Abstract: A sensor board includes an insulating substrate having an upper surface and a lower surface, first detection electrodes located on the upper surface of the insulating substrate, second detection electrodes located on the lower surface of the insulating substrate, and a heat generator located between the first detection electrodes and the second detection electrodes inside the insulating substrate and including at least one conductor layer. A portion of the insulating substrate between the heat generator and the first detection electrodes has the same thickness as a portion of the insulating substrate between the heat generator and the second detection electrodes.

Abstract: An electronic component mounting package and an electronic device provide improved reliability. An electronic component mounting package includes a heat sink having a mount area in its middle, on which an electronic component is mountable, a frame installed on the heat sink to surround the mount area, a bond joining the heat sink and the frame together, and lead terminals installed on the upper surface of the frame to extend outward from the frame. The heat sink includes a metal, and includes a first portion having the mount area and a second portion thinner than the first portion. The second portion has a metallic crystal with a crystal grain size smaller than a crystal grain size of a metallic crystal of the first portion in a heat-sink thickness direction.

Abstract: There are provided a sensor substrate and a sensor device which have high detection accuracy. A sensor substrate includes an insulating substrate; sensing electrodes disposed in the insulating substrate, the sensing electrodes being columnar and being composed of at least one pair of positive and negative sensing electrodes, in the at least one pair of positive and negative sensing electrodes, part of a positive electrode and part of a negative electrode being each exposed from one surface of the insulating substrate; and innerlayer wiring lines embedded within the insulating substrate, the innerlayer wiring lines corresponding to the positive electrode and the negative electrode, respectively, in the at least one pair of positive and negative sensing electrodes.

Abstract: A sensor board includes an insulating substrate, detection electrodes located on a surface of the insulating substrate and including a positive electrode and a negative electrode adjacent to each other, and connection terminals including a positive electrode terminal electrically connected to the positive electrode and a negative electrode terminal electrically connected to the negative electrode. The negative electrode has a smaller volume than the positive electrode.

Abstract: A sensor board includes an insulating substrate having an upper surface and a lower surface, first detection electrodes located on the upper surface of the insulating substrate, second detection electrodes located on the lower surface of the insulating substrate, and a heat generator located between the first detection electrodes and the second detection electrodes inside the insulating substrate and including at least one conductor layer. A portion of the insulating substrate between the heat generator and the first detection electrodes has the same thickness as a portion of the insulating substrate between the heat generator and the second detection electrodes.

Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO2, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.

Abstract: A sensor board includes: an insulating substrate having a principal surface; and a detecting electrode disposed on the principal surface of the insulating substrate, the detecting electrode being formed mainly of a first metallic material composed of a base-metal based material which is catalytically inactive with respect to a decomposition reaction of particulates, an exposed surface of the detecting electrode being covered by a passivation film of the first metallic material.

Abstract: A sensor substrate according to the present invention includes an insulating substrate, a detection electrode on a principal surface of the insulating substrate, and resistance wiring including a heating electrode in the insulating substrate. The resistance wiring includes a multilayer wiring portion which is connected to the heating electrode and in which wires and other wires are connected in parallel.

Abstract: There are provided a sensor substrate and a sensor device which have high detection accuracy. A sensor substrate includes an insulating substrate; sensing electrodes disposed in the insulating substrate, the sensing electrodes being columnar and being composed of at least one pair of positive and negative sensing electrodes, in the at least one pair of positive and negative sensing electrodes, part of a positive electrode and part of a negative electrode being each exposed from one surface of the insulating substrate; and innerlayer wiring lines embedded within the insulating substrate, the innerlayer wiring lines corresponding to the positive electrode and the negative electrode, respectively, in the at least one pair of positive and negative sensing electrodes.

Abstract: A sensor substrate according to the present invention includes an insulating substrate, a detection electrode on a principal surface of the insulating substrate, and resistance wiring including a heating electrode in the insulating substrate. The resistance wiring includes a multilayer wiring portion which is connected to the heating electrode and in which wires and other wires are connected in parallel.

Abstract: A sensor board includes: an insulating substrate having a principal surface; and a detecting electrode disposed on the principal surface of the insulating substrate, the detecting electrode being formed mainly of a first metallic material composed of a base-metal based material which is catalytically inactive with respect to a decomposition reaction of particulates, an exposed surface of the detecting electrode being covered by a passivation film of the first metallic material.

Abstract: A method of manufacturing an implantable medical device includes manufacturing a hermetic feedthrough by providing a first sheet of unfired ceramic material, forming one or more holes through the sheet, inserting a first conductive material into one of the holes, and forming a pad in electrical contact with the first conductive material in one of the holes, wherein the pad comprises a plurality of layers and has a thickness of at least 50 micrometers, at least one layer comprising a second conductive material having a different composition than the first conductive material. The method further includes co-firing the unfired ceramic material, the first conductive material, and the second conductive material. The method further includes coupling the feedthrough to an encasement structure of the implantable medical device.

Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.

Abstract: A wiring board includes an insulating substrate composed of a ceramic sintered compact; and a connection pad disposed on a surface part of the insulating substrate. The connection pad includes a first portion disposed on the surface part of the insulating substrate and a second portion disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion of the connection pad is composed of platinum, and at least an exposed surface part of the first portion of the connection pad is composed of platinum containing a ceramic component.

Abstract: A wiring board includes an insulating substrate composed of a ceramic sintered compact; and a connection pad disposed on a surface part of the insulating substrate. The connection pad includes a first portion disposed on the surface part of the insulating substrate and a second portion disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion of the connection pad is composed of platinum, and at least an exposed surface part of the first portion of the connection pad is composed of platinum containing a ceramic component.

Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.

Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.

Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.

Abstract: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.

Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.