Abstract: By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame is attached to the first printed circuit board. By cutting off a frame part and a tie bar part from the lead frame which was attached to the first printed circuit board, the lead part is separated, and forming is applied to the lead part so as for its tip to be extended over the first printed board. After the lead part which is expanded upward is inserted into a through-hole which was opened in a second printed circuit board, by soldering the lead part and the through-hole, the first printed circuit board and the second printed circuit board are electrically connected.

Abstract: In lead forming of a packaged semiconductor device having sides and leads extending outwardly from the sides of a package, separation between first and second bottom dies is adjusted to receive the package. The first and second bottom dies have top surfaces that include oblique portions. The package is placed between the first and second bottom dies with the leads proximate the top surfaces of the first and second bottom dies. At least one of (i) the first and second bottom dies and (ii) first and second top dies having respective bottom surfaces with oblique portions complementary to the top surfaces of the first and second bottom dies are moved toward each other. The leads are clamped between the top and bottom dies and are formed. Simultaneously, lateral forces, produced through contact of the complementary top and bottom surfaces and the leads, move the first and second top dies laterally, changing separation between the first and second top dies.

Abstract: In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.

Abstract: A method for removing tiebars of a lead frame after one or more semiconductor components have been encapsulated in a resin to form a package body attached to the lead frame, includes preparing a support member and cutters, the support member including holes engageable with the cutters, positioning the lead frame in place on the support member, moving the cutters relative to the support member so that the cutters are fitted into corresponding holes of the support member, punching out tiebars of the lead frame, and thereafter, removing any scraps left between leads of the lead frame.

Abstract: An apparatus for removing tiebars of a lead frame after one or more semiconductor components have been encapsulated in a resin to form a package body includes first and second removing stations. The second removing station is provided for removing scraps that may be left between leads of the lead frame after the tiebars have been removed in the first removing station. In the second removing station, the lead frame is positioned on a die. A scrap-cutting punch is moved relative to the die so that projections of the punch are fitted into corresponding holes of the die, thereby pushing the scraps out of the leads and into the holes.

Abstract: In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.

Abstract: By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame is attached to the first printed circuit board. By cutting off a frame part and a tie bar part from the lead frame which was attached to the first printed circuit board, the lead part is separated, and forming is applied to the lead part so as for its tip to be extended over the first printed board. After the lead part which is expanded upward is inserted into a through-hole which was opened in a second printed circuit board, by soldering the lead part and the through-hole, the first printed circuit board and the second printed circuit board are electrically connected.

Abstract: An apparatus for removing tiebars of a lead frame after one or more semiconductor components have been molded to form a package body includes first and second removing stations. The second removing station is provided for removing scraps that may be left in between the leads after the tiebars have been removed in the first removing station. In the second removing station, the lead frame is positioned in place on a die. A scrap-cutting punch is moved relative to the die so that the projections of the punch are fitted into the corresponding holes of the die, thereby pushing the possible scraps out of the leads to the holes.

Abstract: A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver (111) and a vertical driver (112) are controlled to move a punch holder (110), or an end portion (101T1) of a punch (101), within a plane defined by first and second directions (D1, D2). A tip (101A) of the punch (101) is brought into contact with leads (11), with a punch-side forming surface (101S) and a die-side forming surface (151S) maintained in parallel relationship. A pressurizer (131) is controlled to move the end portion (101T1) in a fourth direction (D4) toward the die-side forming surface (151S), and the punch-side forming surface (101S) and the die-side forming surface (151S) hold the leads (11) therebetween. A pressure detector (121) detects a load placed upon the punch (101).

Abstract: Four lead bending devices (40) are so disposed as to surround the forming die (31). In each of the lead bending devices (40), a rotary lever (41) extends from a rotary strut (43) and a lever guide (42) disposed therebelow holds the rotary lever (41) to prevent deflection of the rotary lever (41). The rotary strut (43) is connected to a driving unit (44). Thus, a lead forming apparatus and a lead forming method are provided to achieve improvement in flatness of end portions of leads, reduction of generation of solder-plating residues by preventing a removal of solder-plate from surfaces of the leads, and easy change of an angle of the end portions of the leads to be formed.