Patents by Inventor Hidehiro Numao

Hidehiro Numao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6863753
    Abstract: In a manufacturing apparatus for flat cable adapted for allowing plural conductive wires arranged on the same plane to be put between a first insulating tape on which first peeling sheets are stuck at predetermined intervals and a second insulating tape on which second peeling sheets are stuck at predetermined intervals to stick the first insulating tape, the conductive wires and the second insulating tape in order recited, such an approach is employed to respectively adjust tensions applied to the first and second insulating tapes to thereby respectively independently change expansions/contractions of the first and second insulating tapes. Thus, it is possible to correct sticking errors of the first peeling sheets and the second peeling sheets.
    Type: Grant
    Filed: January 20, 2000
    Date of Patent: March 8, 2005
    Assignee: Sony Chemicals Corporation
    Inventors: Takao Murooka, Hakuji Kobayashi, Masakazu Endo, Toshihiro Tsutsumi, Hiroaki Shirai, Hidehiro Numao
  • Patent number: 4735847
    Abstract: An electrically conductive adhesive sheet is disclosed which has an electrically conducting property across a thickness thereof and an electrically insulating property along a sheet surface direction. The electrically conductive adhesive sheet comprises an electrically insulating adhesive material and electrically conductive metal powder uniformly dispersed therein. The metal powder has a melting point lower than a certain working temperature, and is flattened by application of pressure between a pair of conductors between which the adhesive sheet is provided. The adhesive material is molten at the certain working temperature and is flown by application of pressure. The adhesive sheet is useful to electrically connect a pair of circuit boards each having a plurality of conductor patterns thereon by bonding corresponding ones through the metal powder as molten, while keeping the neighboring patterns insulated. The circuit board is mechanically integrated simultaneously by the adhesive sheet.
    Type: Grant
    Filed: June 22, 1987
    Date of Patent: April 5, 1988
    Assignee: Sony Corporation
    Inventors: Yoshio Fujiwara, Naotake Kobayashi, Yuichi Matsubara, Hisashi Ando, Hidehiro Numao, Kazuaki Suzuki