Patents by Inventor Hidekazu Sawai

Hidekazu Sawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6750425
    Abstract: In a three-dimensional laser beam machine having a head structure in which a processing point is not moved when a rotation axis and an attitude axis are rotated, the machine has: means for storing information of current angles of the rotation axis and the attitude axis, and calculating a nozzle direction vector from the angles; means for, based on the nozzle direction vector, determining angles of a nozzle in a vertical direction and a horizontal direction consisting of a Z-axis of an orthogonal coordinate system; and means for displaying the determined nozzle angles.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: June 15, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tomonari Mukae, Masaki Tsukamoto, Hidekazu Sawai
  • Publication number: 20030173340
    Abstract: In a three-dimensional laser beam machine having a head structure in which a processing point is not moved when a rotation axis and an attitude axis are rotated, the machine has: means for storing information of current angles of the rotation axis and the attitude axis, and calculating a nozzle direction vector from the angles; means for, based on the nozzle direction vector, determining angles of a nozzle in a vertical direction and a horizontal direction consisting of a Z-axis of an orthogonal coordinate system; and means for displaying the determined nozzle angles.
    Type: Application
    Filed: January 31, 2003
    Publication date: September 18, 2003
    Inventors: Tomonari Mukae, Masaki Tsukamoto, Hidekazu Sawai
  • Patent number: 6420676
    Abstract: A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: July 16, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hidekazu Sawai, Miki Kurosawa, Masato Matsubara
  • Publication number: 20010000605
    Abstract: A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.
    Type: Application
    Filed: December 13, 2000
    Publication date: May 3, 2001
    Inventors: Hidekazu Sawai, Miki Kurosawa, Masato Matsubara
  • Patent number: 6201213
    Abstract: A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.
    Type: Grant
    Filed: March 21, 1997
    Date of Patent: March 13, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hidekazu Sawai, Miki Kurosawa, Masato Matsubara
  • Patent number: 5897800
    Abstract: A beam confinement subsystem for an optical scanning system of a laser beam machine having a laser beam transfer path includes an expandable light path sealing and protecting member surrounding a portion of the laser beam transfer path, and a pressure adjusting buffer directly coupled to the expandable light path sealing and protecting member. Preferably, the pressure adjusting buffer including an expandable, airtight thin-film material. Additionally, the beam confinement can include a pressurized purge gas supply tank directly connected to the expandable light path sealing and protecting member to thereby provide greater protection from contamination to the laser beam transfer path.
    Type: Grant
    Filed: November 28, 1997
    Date of Patent: April 27, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hidekazu Sawai, Tsukasa Matsuno, Mitsunobu Oshimura, Eikichi Hayashi
  • Patent number: 5585015
    Abstract: In a laser machining apparatus and method according to the present invention, a chip conveyor provided under the machining head parallel to the moving direction of the machining head recovers chips dropping near a movable area of a machining head, the chip tray provided in a section where the chip conveyor does not exit, receives chips dropping in a movable area of the machining table where the chip conveyor does not exist, and brushes provided under the machining table move along with the machining table to clean off chips stored in the chip trays and drop the chips onto the chip conveyor.
    Type: Grant
    Filed: December 22, 1994
    Date of Patent: December 17, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Eikichi Hayashi, Mitsunobu Oshimura, Tsukasa Matsuno, Hidekazu Sawai