Patents by Inventor Hideki Shibata

Hideki Shibata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150328704
    Abstract: A gear machining device is provided which can machine an accurate gear by a cutting process by synchronously rotating a machining tool and a workpiece at a high speed. A machining tool includes roughing cutting teeth for roughing bottom lands and right and left side faces of teeth of a gear, right side face finishing cutting teeth for finishing the right side faces of the teeth, and left side face finishing cutting teeth for finishing the left side faces of the teeth. The cutting teeth thus cut different parts of the teeth of the gear. This can reduce cutting resistance and suppress self-vibration during the cutting process, thereby improving tooth trace accuracy of the gear.
    Type: Application
    Filed: April 28, 2015
    Publication date: November 19, 2015
    Applicant: JTEKT CORPORATION
    Inventors: Hisashi OTANI, Hiroyuki NAKANO, Hideki SHIBATA
  • Patent number: 9184357
    Abstract: A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: November 10, 2015
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshiaki Sugizaki, Hideki Shibata, Masayuki Ishikawa, Hideo Tamura, Tetsuro Komatsu, Akihiro Kojima
  • Patent number: 9176496
    Abstract: A substrate treating apparatus having a substrate treating unit, a load port for receiving pods for storing the substrates, and transferring the pods to and from the substrate treating unit, and a buffer between the substrate treating unit and the load port for transferring the substrates to and from the substrate treating unit and the load port, and temporarily storing the pods; a carrier transport system for transferring the pods to and from the load port; and a host computer for transporting the pods in response to conditions. A transport-related control unit, when the load port is being used by one of the pods and a vehicle of the carrier transport system approaches to transfer another of the pods to the load port, to suspends a notice of transfer disapproval until completion of the use by the one of the pods.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: November 3, 2015
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Hideki Shibata
  • Publication number: 20150017750
    Abstract: According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.
    Type: Application
    Filed: October 2, 2014
    Publication date: January 15, 2015
    Inventors: Yoshiaki Sugizaki, Hideki Shibata, Akihiro Kojima, Masayuki Ishikawa, Hideo Tamura, Tetsuro Komatsu
  • Patent number: 8884327
    Abstract: According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: November 11, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiaki Sugizaki, Hideki Shibata, Akihiro Kojima, Masayuki Ishikawa, Hideo Tamura, Tetsuro Komatsu
  • Patent number: 8868233
    Abstract: A control apparatus in a substrate treating system with a substrate treating apparatus having a physical load port for receiving pods for storing substrates, and a carrier transport system for transporting the pods to and from the physical load port. The control apparatus includes a virtual load port control device for allotting a virtual load port to the physical load port, and instructing the carrier transport system to perform a transporting operation to and from the virtual load port on an assumption that the virtual load port really exists.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: October 21, 2014
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventor: Hideki Shibata
  • Publication number: 20130324342
    Abstract: A motor driving force transmission device includes electric motors which produce motor driving force with which a rear differential is operated and a speed reduction and transmission mechanism which reduces the speed of the motor driving force of the electric motors and transmits it to the rear differential. The speed reduction and transmission mechanism has eccentric cams which rotate as the electric motors are driven, transmission members which rotate as the eccentric cams rotate, and is disposed on an outer circumference of the rear differential.
    Type: Application
    Filed: January 11, 2012
    Publication date: December 5, 2013
    Applicant: JTEKT CORPORATION
    Inventors: Tohru Onozaki, Tsune Kobayashi, Masaharu Tagami, Motoyasu Yamamori, Hiroshi Takuno, Kunihiko Suzuki, Tomoyoshi Takai, Keita Nomura, Hideki Shibata
  • Patent number: 8545356
    Abstract: A speed change gear device is provided with a housing, a first member supported rotatably about a predetermined rotational axis, a shaft member formed with an external gear, an annular member formed with an internal gear meshing with the external gear, and a transmission mechanism for transmitting a rotational component only of the annular member to the shaft member or a disc member arranged to be rotatable relative to the housing. The external gear differs from the internal gear in the number of teeth. Further, the first member is formed with a receiving hole that receives the annular member at a position where the center of the annular member is at a predetermined distance from the rotational axis. Then, the annular member is received in the receiving hole rotatably relative to the first member.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: October 1, 2013
    Assignee: JTEKT Corporation
    Inventors: Tsune Kobayashi, Tohru Onozaki, Hideki Shibata
  • Publication number: 20130203544
    Abstract: A speed change gear device is provided with a housing, a first member supported rotatably about a predetermined rotational axis, a shaft member formed with an external gear, an annular member formed with an internal gear meshing with the external gear, and a transmission mechanism for transmitting a rotational component only of the annular member to the shaft member or a disc member arranged to be rotatable relative to the housing. The external gear differs from the internal gear in the number of teeth. Further, the first member is formed with a receiving hole that receives the annular member at a position where the center of the annular member is at a predetermined distance from the rotational axis. Then, the annular member is received in the receiving hole rotatably relative to the first member.
    Type: Application
    Filed: July 22, 2011
    Publication date: August 8, 2013
    Applicant: JTEKT Corporation
    Inventors: Tsune Kobayashi, Tohru Onozaki, Hideki Shibata
  • Patent number: 8475315
    Abstract: An easily structured swing internal contact type planetary gear device is proposed which can achieve a higher meshing ratio when an involute tooth profile is adapted. Each of an internal tooth of an internally toothed gear wheel and an external tooth of an externally toothed gear wheel is formed with an involute tooth profile. Under a driving condition, one of an internal tooth body of the internally toothed gear wheel and an external tooth body of the externally toothed gear wheel is elastically deformed in an extending direction and the other thereof is elastically deformed in a contracting direction so that the number of meshing teeth becomes larger than the number of meshing teeth under a non-driving condition.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: July 2, 2013
    Assignee: JTEKT Corporation
    Inventors: Tsune Kobayashi, Motoyasu Yamamori, Atsushi Ando, Katsuhito Yoshinaga, Hideki Shibata, Akira Saito, Tohru Onozaki, Naomasa Mukaide, Tomohiko Haruyama
  • Patent number: 8436378
    Abstract: According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating film, a first interconnection, a second interconnection, a first metal pillar, a second metal pillar, a resin, and a fluorescent layer. The semiconductor layer has a first major surface, a second major surface formed on an opposite side to the first major surface, and a light emitting layer. The first electrode and the second electrode are provided on the second major surface of the semiconductor layer. The fluorescent layer faces to the first major surface of the semiconductor layer and includes a plurality of kinds of fluorescent materials having different peak wavelengths of emission light.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: May 7, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akihiro Kojima, Yoshiaki Sugizaki, Hideki Shibata, Hideo Tamura, Tetsuro Komatsu, Masayuki Ishikawa
  • Publication number: 20130079914
    Abstract: A substrate treating apparatus having a substrate treating unit, a load port for receiving pods for storing the substrates, and transferring the pods to and from the substrate treating unit, and a buffer between the substrate treating unit and the load port for transferring the substrates to and from the substrate treating unit and the load port, and temporarily storing the pods; a carrier transport system for transferring the pods to and from the load port; and a host computer for transporting the pods in response to conditions. A transport-related control unit, when the load port is being used by one of the pods and a vehicle of the carrier transport system approaches to transfer another of the pods to the load port, suspends a notice of transfer disapproval until completion of the use by the one of the pods.
    Type: Application
    Filed: August 28, 2012
    Publication date: March 28, 2013
    Inventor: Hideki SHIBATA
  • Publication number: 20130045827
    Abstract: An easily structured swing internal contact type planetary gear device is proposed which can achieve a higher meshing ratio when an involute tooth profile is adapted. Each of an internal tooth of an internally toothed gear wheel and an external tooth of an externally toothed gear wheel is formed with an involute tooth profile. Under a driving condition, one of an internal tooth body of the internally toothed gear wheel and an external tooth body of the externally toothed gear wheel is elastically deformed in an extending direction and the other thereof is elastically deformed in a contracting direction so that the number of meshing teeth becomes larger than the number of meshing teeth under a non-driving condition.
