Patents by Inventor Hideki Matsuura

Hideki Matsuura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230409850
    Abstract: An information processing apparatus, a reading system, an information processing method, and a program capable of manage carrying-in or carrying-out of articles more reliably are provided. An information processing apparatus (1) includes a flow line specification unit (2) that specifies a flow line of a movement of an object in a predetermined area near a gate, an RSSI acquisition unit (3) that acquires an RSSI of a signal transmitted from an RFID tag located near the gate, and a passage determination unit (4) that determines whether or not an article specified by identification information read from the RFID tag has passed through the gate based on the specified flow line and the acquired RSSI.
    Type: Application
    Filed: August 31, 2021
    Publication date: December 21, 2023
    Applicant: NEC Platforms, Ltd.
    Inventor: Hideki MATSUURA
  • Patent number: 11797791
    Abstract: Provided is a reading apparatus capable of efficiently reading information from an RFID tag. A reading apparatus (1) includes at least one antenna (2) and a casing (10). The casing (10) has reflective surfaces (12) in at least a part of the inner side. The antenna (2) is provided in the casing (10), and is used to read information from an RFID tag. The antenna (2) is disposed in the vicinity of reflective surfaces (12A) and (12B) having two or more normal lines (N1) and (N2) at different angles, and radiates electromagnetic waves toward at least a direction that is not parallel to the directions of the normal lines (N1) and (N2).
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: October 24, 2023
    Assignee: NEC Platforms, Ltd.
    Inventors: Hideki Matsuura, Yuta Imai
  • Publication number: 20220327880
    Abstract: The present disclosure provides an information processing apparatus, a reading system, an information processing method, and a program that are capable of appropriately managing the carrying-in or the carrying-out of an article. An information processing apparatus (1) includes a flow line specification unit (2) that specifies a flow line of a movement of an object in a predetermined first area of a gate on an entrance side of the gate, and a reading control unit (3) that performs control so that reading processing of an RFID tag near the gate is started when the specified flow line corresponds to a predetermined pattern.
    Type: Application
    Filed: August 3, 2020
    Publication date: October 13, 2022
    Applicant: NEC Platforms, Ltd.
    Inventor: Hideki MATSUURA
  • Publication number: 20220292443
    Abstract: A product management system includes a plurality of first antennas arranged in a shelf board of a display shelf in an orderly manner and configured to receive a radio wave from an RFID tag attached to a product displayed on the display shelf, a tag location unit that locates a product based on a position of each of the first antennas and a receiving state of a radio wave transmitted from the same RFID tag at each of the first antennas, a product determination unit that determines, based on information for specifying an expiration date of the product transmitted from the RFID tag by the radio wave, whether or not a remaining period from a present time to the expiration date satisfies a predetermined condition, and a display control unit that performs control so as to display a position of the product whose remaining period satisfies the predetermined condition.
    Type: Application
    Filed: July 29, 2020
    Publication date: September 15, 2022
    Applicant: NEC Platforms, Ltd.
    Inventor: Hideki MATSUURA
  • Publication number: 20220269873
    Abstract: Provided is a reading apparatus capable of efficiently reading information from an RFID tag. A reading apparatus (1) includes at least one antenna (2) and a casing (10). The casing (10) has reflective surfaces (12) in at least a part of the inner side. The antenna (2) is provided in the casing (10), and is used to read information from an RFID tag. The antenna (2) is disposed in the vicinity of reflective surfaces (12A) and (12B) having two or more normal lines (N1) and (N2) at different angles, and radiates electromagnetic waves toward at least a direction that is not parallel to the directions of the normal lines (N1) and (N2).
    Type: Application
    Filed: March 17, 2020
    Publication date: August 25, 2022
    Applicant: NEC Platforms Ltd.
    Inventors: Hideki MATSUURA, Yuta IMAI
  • Publication number: 20220146163
    Abstract: There is provided a refrigerant cycle apparatus capable of suppressing, even when a refrigerant containing CF3I is used, corrosion of a component of a refrigerant circuit due to the refrigerant containing CF3I. A refrigerant cycle apparatus includes a refrigerant circuit in which a refrigerant containing CF3I circulates, the refrigerant circuit including a compressor, an expansion valve, an outdoor heat exchanger, and an indoor heat exchanger that are connected to each other. The refrigerant circuit includes a component to be in contact with the refrigerant. At least a surface of the component to be in contact with the refrigerant is formed by a corrosion resistance material that contains at least one or more selected from a metal in which the percentage of zinc is 10 wt % or less, a resin other than nylon 66, and carbon.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 12, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Masaru TANAKA, Hideki MATSUURA, Arisa KAWAE
  • Patent number: 10745824
    Abstract: A film forming apparatus according to an embodiment includes: a film forming chamber configured to house therein a substrate to perform film forming processing; a gas supplier located in an upper part of the film forming chamber and configured to supply a process gas onto the substrate; and a heater configured to heat the substrate, wherein the film forming chamber has a temperature-increase suppression region being a lower part of the gas supplier and suppressing a temperature increase of the gas supplied to an upper part of the heater.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: August 18, 2020
    Assignee: NuFlare Technology, Inc.
    Inventors: Kunihiko Suzuki, Naohisa Ikeya, Masayoshi Yajima, Kazukuni Hara, Hiroaki Fujibayashi, Hideki Matsuura, Katsumi Suzuki
  • Publication number: 20200041173
    Abstract: A refrigeration apparatus includes a compressor, a first heat exchanger, an expansion mechanism, and a second heat exchanger. The compressor compresses low-pressure gas refrigerant and discharges high-pressure gas refrigerant. The first heat exchanger condenses high-pressure gas refrigerant and discharges high-pressure liquid refrigerant during an air-cooling operation, or evaporates low-pressure gas-liquid mixed refrigerant and discharges low-pressure gas refrigerant during an air-heating operation. The expansion mechanism has metal components. High-pressure liquid refrigerant passes through the expansion mechanism, and becomes low-pressure gas-liquid mixed refrigerant. The second heat exchanger evaporates low-pressure gas-liquid mixed refrigerant and discharges low-pressure gas refrigerant during an air-cooling operation, or condenses high-pressure gas refrigerant and discharges high-pressure liquid refrigerant during an air-heating operation. The refrigerant contains at least 60 wt % of R32.
    Type: Application
    Filed: October 9, 2019
    Publication date: February 6, 2020
    Inventors: Masaru Tanaka, Hideki Matsuura, Shigeharu Taira, Akinori NAKAI
  • Publication number: 20180135175
    Abstract: A film forming apparatus according to an embodiment includes: a film forming chamber capable of housing a substrate therein; a gas supplier located in an upper part of the film forming chamber and having a plurality of nozzles supplying gases onto a film forming face of the substrate; a heater configured to heat the substrate; and a first protection cover having a plurality of opening parts at positions corresponding to the nozzles of the gas supplier, respectively.
    Type: Application
    Filed: November 15, 2017
    Publication date: May 17, 2018
    Inventors: Kunihiko SUZUKI, Naohisa IKEYA, Masayoshi YAJIMA, Kazukuni HARA, Hiroaki FUJIBAYASHI, Hideki MATSUURA, Katsumi SUZUKI
  • Publication number: 20180135203
    Abstract: A film forming apparatus according to an embodiment includes: a film forming chamber configured to house therein a substrate to perform film forming processing; a gas supplier located in an upper part of the film forming chamber and configured to supply a process gas onto the substrate; and a heater configured to heat the substrate, wherein the film forming chamber has a temperature-increase suppression region being a lower part of the gas supplier and suppressing a temperature increase of the gas supplied to an upper part of the heater.
    Type: Application
    Filed: November 15, 2017
    Publication date: May 17, 2018
    Inventors: Kunihiko SUZUKI, Naohisa IKEYA, Masayoshi YAJIMA, Kazukuni HARA, Hiroaki FUJIBAYASHI, Hideki MATSUURA, Katsumi SUZUKI
  • Publication number: 20150300698
    Abstract: A refrigeration apparatus includes a compressor, a condenser, an expansion mechanism, and an evaporator. A refrigerant containing R32 and refrigerator oil are used in the refrigeration apparatus. The refrigerator oil is used to lubricate the compressor. An acid scavenger added in an amount of 1.0 wt % to 5.0 wt % is blended in the refrigerator oil. The amount of air mixed into the refrigeration apparatus is controlled to 500 ppm or less relative to the amount of filled refrigerant. The amount of water mixed into the refrigeration apparatus is controlled to 300 ppm or less relative to the amount of filled refrigerant. A discharged-gas temperature of the refrigeration apparatus is controlled to 120° C. or less.
    Type: Application
    Filed: October 31, 2013
    Publication date: October 22, 2015
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Masaru TANAKA, Hideki MATSUURA, Shigeharu TAIRA, Akinori NAKAI
  • Patent number: 8691108
    Abstract: A refrigeration apparatus (20) includes a refrigerant circuit (10) in which refrigerant is circulated by a compressor (30) to perform a refrigeration cycle. The compressor (30) includes a fluid machine (82) for compressing refrigerant; and an electric motor (85) for driving the fluid machine (82). Refrigerant oil having volume resistivity of equal to or greater than 1010 ?·m at 20° C. is used for the compressor (30).
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: April 8, 2014
    Assignee: Daikin Industries, Ltd.
    Inventors: Hideki Matsuura, Masaru Tanaka, Hideki Hara
  • Publication number: 20110011123
    Abstract: In a refrigeration apparatus including a refrigerant circuit in which refrigerant represented by Molecular Formula 1: C3HmFn (note that “m” and “n” are integers equal to or greater than 1 and equal to or less than 5, and a relationship represented by an expression m+n=6 is satisfied) and having a single double bond in a molecular structure, or refrigerant mixture containing the refrigerant is used, predetermined functional resin components arranged so as to contact refrigerant of the refrigerant circuit are made of any of polytetrafluoroethylene, polyphenylene sulfide, phenolic resin, polyamide resin, chloroprene rubber, silicone rubber, hydrogenated nitrile rubber, fluorine-containing rubber, and hydrin rubber.
    Type: Application
    Filed: March 5, 2009
    Publication date: January 20, 2011
    Inventors: Hideki Matsuura, Masaru Tanaka, Hideki Hara, Kouji Shibaike, Youichi Ohnuma
  • Publication number: 20110011124
    Abstract: A refrigeration apparatus (20) includes a refrigerant circuit (10) in which refrigerant is circulated by a compressor (30) to perform a refrigeration cycle. The compressor (30) includes a fluid machine (82) for compressing refrigerant; and an electric motor (85) for driving the fluid machine (82). Refrigerant oil having volume resistivity of equal to or greater than 1010 ?·m at 20° C. is used for the compressor (30).
    Type: Application
    Filed: March 18, 2009
    Publication date: January 20, 2011
    Inventors: Hideki Matsuura, Masaru Tanaka, Hideki Hara
  • Patent number: 7434460
    Abstract: A substrate includes a first surface portion, which covers a heat receiving portion of a radiation member together with a resinous member. The substrate further includes a second surface portion, which is on the outer periphery of the first surface portion. The substrate makes contact with the resinous member via the second surface portion. The first surface portion and the heat receiving portion have a first contact boundary therebetween. The second surface portion and the resinous member have a second contact boundary that surrounds the first contact boundary. The second contact boundary is sealed using a sealing member. The sealing member is restricted from flowing into a boundary between the first contact boundary and the second contact boundary.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: October 14, 2008
    Assignee: Denso Corporation
    Inventors: Hideki Matsuura, Noboru Kitahara, Yasushi Goka
  • Publication number: 20080008224
    Abstract: A substrate includes a first surface portion, which covers a heat receiving portion of a radiation member together with a resinous member. The substrate further includes a second surface portion, which is on the outer periphery of the first surface portion. The substrate makes contact with the resinous member via the second surface portion. The first surface portion and the heat receiving portion have a first contact boundary therebetween. The second surface portion and the resinous member have a second contact boundary that surrounds the first contact boundary. The second contact boundary is sealed using a sealing member. The sealing member is restricted from flowing into a boundary between the first contact boundary and the second contact boundary.
