Patents by Inventor Hidehiro Maeda
Hidehiro Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967371Abstract: A semiconductor memory device includes i first word lines connected to the i first memory cells, i second word lines connected to the i second memory cells, a driver capable of supplying voltage to each of the i first word lines and each of the i second word lines, and a logic control circuit controlling both a write operation including a verify operation and a read operation including a verify operation. In the semiconductor memory device, when an order of performing a sense operation for determining whether or not a threshold voltage of the k-th first memory cell has reached a j-th threshold voltage in the verify operation is different from that of in the read operation, a voltage applied to the k-th first word line in the verify operation is different from a voltage applied to the k-th first word line in the read operation.Type: GrantFiled: June 10, 2022Date of Patent: April 23, 2024Assignee: Kioxia CorporationInventors: Rieko Funatsuki, Takashi Maeda, Hidehiro Shiga
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Publication number: 20240096413Abstract: A control circuit of a semiconductor memory device performs a write operation on a memory cell transistor of the semiconductor memory device by performing a first pulse application operation of lowering a threshold voltage of the memory cell transistor, a precharge operation, and then a second pulse application operation. In the precharge operation, in a state in which first and second select transistors connected to the memory cell transistor are turned on, a bit line connected to the memory cell transistor is charged by applying a ground voltage to a word line connected to a gate of the memory cell transistor and applying a voltage higher than the ground voltage to a source line. In the second pulse application operation, in a state in which the first select transistor is turned on and the second select transistor is turned off, a program voltage is applied to the word line.Type: ApplicationFiled: March 2, 2023Publication date: March 21, 2024Inventors: Natsuki SAKAGUCHI, Takashi MAEDA, Rieko FUNATSUKI, Hidehiro SHIGA
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Publication number: 20230052396Abstract: A control device configured to control a supply condition of a gas which is supplied between two substrates that are to be bonded to each other by a substrate bonding device, is configured to control the supply condition based on a measurement result obtained by a measurement in relation to at least one of the substrate, another substrate bonded before the substrate is bonded, or the substrate bonding device, and the two substrates are bonded to each other by a contact region expanding after the contact region is formed in a center.Type: ApplicationFiled: September 6, 2022Publication date: February 16, 2023Applicant: NIKON CORPORATIONInventors: Hidehiro MAEDA, Toshimasa SHIMODA, Hajime MITSUISHI, Hiroshi MORI, Kishou TAKAHATA, Masahiro YOSHIHASHI, Takashi SHIOMI, Yoshihiro MAEHARA
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Publication number: 20220084870Abstract: A substrate holder includes a central support portion configured to support a central portion of a substrate, and an circumferential support portion arranged on an outside of the central support portion and configured to support a circumferential portion on an outside of the central portion, and the circumferential support portion is configured to support the circumferential portion so that at least a partial region of the circumferential portion is curved toward the substrate holder with a curvature greater than that of the central portion.Type: ApplicationFiled: November 5, 2021Publication date: March 17, 2022Applicant: NIKON CORPORATIONInventors: Hajime MITSUISHI, Isao SUGAYA, Atsushi KAMASHITA, Masashi OKADA, Minoru FUKUDA, Hidehiro MAEDA
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Publication number: 20210225651Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.Type: ApplicationFiled: April 8, 2021Publication date: July 22, 2021Applicant: NIKON CORPORATIONInventors: Hajime MITSUISHI, Isao SUGAYA, Minoru FUKUDA, Masaki TSUNODA, Hidehiro MAEDA, Ikuhiro KUWANO
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Patent number: 11004686Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.Type: GrantFiled: May 15, 2019Date of Patent: May 11, 2021Assignee: NIKON CORPORATIONInventors: Hajime Mitsuishi, Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano
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Patent number: 10714351Abstract: Provided is a substrate holding unit that holds a pair of substrates that are aligned and layered, comprising a first holding member that holds one of the substrates; a plurality of members to be joined that are connected to the first holding member; a second holding member that holds the other of the substrates to face the one of the substrates; a plurality of joining members that exert an adhesion force on the members to be joined and are connected to the second holding member at positions corresponding to positions of the members to be joined; and an adhesion restricting section that restricts the adhesion force until the substrates are aligned.Type: GrantFiled: February 7, 2013Date of Patent: July 14, 2020Assignee: Nikon CorporationInventors: Hidehiro Maeda, Satoshi Katagiri
