Abstract: A switch element includes a first wiring line that is provided in a first insulating film and extends in a first direction; a second wiring line that is provided in a second insulating film and extends in a second direction that intersects the first direction; an ion conductive layer sandwiched between the first wiring line and the second wiring line and directly in contact with the second wiring line in an intersection region where the first wiring line and the second wiring line intersect, and enabled to conduct metal ions supplied from the second wiring line; and a metal oxide film sandwiched between the first wiring line and the ion conductive layer.

Abstract: A switch element includes a first wiring line that is provided in a first insulating film and extends in a first direction; a second wiring line that is provided in a second insulating film and extends in a second direction that intersects the first direction; an ion conductive layer sandwiched between the first wiring line and the second wiring line and directly in contact with the second wiring line in an intersection region where the first wiring line and the second wiring line intersect, and enabled to conduct metal ions supplied from the second wiring line; and a metal oxide film sandwiched between the first wiring line and the ion conductive layer.

Abstract: An air spring includes an outer cylindrical member, an inner cylindrical member combined with the outer cylindrical member, a diaphragm coupling the outer cylindrical member and the inner cylindrical member to each other, the diaphragm providing an internal space between the outer cylindrical member and the inner cylindrical member, a first element located on a side of the internal space in at least one of the outer cylindrical member and the inner cylindrical member and defining a part of the internal space, a second element adjacent to the first element, the second element defining a part of the internal space, and a cover layer covering a boundary portion between the first element and the second element.

Abstract: An air spring includes an outer cylindrical member, an inner cylindrical member, a diaphragm, the diaphragm providing an internal space between the outer cylindrical member and the inner cylindrical member, a stopper assembly arranged in the internal space as being pivotable over the inner cylindrical member, a handle for pivoting the stopper assembly over the inner cylindrical member, a guide member attached to the handle as rising from the handle, a positioning member attached by insertion in a guide hole in the guide member for positioning of the handle, a positioning hole provided in the inner cylindrical member which can receive the positioning member, and a holding mechanism in the inner cylindrical member. A position of the stopper assembly with respect to the inner cylindrical member is determined by inserting the positioning member in the positioning hole.

Abstract: An air spring according to the present disclosure includes: an inner cylindrical member; an outer cylindrical member provided on the inner cylindrical member; a diaphragm coupled with the outer cylindrical member and the inner cylindrical member; and a stopper provided rotatably with respect to a circumferential direction of the inner cylindrical member. The stopper has a raised portion raised towards the outer cylindrical member and moving on the inner cylindrical member in the circumferential direction. The outer cylindrical member has a plurality of raised portions raised toward the inner cylindrical member. The plurality of raised portions of the outer cylindrical member are different in height. At least one of the outer cylindrical member's raised portion and the stopper's raised portion is restorable against circumferential deformation.

Abstract: An air spring includes an outer cylindrical member, an inner cylindrical member combined with the outer cylindrical member, a diaphragm coupling the outer cylindrical member and the inner cylindrical member to each other, the diaphragm providing an internal space between the outer cylindrical member and the inner cylindrical member, a stopper assembly arranged in the internal space as being pivotable over the inner cylindrical member, the stopper assembly allowing suppression of movement of the outer cylindrical member toward the inner cylindrical member more than necessary, a pivoting mechanism pivoting the stopper assembly over the inner cylindrical member, and a space portion provided between the stopper assembly and the inner cylindrical member, the space portion allowing lowering in resistance in pivot of the stopper assembly.

Abstract: An air spring includes: an outer cylindrical member; an inner cylindrical member; a diaphragm which couples the outer and inner cylindrical members and forms an internal space; a stopper assembly disposed in the internal space; and a pivoting mechanism which causes this stopper assembly to pivot on the inner cylindrical member. The stopper assembly has a stopper portion protruding towards the outer cylindrical member, and the outer cylindrical member has as a set four or more protrusion portions provided at a position to face the stopper portion and protruding toward the inner cylindrical member. Each of the protrusion portions belonging to the set is disposed successively and also different in height. Each of the protrusion portions belonging to the set is arranged without having a protrusion portion belonging to the set smallest in height adjacent to a protrusion portion belonging to the set largest in height.

Abstract: An electronic apparatus includes a first circuit board, a stacked circuit that is provided on the first circuit board through first coupling terminals and has a structure in which arithmetic elements and memory elements are stacked through inter-element coupling terminals and to which a signal is inputted from the first circuit board, and a second circuit board that is provided on the stacked circuit through second coupling terminals and to which a result of processing is outputted from the stacked circuit, wherein a number of the first coupling terminals and a number of the second coupling terminals are smaller than that of the inter-element coupling terminals.

Abstract: An electronic device includes: a polymer film that is to melt at a predetermined temperature higher than a body temperature; at least one electronic component provided in the polymer film; and a first hydrophobic film provided on an opposite surface of the polymer film to a side of the polymer film to be attached to skin.

Abstract: An electronic device includes: a substrate that includes a first penetration hole; a first electrode that is located on a first surface of the substrate so as to cover the first penetration hole; and a first penetrating electrode that is located in the first penetration hole and is in contact with or away from the first electrode depending on temperature.

