Patents by Inventor Hideki Kabayama

Hideki Kabayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit device with EMI prevention structure
    Patent number: 6803655
    Abstract: A power lead and a ground lead are connected to corresponding pads of a die through an intra-package wiring substrate. A ground plane is formed in a mold under the intra-package wiring substrate extending along the bottom surface of the mold, and connected to the ground lead. A decoupling capacitor is connected to power wiring and the ground plane to prevent EMI caused by switching noise current generated by the power circuit of the die.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: October 12, 2004
    Assignee: International Business Machines Corporation
    Inventors: Shohhei Fujio, Hideki Kabayama
  • Semiconductor integrated circuit device with EMI prevention structure
    Publication number: 20020020915
    Abstract: A power lead and a ground lead are connected to corresponding pads of a die through an intra-package wiring substrate. A ground plane is formed in a mold under the intra-package wiring substrate extending along the bottom surface of the mold, and connected to the ground lead. A decoupling capacitor is connected to power wiring and the ground plane to prevent EMI caused by switching noise current generated by the power circuit of the die.
    Type: Application
    Filed: July 25, 2001
    Publication date: February 21, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shohhei Fujio, Hideki Kabayama