Patents by Inventor Hideki Mukuno
Hideki Mukuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9779976Abstract: Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.Type: GrantFiled: April 18, 2014Date of Patent: October 3, 2017Assignee: Hitachi Automotive Systems, Ltd.Inventors: Satoshi Ikeo, Toshifumi Sagawa, Ryosuke Doi, Hiroshi Kikuchi, Hideki Mukuno
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Publication number: 20160126127Abstract: Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.Type: ApplicationFiled: April 18, 2014Publication date: May 5, 2016Inventors: Satoshi IKEO, Toshifumi SAGAWA, Ryosuke DOI, Hiroshi KIKUCHI, Hideki MUKUNO
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Publication number: 20070051777Abstract: This invention provides a soldering method capable of solving soldering defects due to excess molten solder in the case of soldering while applying an inner pressure into a through-hole of a lead component mounting substrate: (a) In a primary soldering step, a lead component mounting substrate is lowered, and the rear surface thereof is put close to or brought into close contact with an upper end opening edge of a nozzle. Simultaneously, the soldering surface of the molten solder supplied to the nozzle is elevated. (b) In a secondary soldering step, the rear surface of the lead component mounting substrate is relatively spaced from the soldering surface of molten solder by lowering the soldering surface. (c) In a lead separating step, the lead component mounting substrate is elevated while tilting the lead component mounting substrate.Type: ApplicationFiled: September 5, 2006Publication date: March 8, 2007Applicants: TAMURA CORPORATION, TAMURA FA SYSTEM CORPORATION, HITACHI, LTD.Inventors: Takahito Yamaguchi, Norio Hasegawa, Toru Kato, Hideki Mukuno, Masahiko Asano
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Patent number: 6774490Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.Type: GrantFiled: March 25, 2003Date of Patent: August 10, 2004Assignee: Hitachi, Ltd.Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
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Patent number: 6761301Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.Type: GrantFiled: March 15, 2002Date of Patent: July 13, 2004Assignees: Hitachi, Ltd., Tamura/FA System Co., Ltd., Hitachi Car Engineering Co., Ltd., Tamura CorporationInventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai
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Publication number: 20030186072Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.Type: ApplicationFiled: March 25, 2003Publication date: October 2, 2003Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
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Patent number: 6555052Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.Type: GrantFiled: March 7, 2001Date of Patent: April 29, 2003Assignee: Hitachi, Ltd.Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
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Patent number: 6541364Abstract: A mask 11 has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions 10a on one surface of an object to be processed 10 to mount thereon conductive particles 13, and the plurality of holes are opposite to the plurality of electrode portions 10a formed on the object to be processed. A table 12 has a plurality of holes 12a for sucking the object to be processed 10 from the other surface of the object to be processed 10, and for sucking the particles 13 through the plurality of holes 11a in the mask 11 so that the particles 13 may be mounted on the electrode portions 10a formed on the object to be processed 10. A hopper 14 contains therein the plurality of conductive particles 13, prevents the plurality of conductive particles 13 from adhering to each other, and has a slit portion 17 for dropping the plurality of conductive particles 13 by the self-weight.Type: GrantFiled: November 9, 2001Date of Patent: April 1, 2003Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Hideki Mukuno, Jun Matsui, Kaoru Uchiyama, Takayuki Itsuji, Kunio Kondo
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Publication number: 20020100791Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.Type: ApplicationFiled: March 15, 2002Publication date: August 1, 2002Applicant: Hitachi, Ltd.Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai
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Patent number: 6412681Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.Type: GrantFiled: December 11, 2000Date of Patent: July 2, 2002Assignees: Hitachi, Ltd., Tamura Fa System Co., Ltd., Hitachi Car Engineering Co., Ltd., Tamura CorporationInventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai
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Publication number: 20020066583Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.Type: ApplicationFiled: March 7, 2001Publication date: June 6, 2002Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
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Publication number: 20020058406Abstract: A mask 11 has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions 10a on one surface of an object to be processed 10 to mount thereon conductive particles 13, and the plurality of holes are opposite to the plurality of electrode portions 10a formed on the object to be processed. A table 12 has a plurality of holes 12a for sucking the object to be processed 10 from the other surface of the object to be processed 10, and for sucking the particles 13 through the plurality of holes 11a in the mask 11 so that the particles 13 may be mounted on the electrode portions 10a formed on the object to be processed 10. A hopper 14 contains therein the plurality of conductive particles 13, prevents the plurality of conductive particles 13 from adhering to each other, and has a slit portion 17 for dropping the plurality of conductive particles 13 by the self-weight.Type: ApplicationFiled: November 9, 2001Publication date: May 16, 2002Inventors: Hideki Mukuno, Jun Matsui, Kaoru Uchiyama, Takayuki Itsuji, Kunio Kondo
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Publication number: 20010015368Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.Type: ApplicationFiled: December 11, 2000Publication date: August 23, 2001Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai