Patents by Inventor Hideki Kono
Hideki Kono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11939450Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.Type: GrantFiled: January 14, 2022Date of Patent: March 26, 2024Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi Mukae, Hirokazu Komori, Masaji Komori, Hideki Kono, Ayane Nakaue
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Patent number: 11739206Abstract: A resin composition and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.Type: GrantFiled: August 23, 2019Date of Patent: August 29, 2023Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi Mukae, Hideki Kono, Masaji Komori, Hiroshi Ito
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Publication number: 20230260672Abstract: An insulated wire including a conductor (A) and an insulating layer (B) around the conductor (A). The insulating layer (B) contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II) and has a melt viscosity at 60 sec?1 and 390° C. of 0.40 to 0.75 kPa·s. The aromatic polyetherketone resin (I) has a melt viscosity at 60 sec?1 and 390° C. of 0.30 kPa·s or lower. The insulating layer (B) has a thickness of 30 to 300 ?m.Type: ApplicationFiled: March 28, 2023Publication date: August 17, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Takuma MARUHASHI, Koji NAKANISHI, Toyomitsu SEKI, Hideki KONO
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Publication number: 20230242771Abstract: A composition for three-dimensional printing which contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The composition satisfies a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238. Also disclosed is a three-dimensionally printed article obtained by three-dimensional printing of the composition for three-dimensional printing.Type: ApplicationFiled: March 28, 2023Publication date: August 3, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Koji NAKANISHI, Toyomitsu SEKI, Takuma MARUHASHI, Hideki KONO
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Publication number: 20230235182Abstract: A powder composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The powder composition has a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Koji NAKANISHI, Toyomitsu SEKI, Takuma MARUHASHI, Noriko IMADA, Hideki KONO
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FILM, WRAPPING ELECTRIC WIRE COATING MATERIAL, FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, AND LAMINATE
Publication number: 20230174780Abstract: A film containing a resin composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The fluorine-containing copolymer (II) defines a dispersed phase at an average dispersed particle size of 5 µm or smaller. The aromatic polyetherketone resin (I) has a crystallinity of lower than 6%.Type: ApplicationFiled: February 6, 2023Publication date: June 8, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Toyomitsu SEKI, Takuma MARUHASHI, Koji NAKANISHI, Hideki KONO -
Publication number: 20230016062Abstract: A resin composition containing: a melt-fabricable fluororesin containing at least one functional group selected from a carbonyl group-containing group and a hydroxy group; at least one fluorine-free resin selected from a liquid crystal polymer, a polyarylene sulfide, and an aromatic polyether ketone; and particulate boron nitride, wherein the particulate boron nitride is contained in an amount of 30 to 65% by volume.Type: ApplicationFiled: September 9, 2022Publication date: January 19, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi MUKAE, Hideki KONO, Masaji KOMORI, Ayane NAKAUE, Hiroshi ITO
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Patent number: 11472953Abstract: A resin composition containing a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1. Also disclosed is a molded article containing the resin composition.Type: GrantFiled: April 11, 2018Date of Patent: October 18, 2022Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Shuhei Yamaguchi, Ayane Nakaue, Masaji Komori, Hideki Kono
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Patent number: 11332614Abstract: The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280° C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300° C., and has a 5% weight loss temperature of 470° C.Type: GrantFiled: June 25, 2018Date of Patent: May 17, 2022Assignees: TEIJIN LIMITED, DAIKIN INDUSTRIES, LTD.Inventors: Shunsuke Okuzawa, Toshiyuki Miyake, Koji Nakanishi, Masaji Komori, Hideki Kono
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Publication number: 20220135767Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.Type: ApplicationFiled: January 14, 2022Publication date: May 5, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi MUKAE, Hirokazu KOMORI, Masaji KOMORI, Hideki KONO, Ayane NAKAUE
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Patent number: 11261324Abstract: A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Also disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 ?m.Type: GrantFiled: June 25, 2018Date of Patent: March 1, 2022Assignees: DAIKIN INDUSTRIES, LTD., TEIJIN LIMITEDInventors: Koji Nakanishi, Masaji Komori, Hideki Kono, Shunsuke Okuzawa, Toshiyuki Miyake
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Publication number: 20220010131Abstract: A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.Type: ApplicationFiled: September 23, 2021Publication date: January 13, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Koji NAKANISHI, Toyomitsu SEKI, Hideki KONO
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Publication number: 20210332229Abstract: Provided are a resin composition having excellent heat dissipation properties as well as excellent moldability, and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.Type: ApplicationFiled: August 23, 2019Publication date: October 28, 2021Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi MUKAE, Hideki KONO, Masaji KOMORI, Hiroshi ITO
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Publication number: 20210253841Abstract: Provided are a fluororesin-containing composition having significantly improved fluidity and a method for producing the same. The fluororesin-containing composition contains 99.99 to 97% by mass of a fluororesin having a melting point of 205° C. to 225° C. and 0.01 to 2% by mass of a thermotropic liquid crystal polymer. The method for producing the fluororesin-containing composition includes kneading polychlorotrifluoroethylene and a thermotropic liquid crystal polymer at 285° C. to 320° C.Type: ApplicationFiled: June 24, 2019Publication date: August 19, 2021Applicants: TSINGHUA UNIVERSITY, DAIKIN INDUSTRIES, LTD.Inventors: Xuming XIE, Masaji KOMORI, Hideki KONO
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Publication number: 20210206970Abstract: A resin composition containing a polyarylene sulfide (a); a fluorine-containing copolymer (b); and a reactive functional group-containing compound (c), the polyarylene sulfide (a) and the fluorine-containing copolymer (b) giving a mass ratio (a):(b) of 99:1 to 40:60, the compound (c) being present in an amount of 0.1 to 35 parts by mass relative to 100 parts by mass of a total of the polyarylene sulfide (a) and the fluorine-containing copolymer (b), the resin composition having a tensile elongation at break in accordance with ASTM D 638 of 15% or more.Type: ApplicationFiled: May 23, 2019Publication date: July 8, 2021Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yoshihiro SAIGUSA, Hirofumi MUKAE, Kanako ARAI, Yuimi ISHIHARA, Haruna MATSUMOTO, Hideki KONO
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Patent number: 11021582Abstract: The present invention aims to provide a method for producing a modified molded article that has favorable appearance, high breaking strength, and excellent abrasion resistance, as well as excellently low permeability to nitrogen gas and hydrochloric acid. The method for producing a modified molded article of the present invention includes molding a fluororesin to provide a molded article and irradiating the molded article with radiation at an irradiation dose of lower than 100 kGy at 50° C. to 200° C. to provide a modified molded article.Type: GrantFiled: May 21, 2018Date of Patent: June 1, 2021Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Hitoshi Imamura, Tatsuya Funaoka, Hideki Kono
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Patent number: 10731015Abstract: The present invention aims to provide a modified fluorine-containing copolymer excellent in crack resistance, a fluororesin molded article, and a method of producing a fluororesin molded article. The present invention includes a modified fluorine-containing copolymer consisting only of tetrafluoroethylene units and perfluoro(alkyl vinyl ether) units. The copolymer is modified by irradiation with radiation at an irradiation temperature not higher than the melting point of the copolymer but not lower than 200° C.Type: GrantFiled: July 4, 2013Date of Patent: August 4, 2020Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Kyouhei Sawaki, Hideki Kono, Hitoshi Imamura, Takahisa Aoyama, Masamichi Sukegawa
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Publication number: 20200140682Abstract: The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280° C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300° C., and has a 5% weight loss temperature of 470° C.Type: ApplicationFiled: June 25, 2018Publication date: May 7, 2020Applicants: TEIJIN LIMITED, Daikin Industries, Ltd.Inventors: Shunsuke OKUZAWA, Toshiyuki MIYAKE, Koji NAKANISHI, Masaji KOMORI, Hideki KONO
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Publication number: 20200123368Abstract: A resin composition containing a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1. Also disclosed is a molded article containing the resin composition.Type: ApplicationFiled: April 11, 2018Publication date: April 23, 2020Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Shuhei YAMAGUCHI, Ayane NAKAUE, Masaji KOMORI, Hideki KONO
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Publication number: 20200123377Abstract: A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Aso disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 ?m.Type: ApplicationFiled: June 25, 2018Publication date: April 23, 2020Applicants: DAIKIN INDUSTRIES, LTD, TEIJIN LIMITEDInventors: Koji NAKANISHI, Masaji KOMORI, Hideki KONO, Shunsuke OKUZAWA, Toshiyuki MIYAKE