    Type: Application
    Filed: February 15, 2011
    Publication date: February 21, 2013
    Applicant: JTEKT CORPORATION
    Inventors: Tsune Kobayashi, Motoyasu Yamamori, Atsushi Ando, Katsuhito Yoshinaga, Hideki Shibata, Akira Saito, Tohru Onozaki, Naomasa Mukaide, Tomohiko Haruyama
  • Patent number: 8378377
    Abstract: According to one embodiment, a light emitting device includes a light emitting chip, an external terminal made of a metal material, and a circuit board. The light emitting chip is mounted on the circuit board via the external terminal. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer. The circuit board includes an interconnection bonded to the first metal pillar and the second metal pillar via the external terminal, and a heat radiation material provided on an opposite side of the interconnection and connected to the interconnection.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: February 19, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiaki Sugizaki, Hideki Shibata, Akihiro Kojima, Masayuki Ishikawa, Hideo Tamura, Tetsuro Komatsu
  • Patent number: 8377726
    Abstract: According to one embodiment, a light emitting device includes a stacked body, a p-side and n-side electrodes, an insulating film, a p-side extraction electrode, an n-side extraction electrode, a resin layer and a phosphor layer. The stacked body has a first and a second surface opposite to each other and includes a light emitting layer. A p-side and an n-side electrode are provided on the second surface. An insulating film has openings to which the p-side and n-side electrodes are exposed. A p-side extraction electrode includes a p-side seed metal and a p-side metal wiring layer. An n-side extraction electrode includes an n-side seed metal and an n-side metal wiring layer. A resin layer is filled around the p-side and n-side extraction electrodes, and a phosphor layer is provided on a side of the first surface. Emission light from the light emitting layer is emitted through the first surface.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: February 19, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akihiro Kojima, Yoshiaki Sugizaki, Hideki Shibata, Hideo Tamura, Tetsuro Komatsu, Masayuki Ishikawa
  • Patent number: 8373192
    Abstract: According to one embodiment, a semiconductor light emitting device includes a plurality of semiconductor layers, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer, and is mounted in a bent state on a curved surface. The plurality of semiconductor layers includes a first main surface, a second main surface opposite to the first main surface, and a light emitting layer, the plurality of semiconductor layers being separated from one another. A material is provided between the plurality of the semiconductor layers separated from one another. The member has a higher flexibility than the semiconductor layers being.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: February 12, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiaki Sugizaki, Hideki Shibata, Akihiro Kojima, Masayuki Ishikawa, Hideo Tamura, Tetsuro Komatsu
  • Publication number: 20130013103
    Abstract: A control apparatus in a substrate treating system with a substrate treating apparatus having a physical load port for receiving pods for storing substrates, and a carrier transport system for transporting the pods to and from the physical load port. The control apparatus includes a virtual load port control device for allotting a virtual load port to the physical load port, and instructing the carrier transport system to perform a transporting operation to and from the virtual load port on an assumption that the virtual load port really exists.
    Type: Application
    Filed: July 3, 2012
    Publication date: January 10, 2013
    Inventor: Hideki SHIBATA
  • Publication number: 20120237320
    Abstract: A substrate treating apparatus includes a pod storage unit 9 between a substrate treating unit 11 and a pod storage and transport unit 7, with a transport robot 19 transporting FOUPs 3 between a load port 5 and a rack array 33. A transport robot 31 transports the FOUPs 3 between the rack array 33, a rack array 69 and a receiver 27. The transportation between the load port 5 and rack array 33 and the transportation between the rack array 69, rack array 33 and receiver 27 can be carried out substantially in parallel. As a result, the efficiency of transporting the FOUPs 3 can be improved to improve throughput. Moreover, an increase in apparatus size can be inhibited since only the pod storage unit 9 is disposed between the pod storage and transport unit 7 and substrate treating unit 11. The capacity for storing the FOUPs 3 can be increased to make effective use of the high throughput of the apparatus.
    Type: Application
    Filed: February 8, 2012
    Publication date: September 20, 2012
    Inventors: Ichiro MITSUYOSHI, Hideki SHIBATA, Tomoyasu FURUTA
  • Publication number: 20120097972
    Abstract: A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed.
    Type: Application
    Filed: December 2, 2011
    Publication date: April 26, 2012
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Yoshiaki SUGIZAKI, Hideki Shibata, Masayuki Ishikawa, Hideo Tamura, Tetsuro Komatsu, Akihiro Kojima
  • Patent number: D726113
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 7, 2015
    Assignee: DDK Ltd.
    Inventors: Nobuyuki Senba, Hideki Shibata