Patents by Inventor Hidehito Matsuyama

Hidehito Matsuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6895354
    Abstract: A method for generating thermal network data for use in thermal analysis of a coupling structure of a large number of components. Depending on the density of nodes having a position defined by the structure, two-dimensional quadtree area division or three-dimensional octtree area division is performed. A node is provided in the center of the divided area and anode is determined using approximation to a node having a position defined by the structure. Alternatively, an area and a node are determined using Voronoi area division in case of area subdivision where a small area is assigned only to a defined node. Thermal network data is generated by inserting thermal resistances between respective nodes.
    Type: Grant
    Filed: February 4, 2002
    Date of Patent: May 17, 2005
    Assignee: NEC Corporation
    Inventors: Hidehito Matsuyama, Hirokazu Tohya
  • Publication number: 20040073397
    Abstract: A method for generating thermal network data for use in thermal analysis of a coupling structure of a large number of components. Depending on the density of nodes having a position defined by the structure, two-dimensional quadtree area division or three-dimensional octtree area division is performed. A node is provided in the center of the divided area and anode is determined using approximation to a node having a position defined by the structure. Alternatively, an area and a node are determined using Voronoi area division in case of area subdivision where a small area is assigned only to a defined node. Thermal network data is generated by inserting thermal resistances between respective nodes.
    Type: Application
    Filed: August 4, 2003
    Publication date: April 15, 2004
    Inventors: Hidehito Matsuyama, Hirokazu Tohya
  • Patent number: 6618694
    Abstract: A user uses part data forming means 101 and module data forming means 102 to input the actual dimension, physical constants and mesh dividing number for fundamental shapes which are registered in advance, thereby forming parts, and then indicates the relative position between the parts to form the entire shape of an assembly of plural parts without paying attention to coincidence or non-coincidence of nodal points. Data converting means 104 divides the shape of each part thus assembled according to the indicated mesh divisional number to generate element data and nodal point data. Further, it generates a constraint equation for connecting nodal points which are non-connected between neighboring parts, and forms an analysis model 401. A finite element method analyzer 105 uses approximate calculation means 106 to approximate a non-connected nodal point displacement from a nodal point displacement of neighboring structural elements on the basis of the constraint equation.
    Type: Grant
    Filed: May 26, 1998
    Date of Patent: September 9, 2003
    Assignee: NEC Corporation
    Inventors: Akinobu Shibuya, Kouji Matsui, Hidehito Matsuyama