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Publication number: 20190267238Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.Type: ApplicationFiled: May 15, 2019Publication date: August 29, 2019Applicant: NIKON CORPORATIONInventors: Hajime MITSUISHI, lsao SUGAYA, Minoru FUKUDA, Masaki TSUNODA, Hidehiro MAEDA, lkuhiro KUWANO
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Patent number: 9240339Abstract: A substrate holder is reliably transported in a state of holding a substrate. There is provided a substrate holder for holding a substrate by means of electrostatic force generated by power supplied from an external source. The substrate holder is to be transported in a state of holding the substrate. The substrate holder includes a holder body that is to have the substrate placed thereon, and a connector terminal that is externally exposed through the holder body, where the connector terminal is attachable to and detachable from an external power supply terminal. There is also provided a substrate transport apparatus for transporting a substrate holder holding a substrate by means of electrostatic force generated by power supplied from an external source.Type: GrantFiled: October 10, 2013Date of Patent: January 19, 2016Assignee: NIKON CORPORATIONInventors: Hidehiro Maeda, Masahiro Yoshihashi
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Patent number: 9054140Abstract: Provided is a substrate holder system comprising a first substrate holder that holds a first substrate; an engaging member provided on the first substrate holder; a second substrate holder that holds a second substrate and can, together with the first substrate holder, sandwich the first substrate and the second substrate; an engagement receiving member that is provided on the second substrate holder and engages with the engaging member; and a dust restricting means for restricting generation of dust caused by the engagement of the engaging member and the engagement receiving member.Type: GrantFiled: January 20, 2012Date of Patent: June 9, 2015Assignee: NIKON CORPORATIONInventors: Isao Sugaya, Junichi Chonan, Hidehiro Maeda
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Patent number: 9015930Abstract: Provided is a substrate holding unit that holds a pair of substrates that are aligned and layered, comprising a first holding member that holds one of the substrates; a plurality of members to be joined that are connected to the first holding member; a second holding member that holds the other of the substrates to face the one of the substrates; a plurality of joining members that exert an adhesion force on the members to be joined and are connected to the second holding member at positions corresponding to positions of the members to be joined; and an adhesion restricting section that restricts the adhesion force until the substrates are aligned.Type: GrantFiled: April 28, 2010Date of Patent: April 28, 2015Assignee: Nikon CorporationInventors: Hidehiro Maeda, Satoshi Katagiri
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Publication number: 20140345805Abstract: A substrate holder that holds a substrate when the substrate is being aligned with another substrate and transports the substrate in a held state, comprising a mounting portion on which the substrate is mounted; a supported section that is provided on the mounting portion and is supported by another member during transport; and a restricting section that restricts damage from stress caused by a difference in expansion and contraction due to heat between the mounting portion and the supported section.Type: ApplicationFiled: June 13, 2014Publication date: November 27, 2014Inventors: Hidehiro MAEDA, Isao SUGAYA, Naohiko KURATA, Hiroshi MORI
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Publication number: 20140036403Abstract: A substrate holder is reliably transported in a state of holding a substrate. There is provided a substrate holder for holding a substrate by means of electrostatic force generated by power supplied from an external source. The substrate holder is to be transported in a state of holding the substrate. The substrate holder includes a holder body that is to have the substrate placed thereon, and a connector terminal that is externally exposed through the holder body, where the connector terminal is attachable to and detachable from an external power supply terminal. There is also provided a substrate transport apparatus for transporting a substrate holder holding a substrate by means of electrostatic force generated by power supplied from an external source.Type: ApplicationFiled: October 10, 2013Publication date: February 6, 2014Applicant: NIKON CORPORATIONInventors: Hidehiro Maeda, Masahiro Yoshihashi
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Patent number: 8570704Abstract: A substrate holder is reliably transported in a state of holding a substrate. There is provided a substrate holder for holding a substrate by means of electrostatic force generated by power supplied from an external source. The substrate holder is to be transported in a state of holding the substrate. The substrate holder includes a holder body that is to have the substrate placed thereon, and a connector terminal that is externally exposed through the holder body, where the connector terminal is attachable to and detachable from an external power supply terminal. There is also provided a substrate transport apparatus for transporting a substrate holder holding a substrate by means of electrostatic force generated by power supplied from an external source.Type: GrantFiled: September 10, 2010Date of Patent: October 29, 2013Assignee: Nikon CorporationInventors: Hidehiro Maeda, Masahiro Yoshihashi
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Publication number: 20130274915Abstract: Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on acceleration of the substrate holders. Whether there is the possibility of misalignment may be judged based on acceleration of a transporting section that transports the substrate holders. Whether there is the possibility of misalignment may be judged based on relative positions of the substrate holders.Type: ApplicationFiled: June 12, 2013Publication date: October 17, 2013Inventors: Hidehiro Maeda, Kazuya Okamoto, Yasuaki Tanaka
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Patent number: 8489227Abstract: Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on at least one of an acceleration of the substrate holders, an acceleration of a transporting section that transports the substrate holders, relative positions of the substrate holders, or relative positions of the transporting section and one of the pair of substrate holders.Type: GrantFiled: July 13, 2012Date of Patent: July 16, 2013Assignee: Nikon CorporationInventors: Hidehiro Maeda, Kazuya Okamoto, Yasuaki Tanaka
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Publication number: 20130157438Abstract: Provided is a substrate holding unit that holds a pair of substrates that are aligned and layered, comprising a first holding member that holds one of the substrates; a plurality of members to be joined that are connected to the first holding member; a second holding member that holds the other of the substrates to face the one of the substrates; a plurality of joining members that exert an adhesion force on the members to be joined and are connected to the second holding member at positions corresponding to positions of the members to be joined; and an adhesion restricting section that restricts the adhesion force until the substrates are aligned.Type: ApplicationFiled: February 7, 2013Publication date: June 20, 2013Applicant: NIKON CORPORATIONInventors: Hidehiro MAEDA, Satoshi Katagiri
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Publication number: 20120330459Abstract: Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on at least one of an acceleration of the substrate holders, an acceleration of a transporting section that transports the substrate holders, relative positions of the substrate holders, or relative positions of the transporting section and one of the pair of substrate holders.Type: ApplicationFiled: July 13, 2012Publication date: December 27, 2012Applicant: Nikon CorporationInventors: Hidehiro MAEDA, Kazuya OKAMOTO, Yasuaki TANAKA
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Publication number: 20120214290Abstract: Provided is a substrate holder pair comprising a first substrate holder that has a first holding portion holding a first substrate; a second substrate holder that has a second holding portion holding a second substrate to be bonded with the first substrate and that, together with the first substrate holder, sandwiches the first substrate and the second substrate; an engaging member that causes the first substrate holder to engage with the second substrate holder; and a dust inhibiting section inhibits dust generated by the engaging of the engaging member from entering between the first holding portion and the second holding portion.Type: ApplicationFiled: January 20, 2012Publication date: August 23, 2012Inventors: Isao Sugaya, Junichi Chonan, Hidehiro Maeda, Keiichi Tanaka, Tomoyuki Yasuda
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Publication number: 20120205024Abstract: Provided is a substrate holder system comprising a first substrate holder that holds a first substrate; an engaging member provided on the first substrate holder; a second substrate holder that holds a second substrate and can, together with the first substrate holder, sandwich the first substrate and the second substrate; an engagement receiving member that is provided on the second substrate holder and engages with the engaging member; and a dust restricting means for restricting generation of dust caused by the engagement of the engaging member and the engagement receiving member.Type: ApplicationFiled: January 20, 2012Publication date: August 16, 2012Inventors: Isao SUGAYA, Junichi CHONAN, Hidehiro MAEDA