Patents by Inventor Hideki Nakabayashi

Hideki Nakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934120
    Abstract: An image forming apparatus includes a heating rotary member and a pressing rotary member. The pressing rotary member and the heating rotary member form a fixing nip portion and are configured to apply heat and pressure to a toner image carried on a recording medium at the fixing nip portion, thereby fix the toner image onto the recording medium. The image forming apparatus further includes a winding roller configured to wind up a web used to collect toner that is not fixed to the recording medium, a motor configured to rotate the winding roller, a contact member configured to contact an outside surface of the web wound around the winding roller, a variable resistor disposed so as to be able to change a resistance in accordance with a position of the contact member, and a control unit configured to control an amount of rotation of the motor.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: March 19, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hideki Ohta, Takayuki Hata, Junichiro Nakabayashi
  • Patent number: 7690262
    Abstract: A pressure sensor device includes a temperature sensor mounted on a common housing composed of a resin head and a resin pipe both hermetically connected to each other. The pressure sensor device is mounted on, for example, on an intake manifold of an internal combustion engine to measure an amount of air supplied to the engine based on detected pressure and temperature of the air. A pressure sensor is mounted on the resin head, and a temperature sensor element is supported in the resin pipe. A lead wire of the temperature sensor element such as a thermistor is electrically connected to a conductor bar embedded in the resin pipe. The temperature sensor is directly exposed to the air in the intake manifold, and a size of the temperature sensor and the lead wire is made small to make a response speed of the temperature sensor element high.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: April 6, 2010
    Assignee: DENSO CORPORATION
    Inventor: Hideki Nakabayashi
  • Publication number: 20080250862
    Abstract: A pressure sensor device includes a temperature sensor mounted on a common housing composed of a resin head and a resin pipe both hermetically connected to each other. The pressure sensor device is mounted on, for example, on an intake manifold of an internal combustion engine to measure an amount of air supplied to the engine based on detected pressure and temperature of the air. A pressure sensor is mounted on the resin head, and a temperature sensor element is supported in the resin pipe. A lead wire of the temperature sensor element such as a thermistor is electrically connected to a conductor bar embedded in the resin pipe. The temperature sensor is directly exposed to the air in the intake manifold, and a size of the temperature sensor and the lead wire is made small to make a response speed of the temperature sensor element high.
    Type: Application
    Filed: February 29, 2008
    Publication date: October 16, 2008
    Applicant: DENSO CORPORATION
    Inventor: Hideki Nakabayashi
  • Patent number: 7237948
    Abstract: A thermal sensor is pushed into a housing bushing so that a pin of the sensor is locked in an opening of the housing bushing. The thermal sensor is thereby easily fixed within the housing bushing. Further, the thermal sensor does not rotate within the housing bushing.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: July 3, 2007
    Assignee: Denso Corporation
    Inventor: Hideki Nakabayashi
  • Patent number: 7201513
    Abstract: In a temperature sensor for an engine, abutting surfaces of two parts that form a compartment for a temperature sensing element of the sensor is interposed with a sealing material being compressed by an raised portion on one of the abutting surfaces to the other surface. Because the sealing material is in contact circularly with both of the two surfaces, that is, one between two concentric raised portions on one of the abutting surfaces and the other that confronts the former surface, a seal for the temperature sensing element can be kept for a long period of time even when the raised portions have a scratch.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: April 10, 2007
    Assignee: Denso Corporation
    Inventor: Hideki Nakabayashi
  • Publication number: 20050185696
    Abstract: In a temperature sensor for an engine, abutting surfaces of two parts that form a compartment for a temperature sensing element of the sensor is interposed with a sealing material being compressed by an raised portion on one of the abutting surfaces to the other surface. Because the sealing material is in contact circularly with both of the two surfaces, that is, one between two concentric raised portions on one of the abutting surfaces and the other that confronts the former surface, a seal for the temperature sensing element can be kept for a long period of time even when the raised portions have a scratch.
    Type: Application
    Filed: February 8, 2005
    Publication date: August 25, 2005
    Inventor: Hideki Nakabayashi
  • Publication number: 20050175066
    Abstract: A thermal sensor is pushed into a housing bushing so that a pin of the sensor is locked in an opening of the housing bushing. The thermal sensor is thereby easily fixed within the housing bushing. Further, the thermal sensor does not rotate within the housing bushing.
    Type: Application
    Filed: December 23, 2004
    Publication date: August 11, 2005
    Inventor: Hideki Nakabayashi