    Type: Application
    Filed: December 28, 2005
    Publication date: January 10, 2008
    Applicant: DENSO CORPORATION
    Inventors: Hideki Matsuura, Noboru Kitahara, Yasushi Goka
  • Patent number: 7234349
    Abstract: A measurement body is provided with a sub-outlet arranged between a U-turn portion of a bypass passage and a main outlet. The sub-outlet includes a first sub-outlet positioned on a path of air, which flows on the inside of the bypass passage, and a second sub-outlet positioned on a path of air, which flows on the outside of the bypass passage. The respective sub-outlets open in a sidewall surface of the measurement body along the thickness-wise direction. However, the first sub-outlet and the second sub-outlet are arranged in different positions with respect to the flow direction of measurement air. With this structure, a substantial length of the bypass passage can be adjusted in accordance with positions of the first sub-outlet and the second sub-outlet, so that compensation of intake pulsation is enhanced in accuracy. Thereby, measurement error caused by influences of intake pulsation can be reduced.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: June 26, 2007
    Assignee: DENSO Corporation
    Inventors: Noboru Kitahara, Hideki Matsuura, Tomomi Taniguchi
  • Patent number: 7228734
    Abstract: A sensing unit is constructed of a heater element and a temperature sensing element. The sensing unit is arranged in a region, in which measurement air, which flows into the inflow passage through the bypass inlet, bends at the substantially right-angle and contracts in flow. Alternatively, the sensing unit is arranged in a region immediately after an area, in which the measurement air flowing through the bypass inlet bends at the substantially right-angle. The lengthwise directions of the heater element and the temperature sensing element are respectively arranged to be in parallel with both thickness-wise side faces of the measurement body. Thereby, even when a flow rate of measurement air changes, an influence due to the change can be restricted from being exerted. Therefore, the maximum flow rate can be measured within the lengthwise range of the heater element from a low flow rate to a high flow rate.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: June 12, 2007
    Assignee: DENSO Corporation
    Inventors: Noboru Kitahara, Hideki Matsuura, Yasushi Goka
  • Patent number: 7230636
    Abstract: A gas is generated from a printing plate by exposure of the printing plate. A gas diffusing suction unit jets air from air jet ports to diffuse the gas generated from the printing plate by irradiation of laser light. The gas diffused by the air is sucked along with the air from a gas suction opening of the gas diffusing suction unit. At this time, a gas suction velocity is set to 1.2 or more times an air jet velocity to suck the gas/air efficiently. The gas/air may be sucked efficiently by setting a volume of suction to 30 or more times a volume of air jet.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: June 12, 2007
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Hiroshi Iwasa, Hideki Matsuura
  • Patent number: 7043978
    Abstract: An airflow meter has a bypass passage disposed in an air passage and a sensing portion disposed in the bypass passage to detect an airflow amount. The bypass passage is provided with a restriction portion to gradually decrease a passage width of the bypass passage in an airflow direction in the bypass passage. The restriction portion includes a first restriction portion and the second restriction portion disposed at an immediately downstream side of a narrowest portion of the first restriction portion. The first restriction portion gradually decreases the passage width in the airflow direction. The second restriction portion increases the passage width than the passage width at the narrowest portion in a stepped manner. The sensing portion is located in a bound in which the restriction portion is disposed.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: May 16, 2006
    Assignee: Denso Corporation
    Inventors: Yasushi Goka, Hideki Matsuura, Noboru Kitahara