Patents by Inventor Hideki Fujimura
Hideki Fujimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200317867Abstract: A material for fused deposition modeling 3D printer having an improved formability, and a filament for fused deposition modeling 3D printer using the same. The material for fused deposition modeling 3D printer includes a polyamide copolymer. The filament for fused deposition modeling 3D printer includes the material for fused deposition modeling 3D printer as described above.Type: ApplicationFiled: May 30, 2017Publication date: October 8, 2020Inventors: Yoshitomo HARA, Hideki FUJIMURA, Tadaharu MATSUMOTO, Mao TSURU
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Publication number: 20190241737Abstract: Provided is a composite member that has a member containing a fluorine-containing resin and a member containing a thermoplastic resin and demonstrates superior adhesiveness. The composite member is obtained by directly contacting a first member containing a thermoplastic polyurethane and a polyamide elastomer and a second member containing a fluorine-containing resin.Type: ApplicationFiled: October 30, 2017Publication date: August 8, 2019Applicant: UBE INDUSTRIES, LTD.Inventors: Takashi OKUSAKO, Katsuhiko TOKUHARA, Hideki FUJIMURA, Yoshitomo HARA
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Publication number: 20190037972Abstract: Provided is a polyamide elastomer composition having excellent stability in various molding and excellent dyeing properties as well as excellent color fastness properties. A polyamide elastomer composition which comprises a polyamide elastomer and a phosphorous acid compound, wherein the polyamide elastomer comprises constituent units 1 derived from a diamine compound represented by the formula (1) below, constituent units 2 derived from an aminocarboxylic acid compound represented by the formula (2) below or a lactam compound represented by the formula (3) below, and constituent units 3 derived from a dicarboxylic acid compound represented by the formula (4) below, wherein the content of the phosphorous acid compound in the polyamide elastomer is 0.02 to 0.15% by mass, and wherein the polyamide elastomer has a terminal amino group concentration of 2.Type: ApplicationFiled: February 21, 2017Publication date: February 7, 2019Applicant: UBE INDUSTRIES, LTD.Inventors: Yoshitomo HARA, Hideki FUJIMURA, Toshio MORIYAMA
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Publication number: 20180229482Abstract: A composite body in which a resin and a metal are contact-bonded with excellent adhesive force. Also, a composite body which is suppressed in decrease of bonding strength between a resin and a metal due to water absorption of the resin even if the composite body is left in rain or water, or is left in a high humidity environment or the like for a long period of time. The composite body is obtained by contact-bonding a thermoplastic resin (A) and a metal (B), and is characterized in that the thermoplastic resin (A) is a polyamide elastomer (1A) or a thermoplastic resin composition (2A) that contains a water absorbent thermoplastic resin (2a) and a metal hydroxide (2b).Type: ApplicationFiled: April 17, 2018Publication date: August 16, 2018Inventors: Hiroki Akatsu, Hideki Fujimura, Riyousuke Sasaki, Shinichi Hirayama, Tetsurou Hiroki, Hideki Harada
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Patent number: 9975317Abstract: Provided is a composite body in which a resin and a metal are contact-bonded with excellent adhesive force. Also provided is a composite body which is suppressed in decrease of bonding strength between a resin and a metal due to water absorption of the resin even if the composite body is left in rain or water, or is left in a high humidity environment or the like for a long period of time. The present invention relates to a composite body which is obtained by contact-bonding a thermoplastic resin (A) and a metal (B), and which is characterized in that the thermoplastic resin (A) is a polyamide elastomer (1A) or a thermoplastic resin composition (2A) that contains a water absorbent thermoplastic resin (2a) and a metal hydroxide (2b).Type: GrantFiled: August 12, 2014Date of Patent: May 22, 2018Assignee: Ube Industries, Ltd.Inventors: Hiroki Akatsu, Hideki Fujimura, Riyousuke Sasaki, Shinichi Hirayama, Tetsurou Hiroki, Hideki Harada
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Publication number: 20160185088Abstract: Provided is a composite body in which a resin and a metal are contact-bonded with excellent adhesive force. Also provided is a composite body which is suppressed in decrease of bonding strength between a resin and a metal due to water absorption of the resin even if the composite body is left in rain or water, or is left in a high humidity environment or the like for a long period of time. The present invention relates to a composite body which is obtained by contact-bonding a thermoplastic resin (A) and a metal (B), and which is characterized in that the thermoplastic resin (A) is a polyamide elastomer (1A) or a thermoplastic resin composition (2A) that contains a water absorbent thermoplastic resin (2a) and a metal hydroxide (2b).Type: ApplicationFiled: August 12, 2014Publication date: June 30, 2016Inventors: Hiroki Akatsu, Hideki Fujimura, Riyousuke Sasaki, Shinichi Hirayama, Tetsurou Hiroki, Hideki Harada
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Patent number: 8493838Abstract: When the alternate unit detects the failure of the area unit, the alternate unit obtains the program corresponding to the program type of the area unit having the failure. The alternate unit sets the IP address of the area unit, and obtains the setting information from the management unit belonging to the area same as the area including the area unit having the failure. Then, the alternate unit collects the data from the units which previously communicate with the area unit having a failure and previously communicating with the area unit. The alternate unit performs the initialization and starts the management of the unit. Consequently, it is possible to continuously manage the sub unit being previously managed by the main unit, now having a failure, without stopping the management of the sub unit, even if the main unit is failed.Type: GrantFiled: April 24, 2009Date of Patent: July 23, 2013Assignee: Panasonic CorporationInventors: Toshitaka Sato, Yuuki Kasai, Hideki Fujimura
