio Mayama, Hidehiro Iwase