Abstract: A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in this order, and has a total film thickness of 400 ?m or less, in which a thickness of the intermediate layer is 5 ?m or more and 50 ?m or less, and an upper yield point stress of the laminate is 1,500 N/cm2 or more.

Abstract: A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in this order, and has a total film thickness of 400 ?m or less, in which a thickness of the intermediate layer is 5 ?m or more and 50 ?m or less, and an upper yield point stress of the laminate is 1,500 N/cm2 or more.

Abstract: The present invention provides an adhesive resin composition that is used for adhesion of a fluorine-based resin and is aimed at adhesion between fluorine-based resins or between a fluorine-based resin and a material other than a fluorine-based resin. More specifically, the present invention relates to an adhesive resin composition for use in adhesion of a fluorine-based resin, the composition including a polyethylene-based resin, an elastomer component, and a component having an epoxy group and a vinyl group, wherein a content of the polyethylene-based resin is 55 parts by mass or more and 90 parts by mass or less, a content of the elastomer component is 10 parts by mass or more and 45 parts by mass or less, the elastomer component and the component having an epoxy group and a vinyl group have a common repetition unit, and a content of the component having an epoxy group and a vinyl group based on a total amount of 100 parts by mass of the polyethylene-based resin and the elastomer component is 0.

Abstract: A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in this order, and has a total film thickness of 400 ?m or less, in which a thickness of the intermediate layer is 5 ?m or more and 50 ?m or less, and an upper yield point stress of the laminate is 1,500 N/cm2 or more.

Abstract: A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in this order, and has a total film thickness of 400 ?m or less, in which a thickness of the intermediate layer is 5 ?m or more and 50 ?m or less, and an upper yield point stress of the laminate is 1,500 N/cm2 or more.

Abstract: The present invention provides an adhesive resin composition that is used for adhesion of a fluorine-based resin and is aimed at adhesion between fluorine-based resins or between a fluorine-based resin and a material other than a fluorine-based resin. More specifically, the present invention relates to an adhesive resin composition for use in adhesion of a fluorine-based resin, the composition including a polyethylene-based resin, an elastomer component, and a component having an epoxy group and a vinyl group, wherein a content of the polyethylene-based resin is 55 parts by mass or more and 90 parts by mass or less, a content of the elastomer component is 10 parts by mass or more and 45 parts by mass or less, the elastomer component and the component having an epoxy group and a vinyl group have a common repetition unit, and a content of the component having an epoxy group and a vinyl group based on a total amount of 100 parts by mass of the polyethylene-based resin and the elastomer component is 0.

Abstract: A coating film peeling apparatus for resin material includes: a peeling cylinder, a peeling roll installed therein with a space for a peeling process along an inner wall of the peeling cylinder, a resistance lid disposed to block a discharge port of the peeling cylinder, and a pressure adjustment part for adjusting an outflow rate and internal pressure of the peeling cylinder. The peeling cylinder is constituted by a polygonal-shaped angular columnar body having, as coating film pass-through holes, rows K of small holes and rows L of small holes and projection rings (angular embossments) provided alternately in multiple rows along a direction perpendicular to a rotating direction of the peeling roll.

Abstract: A coating film peeling apparatus for resin material includes: a peeling cylinder, a peeling roll installed therein with a space for a peeling process along an inner wall of the peeling cylinder, a resistance lid disposed to block a discharge port of the peeling cylinder, and a pressure adjustment part for adjusting an outflow rate and internal pressure of the peeling cylinder. The peeling cylinder is constituted by a polygonal-shaped angular columnar body having, as coating film pass-through holes, rows K of small holes and rows L of small holes and projection rings (angular embossments) provided alternately in multiple rows along a direction perpendicular to a rotating direction of the peeling roll.