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Patent number: 8484329Abstract: A device management system has lighting device controlling units and measurement management units, each of which is disposed in each sub area. In addition, the lighting device controlling units and the measurement management units are configured to communicate with an area unit which is disposed in each sub area. The area unit is configured to communicate with the lighting device controlling units and the measurement management units via a communication packet. The area unit further has a router which is configured to prevent the communication packet from leaking to the communication network having an upper management device in the high hierarchy level. The area unit is configured to communicate with the upper management device through the router.Type: GrantFiled: August 6, 2008Date of Patent: July 9, 2013Assignee: Panasonic CorporationInventors: Toshitaka Sato, Hideki Fujimura, Masayuki Amano, Yuuki Kasai
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Publication number: 20120004739Abstract: A device management system has lighting device controlling units and measurement management units, each of which is disposed in each sub area. In addition, the lighting device controlling units and the measurement management units are configured to communicate with an area unit which is disposed in each sub area. The area unit is configured to communicate with the lighting device controlling units and the measurement management units via a communication packet. The area unit further has a router which is configured to prevent the communication packet from leaking to the communication network having an upper management device in the high hierarchy level. The area unit is configured to communicate with the upper management device through the router.Type: ApplicationFiled: August 6, 2008Publication date: January 5, 2012Inventors: Toshitaka Sato, Hideki Fujimura, Masayuki Amano, Yuuki Kasai
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Patent number: 8069074Abstract: An information processing terminal for supporting quality improvement concerning product manufacture includes a workflow arrangement part acquiring row information indicating a first arrangement location of each of a plurality of workflows being arranged in an area for arranging the plurality of workflows for verifying the quality improvement, and displaying the plurality of workflows based on the row information; a process component arrangement part acquiring matrix information indicating a second arrangement location of each of a plurality of process components being arranged in each of the plurality of workflows, and displaying the plurality of process components based on the matrix information; and a data association part performing a data association among the plurality of process components in accordance with data link lines within each of the plurality of workflows or the data link lines crossing from one workflow to another workflow with respect to the plurality of process components arranged and dispType: GrantFiled: December 14, 2006Date of Patent: November 29, 2011Assignee: Fujitsu Semiconductor LimitedInventors: Tsuyoshi Toyofuku, Tsunehiro Kosaka, Hideki Fujimura
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Publication number: 20110047259Abstract: When the alternate unit detects the failure of the area unit, the alternate unit obtains the program corresponding to the program type of the area unit having the failure. The alternate unit sets the IP address of the area unit, and obtains the setting information from the management unit belonging to the area same as the area including the area unit having the failure. Then, the alternate unit collects the data from the units which previously communicate with the area unit having a failure and previously communicating with the area unit. The alternate unit performs the initialization and starts the management of the unit. Consequently, it is possible to continuously manage the sub unit being previously managed by the main unit, now having a failure, without stopping the management of the sub unit, even if the main unit is failed.Type: ApplicationFiled: April 24, 2009Publication date: February 24, 2011Inventors: Toshitaka Sato, Yuuki Kasai, Hideki Fujimura
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Publication number: 20070192153Abstract: An information processing terminal for supporting quality improvement concerning product manufacture includes a workflow arrangement part acquiring row information indicating a first arrangement location of each of a plurality of workflows being arranged in an area for arranging the plurality of workflows for verifying the quality improvement, and displaying the plurality of workflows based on the row information; a process component arrangement part acquiring matrix information indicating a second arrangement location of each of a plurality of process components being arranged in each of the plurality of workflows, and displaying the plurality of process components based on the matrix information; and a data association part performing a data association among the plurality of process components in accordance with data link lines within each of the plurality of workflows or the data link lines crossing from one workflow to another workflow with respect to the plurality of process components arranged and dispType: ApplicationFiled: December 14, 2006Publication date: August 16, 2007Inventors: Tsuyoshi Toyofuku, Tsunehiro Kosaka, Hideki Fujimura
