Patents by Inventor Hideki FURUZAWA

Hideki FURUZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11505137
    Abstract: A sound-absorbing member has a Helmholtz resonance structure including an inlet passage and a hollow portion connected to the outside through the inlet passage, wherein the sound-absorbing member includes a first layer and a second layer disposed on the first layer, the first layer includes a first main surface and a second main surface opposite to the first main surface, the second layer includes a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, the first layer includes a first through-hole penetrating through the second main surface from the first main surface and defining the inlet passage, the second main surface includes a second main surface opening defining an end portion of the first through-hole and a second main surface flat portion, the third main surface includes a third main surface opening defining an end portion of the hollow portion and a third main surface flat portion, the second main surface opening has an opening area smaller
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 22, 2022
    Assignee: IBIDEN CO., LTD.
    Inventors: Hideki Furuzawa, Hiroshi Sakaguchi, Tomohiro Nishikawa, Toshihiro Nomura
  • Publication number: 20200139902
    Abstract: A sound-absorbing member has a Helmholtz resonance structure including an inlet passage and a hollow portion connected to the outside through the inlet passage, wherein the sound-absorbing member includes a first layer and a second layer disposed on the first layer, the first layer includes a first main surface and a second main surface opposite to the first main surface, the second layer includes a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, the first layer includes a first through-hole penetrating through the second main surface from the first main surface and defining the inlet passage, the second main surface includes a second main surface opening defining an end portion of the first through-hole and a second main surface flat portion, the third main surface includes a third main surface opening defining an end portion of the hollow portion and a third main surface flat portion, the second main surface opening has an opening area smaller
    Type: Application
    Filed: January 8, 2020
    Publication date: May 7, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Hideki FURUZAWA, Hiroshi SAKAGUCHI, Tomohiro NISHIKAWA, Toshihiro NOMURA
  • Patent number: 9200391
    Abstract: A mat includes a first principal face, a second principal face opposite to the first principal face, entangled points, and unentangled portions. The entangled points are provided by entangling inorganic fibers with one another. The unentangled portions are provided from the first principal face to the second principal face. The inorganic fibers are not entangled with one another and are arranged substantially parallel to one another in said unentangled portions.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: December 1, 2015
    Assignee: IBIDEN CO., LTD.
    Inventor: Hideki Furuzawa
  • Publication number: 20110239602
    Abstract: A mat includes a first principal face, a second principal face opposite to the first principal face, entangled points, and unentangled portions. The entangled points are provided by entangling inorganic fibers with one another. The unentangled portions are provided from the first principal face to the second principal face. The inorganic fibers are not entangled with one another and are arranged substantially parallel to one another in said unentangled portions.
    Type: Application
    Filed: March 31, 2011
    Publication date: October 6, 2011
    Applicant: IBIDEN CO., LTD.
    Inventor: Hideki FURUZAWA