Patents by Inventor Hidekazu Shoji
Hidekazu Shoji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11994454Abstract: Automated analysis of particle beam measurement results is facilitated by a device that calculates a spatial parameter distribution representing spatial structure of a sample based on a scattering pattern corresponding to projection of the spatial structure of the sample to wavenumber space, the projection being obtained by detecting scattering of a particle beam which enters the sample and intersects with the sample.Type: GrantFiled: April 24, 2020Date of Patent: May 28, 2024Assignees: HITACHI, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Akinori Asahara, Hidekazu Morita, Takuya Kanazawa, Kanta Ono, Masao Yano, Tetsuya Shoji
-
Publication number: 20240154318Abstract: A structure contains a first member formed from a thermoplastic resin composition A and a second member formed from a thermoplastic resin composition B, the first member and the second member being joined at least partially, wherein the thermoplastic resin composition A molded into a molding with a thickness of 2 mm has a transmittance of 70.0% or more at a frequency of 76.5 GHz; the thermoplastic resin composition B molded into a molding with a thickness of 2 mm has a transmittance of less than 50.0% at a frequency of 76.5 GHz; and the thermoplastic resin composition B molded into a molding with a thickness of 2 mm has an absorbance of 40.0% or more at a frequency of 76.Type: ApplicationFiled: December 14, 2023Publication date: May 9, 2024Applicant: Mitsubishi Chemical CorporationInventors: Shuta ISEKI, Hidekazu SHOJI
-
Publication number: 20240026073Abstract: To provide a resin composition and a molded article. The resin composition contains a thermoplastic resin and an electrically conductive substance, wherein the resin composition formed into a molded article with a size of 100 mm×100 mm×t mm thick, provided that t is a value in a case where Concentration C (mass %) of an electrically conductive substance in the resin composition×Thickness t (mm) gives a value of 1.2 or more, has a ? absorptance of 20.0% or less, which is a difference between a maximum value and a minimum value of the absorptance in the frequency range of 28.0 GHz to 40.0 GHz; and has the absorptance of 35.0% or more at a frequency of 28.Type: ApplicationFiled: September 28, 2023Publication date: January 25, 2024Applicant: MITSUBISHI CHEMICAL CORPORATIONInventors: Shuta ISEKI, Hidekazu SHOJI
-
Publication number: 20230323111Abstract: A resin composition, a formed article, and, an electromagnetic wave absorber, may each have large electromagnetic wave absorbance. The resin composition may contain: a thermoplastic resin; and an electro-conductive substance, the resin composition, when formed to a 2 mm thick test specimen and a cross section thereof is observed under a digital microscope, giving an aggregate attributable to the electro-conductive substance, with an area percentage of the aggregate, having an equivalent circle diameter of 30 µm or larger, of 0.80% or smaller.Type: ApplicationFiled: February 24, 2022Publication date: October 12, 2023Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Shuta ISEKI, Hidekazu SHOJI, Satomi KITAGAWA
-
Publication number: 20230250276Abstract: A resin composition including a thermoplastic resin and a carbon nanotube. The resin composition has a dielectric constant at 76.5 GHz frequency of 4.50 or larger. A method for producing the resin composition, the method including, melt-kneading the thermoplastic resin, and a masterbatch of the carbon nanotube in the thermoplastic resin.Type: ApplicationFiled: February 24, 2022Publication date: August 10, 2023Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Shuta ISEKI, Hidekazu SHOJI
-
Publication number: 20230242747Abstract: A resin composition containing, per 100 parts by mass of a thermoplastic resin, 0.1 to 10.0 parts by mass of a carbon nanotube, and 10 to 100 parts by mass of a glass fiber, with a mass proportion of the carbon nanotube and the glass fiber (carbon nanotube/glass fiber) being 0.01 to 0.30.Type: ApplicationFiled: June 16, 2021Publication date: August 3, 2023Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Shuta ISEKI, Hidekazu SHOJI
-
Publication number: 20220325037Abstract: A thermoplastic resin composition for a millimeter-wave radar member, is provided, which comprises, relative to 100 parts by mass of a polybutylene terephthalate resin (A), 15 to 65 parts by mass of a rubber-reinforced polystyrene resin (B1) and/or 10 to 70 parts by mass of a polycarbonate resin (B2) as a component (B), 0.1 to 3 parts by mass of an epoxy compound (D), and 30 to 150 parts by mass of glass fiber (E).Type: ApplicationFiled: May 15, 2020Publication date: October 13, 2022Applicant: Mitsubishi Engineering-Plastics CorporationInventor: Hidekazu SHOJI
-
Publication number: 20210292547Abstract: A polybutylene terephthalate resin composition, comprising comprising a thermoplastic resin (A) containing a polybutylene terephthalate resin and, per 100 parts by mass of the thermoplastic resin (A), from 0 to 30 parts by mass of an elastomer (B), from 0.3 to 4 parts by mass of an epoxy compound (C), from 15 to 80 parts by mass of a reinforcing filler (D), and from 1 to 15 parts by mass of a masterbatch (E) containing a silicone compound with a weight-average molecular weight of 10,000 to 80,000 and a thermoplastic resin.Type: ApplicationFiled: July 19, 2019Publication date: September 23, 2021Applicant: Mitsubishi Engineering-Plastics CorporationInventors: Yasushi YAMANAKA, Hidekazu SHOJI, Rina TAKEUCHI
-
Patent number: 6762235Abstract: A polybutylene terephthalate resin having 30 eq/t or less of carboxyl end group, a crystallization temperature in a temperature decrease of 175° C. or higher and an amount of residual tetrahydrofuran of 300 ppm by weight or less; and compositions and molded articles comprising the resin and glass fiber, antioxidants and mold-releasing agents is provided. The polybutylene terephthalate resin can be molded in a short molding cycle, exhibits excellent resistance to hydrolysis and mold-releasing property, causes no corrosion of metals and generates little gas during molding. The compositions and the molded articles exhibit improved impact resistance, stability under heating and oxidation and mold-releasing property and can be advantageously used for members in electric and electronic products and in automobiles.Type: GrantFiled: April 19, 2002Date of Patent: July 13, 2004Assignee: Mitsubishi Engineering-Plastics CorporationInventors: Kunihiro Takenaka, Ryo Saito, Hidekazu Shoji
-
Publication number: 20030069339Abstract: A polybutylene terephthalate resin having 30 eq/t or less of carboxyl end group, a crystallization temperature in a temperature decrease of 175° C. or higher and an amount of residual tetrahydrofuran of 300 ppm by weight or less; and compositions and molded articles comprising the resin and glass fiber, antioxidants and mold-releasing agents is provided. The polybutylene terephthalate resin can be molded in a short molding cycle, exhibits excellent resistance to hydrolysis and mold-releasing property, causes no corrosion of metals and generates little gas during molding. The compositions and the molded articles exhibit improved impact resistance, stability under heating and oxidation and mold-releasing property and can be advantageously used for members in electric and electronic products and in automobiles.Type: ApplicationFiled: April 19, 2002Publication date: April 10, 2003Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Kunihiro Takenaka, Ryo Saito, Hidekazu Shoji
-
Patent number: 5519106Abstract: A process for preparing an aromatic polycarbonate resin from an aromatic dihydroxy compound and a carbonate diester by transesterification in the presence of a transesterification catalyst comprising; reacting a purified carbonate diester with an aromatic dihydroxy compound in the presence of a transesterification catalyst to form a polycarbonate prepolymer; said carbonate diester containing benzophenone and benzoate ester derivatives having a molecular weight of less than 1,000, each in an amount of 100 ppm or less, said polycarbonate prepolymer having a viscosity average molecular weight of 5,000 to 20,000 at a temperature of 140.degree. to 280.degree. C., the reaction pressure being from 0.1 Torr to normal pressure; polymerizing said prepolymer at a temperature of 240.degree. to 350.degree. C. in a lateral, bi-axial, self-cleaning reactor to obtain an aromatic polycarbonate resin having a viscosity average molecular weight of 15,000 to 60,000.Type: GrantFiled: January 17, 1995Date of Patent: May 21, 1996Assignee: Mitsubishi Chemical CorporationInventors: Masahiro Nukui, Takao Tayama, Takeshi Kashiwagi, Masatoshi Kimura, Hidekazu Shoji
-
Patent number: 5455324Abstract: Disclosed herein is an aromatic polycarbonate resin containing benzophenone and benzoate ester derivatives which have a molecular weight less than 1,000, each in an amount of 100 ppm or less. Also disclosed is a process for preparing an aromatic polycarbonate resin from an aromatic dihydroxy compound and a carbonate diester in which the benzophenone derivative content is 100 ppm or less by transesterification, comprising preparing a polycarbonate prepolymer having a viscosity average molecular weight of 5,000 to 20,000 using an iminocarboxylic acid or salt thereof as a transesterification catalyst and polymerizing the prepolymer in an extruder.The aromatic polycarbonate is colorless and transparent and is suitable for extrusion molding.Type: GrantFiled: August 25, 1993Date of Patent: October 3, 1995Assignee: Mitsubishi Chemical CorporationInventors: Masahiro Nukui, Takao Tayama, Takeshi Kashiwagi, Masatoshi Kimura, Hidekazu Shoji