Patents by Inventor Hideki Hamagaki

Hideki Hamagaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7994483
    Abstract: To attain objects to reduce the spread of electrons as compared with a conventional one without degrading the multiplication factor of electrons; to provide a large electron multiplication factor; and to improve positional resolution, there is provided a gas electron multiplier using interaction between radiation and gas through photoelectric effects including: a chamber filled with gas and a single gas electron multiplication foil arranged in the chamber wherein the gas electron multiplication foil is made of a plate-like multilayer body composed by having a plate-like insulation layer made of a macromolecular polymer material having a thickness of around 100 ?m to 300 ?m and flat metal layers overlaid on both surfaces of the insulation layer, and the plate-like multilayer body is provided with a through-hole structure.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: August 9, 2011
    Assignees: Riken, The University of Tokyo, Scienergy Co., Ltd.
    Inventors: Toru Tamagawa, Satoshi Koshimuta, Hideki Hamagaki
  • Publication number: 20090084972
    Abstract: To attain objects to reduce the spread of electrons as compared with a conventional one without degrading the multiplication factor of electrons; to provide a large electron multiplication factor; and to improve positional resolution, there is provided a gas electron multiplier using interaction between radiation and gas through photoelectric effects including: a chamber filled with gas and a single gas electron multiplication foil arranged in the chamber wherein the gas electron multiplication foil is made of a plate-like multilayer body composed by having a plate-like insulation layer made of a macromolecular polymer material having a thickness of around 100 ?m to 300 ?m and flat metal layers overlaid on both surfaces of the insulation layer, and the plate-like multilayer body is provided with a through-hole structure.
    Type: Application
    Filed: March 1, 2007
    Publication date: April 2, 2009
    Applicants: RIKEN, THE UNIVERSITY OF TOKYO, SCIENERGY Co., LTD,
    Inventors: Toru Tamagawa, Satoshi Koshimuta, Hideki Hamagaki