Abstract: An air spring includes an outer cylindrical member, an inner cylindrical member, a diaphragm, the diaphragm providing an internal space between the outer cylindrical member and the inner cylindrical member, a stopper assembly arranged in the internal space as being pivotable over the inner cylindrical member, a handle for pivoting the stopper assembly over the inner cylindrical member, a guide member attached to the handle as rising from the handle, a positioning member attached by insertion in a guide hole in the guide member for positioning of the handle, a positioning hole provided in the inner cylindrical member which can receive the positioning member, and a holding mechanism in the inner cylindrical member. A position of the stopper assembly with respect to the inner cylindrical member is determined by inserting the positioning member in the positioning hole.

Abstract: An air spring includes an outer cylindrical member, an inner cylindrical member combined with the outer cylindrical member, a diaphragm coupling the outer cylindrical member and the inner cylindrical member to each other, the diaphragm providing an internal space between the outer cylindrical member and the inner cylindrical member, a first element located on a side of the internal space in at least one of the outer cylindrical member and the inner cylindrical member and defining a part of the internal space, a second element adjacent to the first element, the second element defining a part of the internal space, and a cover layer covering a boundary portion between the first element and the second element.

Abstract: An air spring includes an outer cylindrical member, an inner cylindrical member combined with the outer cylindrical member, a diaphragm coupling the outer cylindrical member and the inner cylindrical member to each other, the diaphragm providing an internal space between the outer cylindrical member and the inner cylindrical member, a stopper assembly arranged in the internal space as being pivotable over the inner cylindrical member, the stopper assembly allowing suppression of movement of the outer cylindrical member toward the inner cylindrical member more than necessary, a pivoting mechanism pivoting the stopper assembly over the inner cylindrical member, and a space portion provided between the stopper assembly and the inner cylindrical member, the space portion allowing lowering in resistance in pivot of the stopper assembly.

Abstract: An air spring according to the present disclosure includes: an inner cylindrical member; an outer cylindrical member provided on the inner cylindrical member; a diaphragm coupled with the outer cylindrical member and the inner cylindrical member; and a stopper provided rotatably with respect to a circumferential direction of the inner cylindrical member. The stopper has a raised portion raised towards the outer cylindrical member and moving on the inner cylindrical member in the circumferential direction. The outer cylindrical member has a plurality of raised portions raised toward the inner cylindrical member. The plurality of raised portions of the outer cylindrical member are different in height. At least one of the outer cylindrical member's raised portion and the stopper's raised portion is restorable against circumferential deformation.

Abstract: An air spring includes: an outer cylindrical member; an inner cylindrical member; a diaphragm which couples the outer and inner cylindrical members and forms an internal space; a stopper assembly disposed in the internal space; and a pivoting mechanism which causes this stopper assembly to pivot on the inner cylindrical member. The stopper assembly has a stopper portion protruding towards the outer cylindrical member, and the outer cylindrical member has as a set four or more protrusion portions provided at a position to face the stopper portion and protruding toward the inner cylindrical member. Each of the protrusion portions belonging to the set is disposed successively and also different in height. Each of the protrusion portions belonging to the set is arranged without having a protrusion portion belonging to the set smallest in height adjacent to a protrusion portion belonging to the set largest in height.

Abstract: An electronic apparatus includes a first circuit board, a stacked circuit that is provided on the first circuit board through first coupling terminals and has a structure in which arithmetic elements and memory elements are stacked through inter-element coupling terminals and to which a signal is inputted from the first circuit board, and a second circuit board that is provided on the stacked circuit through second coupling terminals and to which a result of processing is outputted from the stacked circuit, wherein a number of the first coupling terminals and a number of the second coupling terminals are smaller than that of the inter-element coupling terminals.

Abstract: A semiconductor device includes: a semiconductor substrate; a wiring layer provided on a front-surface side of the semiconductor substrate; a through-via that penetrates through the semiconductor substrate from a back-surface side of the semiconductor substrate and is coupled to a wire included in the wiring layer; and a stress relaxation part that protrudes toward a through-via side and is disposed on a section in the wire and coupled to the through-via, the stress relaxation part including at least one insulating portion containing an insulating material having a smaller thermal expansion coefficient than a material of the through-via.

Abstract: A semiconductor device includes: a semiconductor substrate; a through silicon via which penetrates the semiconductor substrate; an insulating film which is provided between a side surface of the through silicon via and the semiconductor substrate; and a MOS transistor which is provided on the semiconductor substrate, wherein: the semiconductor substrate has a first crystal axis and a second crystal axis, and a propagation amount of stress occurring from the through silicon via is larger in a direction of the first crystal axis than in a direction of the second crystal axis; and the insulating film has a thickness in a direction of a diameter of the through silicon via being a thickness along the direction of the first crystal axis larger than a thickness along the direction of the second crystal axis.

Abstract: An electronic device includes: a substrate that includes a first penetration hole; a first electrode that is located on a first surface of the substrate so as to cover the first penetration hole; and a first penetrating electrode that is located in the first penetration hole and is in contact with or away from the first electrode depending on temperature.

Abstract: A semiconductor device includes a via and first and second transistors of the same channel type which are formed in a semiconductor substrate. The first and second transistors are located in a first lateral direction of the via and have their channel direction that matches the first lateral direction. A first stress relaxation region is formed in the semiconductor substrate between the via and the first transistor which is located closer to the via than the second transistor is. A second stress relaxation region smaller than the first stress relaxation region is formed in the semiconductor substrate between the first transistor and the second transistor which is located farther from the via than the first transistor is.