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Patent number: 7232597Abstract: A corrugated polyamide tube composed of a corrugated outer tube layer of polyamide resin and a flat inner tube layer fixed to the outer tube layer at bottom portions thereof, in which the inner tube layer is made essentially of a polyetheramide elastomer.Type: GrantFiled: May 26, 2004Date of Patent: June 19, 2007Assignee: Ube Industries, Ltd.Inventors: Yoshiro Iwata, Hideki Fujimura
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Patent number: 7056975Abstract: A thermoplastic resin composition composed of a thermoplastic resin and a polyamide elastomer in which the polyamide elastomer contains at least 50 weight % of a polyetheramide elastomer prepared by polymerization of a tri-block polyetherdiamine compound, a polyamide-forming monomer is an aminocarboxylic acid and/or a lactam compound, and a dicarboxylic acid compound, in which the tri-block polyetherdiamine compound has the formula (1): [each of x and y is an integer of 1 to 20, and y is an integer of 4 to 50].Type: GrantFiled: May 26, 2004Date of Patent: June 6, 2006Assignee: Ube Industries, Ltd.Inventors: Hideki Fujimura, Toshio Moriyama, Shinya Matsuda
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Publication number: 20040241368Abstract: A corrugated polyamide tube composed of a corrugated outer tube layer of polyamide resin and a flat inner tube layer fixed to the outer tube layer at bottom portions thereof, in which the inner tube layer is made essentially of a polyetheramide elastomer.Type: ApplicationFiled: May 26, 2004Publication date: December 2, 2004Applicant: Ube Industries, Ltd.Inventors: Yoshiro Iwata, Hideki Fujimura
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Publication number: 20040242774Abstract: A thermoplastic resin composition composed of a thermoplastic resin and a polyamide elastomer in which the polyamide elastomer contains at least 50 weight % of a polyetheramide elastomer prepared by polymerization of a tri-block polyetherdiamine compound, a polyamide-forming monomer is an aminocarboxylic acid and/or a lactam compound, and a dicarboxylic acid compound, in which the tri-block polyetherdiamine compound has the formula (1): 1Type: ApplicationFiled: May 26, 2004Publication date: December 2, 2004Applicant: Ube Industries, Ltd.Inventors: Hideki Fujimura, Toshio Moriyama, Shinya Matsuda
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Publication number: 20040206412Abstract: A nylon resin multi-layer pipe, excellent in adhesivity to a nylon resin joint, includes at least (A) a layer containing a copolymerized nylon and (B) a layer containing a nylon resin other than the copolymerized nylon of the layer (A). The surface in contact with the joint is the layer (A) containing a copolymerized nylon. An adhesion method is provided for adhering a nylon resin joint to the aforementioned nylon resin multi-layer pipe using a solvent adhesive.Type: ApplicationFiled: March 4, 2004Publication date: October 21, 2004Applicants: UBE Industries, Ltd., Osaka Gas Co., Ltd.Inventors: Noriyuki Isobe, Hideki Fujimura, Shinya Matsuda, Yuji Higuchi
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Publication number: 20040171764Abstract: A joint to be adhered to nylon resin moldings includes a copolymerized nylon or a composition comprising a copolymerized nylon or a copolymerized nylon blend and at least one of a nucleating agent and a lubricant. A method for adhering nylon resin moldings includes, adhering nylon resin moldings to the joint using a solvent adhesive. The joint and the solvent adhesive enable formation of an effective adhesive layer.Type: ApplicationFiled: December 22, 2003Publication date: September 2, 2004Applicants: Ube Industries, Ltd., Osaka Gas Co., Ltd.Inventors: Noriyuki Isobe, Hideki Fujimura, Shinya Matsuda, Yuji Higuchi
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Publication number: 20040135371Abstract: A fuel pipe joint having excellent fuel permeation resistance, particularly a fuel pipe joint for use in automobiles, which can greatly reduce the amount of fuel permeated through the wall and exhibits excellent rigidity and fuel barrier property even at high temperatures, the fuel pipe joint using a joint material comprising a polyamide (nylon 9T) consisting of a dicarboxylic acid component and a diamine component, with 60 to 100 mol % of the dicarboxylic acid component being a terephthalic acid and 60 to 100 mol % of the diamine component being a diamine component selected from 1,9-nonanediamine and 2-methyl-1,8-octanediamine. The joint material preferably further comprises a reinforcement and/or an electrically conducting filler. The electrically conducting filler preferably has an aspect ratio of 50 or more and a short diameter of 0.5 nm to 10 &mgr;m.Type: ApplicationFiled: October 14, 2003Publication date: July 15, 2004Applicants: Kuraray Co., Ltd., a Japanese corporation, Ube Industries, Ltd., a Japanese corporationInventors: Haruhisa Masuda, Yuji Munesawa, Koichi Warino, Noriyuki Isobe, Hideki Fujimura, Yoshiro Iwata, Koji Nakamura, Kozo Tamura
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Publication number: 20030131936Abstract: A nylon resin multi-layer pipe excellent in adhesivity to a nylon resin joint including at least (A) a layer containing a copolymerized nylon and (B) a layer containing a nylon resin other than the copolymerized nylon of the layer (A) wherein the surface in contact with the joint is the layer (A) containing a copolymerized nylon and an adhesion method for adhering a nylon resin joint to the aforementioned nylon resin multi-layer pipe using a solvent adhesive are described.Type: ApplicationFiled: January 8, 2003Publication date: July 17, 2003Applicant: UBE Industries, Ltd.Inventors: Noriyuki Isobe, Hideki Fujimura, Shinya Matsuda