Abstract: A heat dissipation device includes: a first plate with a first surface on which a first heat dissipation fin is formed; a second plate with a first surface on which a second heat dissipation fin is formed, and a heat conduction unit that passes through a first through-hole of the first plate and a second through-hole of the second plate.

Abstract: A cooling device including: a heat receiver in which a working fluid is enclosed, a heat sink in which the working fluid is enclosed, an air tube made of metal so as to have flexibility, the air tube coupling the heat receiver and the heat sink, the air tube in which the working fluid of a gas phase flows through, and a liquid tube made of metal so as to have flexibility, the liquid tube coupling the heat receiver and the heat sink, the liquid tube in which the working fluid of a liquid phase flows through.

Abstract: A base station, includes: an electronic unit; a housing, including a resin, configured to accommodate the electronic unit; a valve, provided in the housing and including a communication channel communicating an inside of the housing with an outside, configured to open the communication channel if an internal pressure of the housing exceeds a value.

Abstract: A heat dissipation device includes: a first plate with a first surface on which a first heat dissipation fin is formed; a second plate with a first surface on which a second heat dissipation fin is formed, and a heat conduction unit that passes through a first through-hole of the first plate and a second through-hole of the second plate.

Abstract: A base station, includes: an electronic unit; a housing, including a resin, configured to accommodate the electronic unit; a valve, provided in the housing and including a communication channel communicating an inside of the housing with an outside, configured to open the communication channel if an internal pressure of the housing exceeds a value.

Abstract: A heat relay mechanism includes a heat-dissipating member for dissipating heat, a buffer member contacted with the heat-dissipating member at a first surface, a thermally deformable member connected to a second surface of the buffer member and deforms at a high temperature, a heat pipe connected to the thermally deformable member at one end, and a device connected to another end of the heat pipe.

Abstract: The card mounting configuration includes a card with a height that is approximately half that of conventional cards and integration of a front plate and a back plate of the card with a support to prevent circuit board distortion. A card ejector is attached on the front plate, and a plug-in connector is provided on the back plate. A housing with guides to receive the cards contains two levels, upper and lower, wherein six cards are mounted into each level. A plug-in connector on the card passes through a hole in a back board or supplemental backplane of the housing and is connected to a part of an external line connector that appears inside the housing.

Abstract: A rack structure which is capable of improving heat-dissipating efficiency thereof within a limited space, and a communication apparatus which is capable of enhancing cooling efficiency by applying the rack structure thereto. In the rack structure of the communication apparatus, the air used for cooling printed circuit boards within a lower shelf and thereby increased in temperature is cooled by causing the same to flow through the heat-dissipating duct on a lateral side and is then used again for cooling printed circuit boards within an upper shelf. This makes it possible to increase the heat-dissipating efficiency of the communication apparatus to thereby improve the cooling performance thereof. As a consequence, the necessity of increasing the number of cooling fans or increasing the size of fans becomes small, and the cooling performance of the communication apparatus can be maintained within a limited installation space.

Abstract: The card mounting configuration includes a card with a height that is approximately half that of conventional cards and integration of a front plate and a back plate of the card with a support to prevent circuit board distortion. A card ejector is attached on the front plate, and a plug-in connector is provided on the back plate. A housing contains two levels, upper and lower, wherein six cards are mounted into each level. A plug-in connector passes through a hole in a back board of the housing and is connected to a part of an external line connector that is exposed on the inside of the housing.

Abstract: A rack structure which is capable of improving heat-dissipating efficiency thereof within a limited space, and a communication apparatus which is capable of enhancing cooling efficiency by applying the rack structure thereto. In the rack structure of the communication apparatus, the air used for cooling printed circuit boards within a lower shelf and thereby increased in temperature is cooled by causing the same to flow through the heat-dissipating duct on a lateral side and is then used again for cooling printed circuit boards within an upper shelf. This makes it possible to increase the heat-dissipating efficiency of the communication apparatus to thereby improve the cooling performance thereof. As a consequence, the necessity of increasing the number of cooling fans or increasing the size of fans becomes small, and the cooling performance of the communication apparatus can be maintained within a limited installation space.

Abstract: A rack structure body for a machine includes a frame body provided at one of a front surface side and a back surface side of the rack structure body. The frame body includes a main frame part formed by bending and a sub frame part formed by bending. The sub frame part is installed inside of the main frame part. The frame body has a hollow structure.

Abstract: The invention relates to a heat radiation member and a cabinet to be installed outdoors in a hermetic state, having a heat radiation function for heat radiation of devices contained therein. The object of the invention is to facilitate maintenance, downsize the cabinet, and prevent occurrence of noise. It includes: a cabinet body containing a heat source; a cover member attached to an aperture of the cabinet and having a guide portion guiding, to an exterior of the cabinet, a heat transfer member for transferring therethrough heat from the heat source by use of a hydraulic fluid; and a heat radiation part being a thermal conductor and in contact with the heat transfer member on a face and covering the heat transfer member from the exterior of the cabinet and having a heat radiation member on a face opposite to the face in contact with the heat transfer member.

Abstract: The invention relates to a heat radiation member and a cabinet to be installed outdoors in a hermetic state, having a heat radiation function for heat radiation of devices contained therein. The object of the invention is to facilitate maintenance, downsize the cabinet, and prevent occurrence of noise. It includes: a cabinet body containing a heat source; a cover member attached to an aperture of the cabinet and having a guide portion guiding, to an exterior of the cabinet, a heat transfer member for transferring therethrough heat from the heat source by use of a hydraulic fluid; and a heat radiation part being a thermal conductor and in contact with the heat transfer member on a face and covering the heat transfer member from the exterior of the cabinet and having a heat radiation member on a face opposite to the face in contact with the heat transfer member.

Abstract: A rack structure body for a machine includes a frame body provided at one of a front surface side and a back surface side of the rack structure body. The frame body includes a main frame part formed by bending and a sub frame part formed by bending. The sub frame part is installed inside of the main frame part. The frame body has a hollow structure.

Abstract: A communication device includes a number of transmitter/receiver/modem blocks installed in vertical positions. Each of the transmitter/receiver/modem blocks includes a supporting board having a front surface and a back surface, the supporting board including a plurality of fins on the front surface and a plurality of forced air-cooling fans on the supporting board. A front cover encloses the front surface of the supporting board, the front cover and the fins forming a plurality of ducts, the front cover and the front surface forming an internal opening under the fins. A back cover encloses the back surface of the supporting board. First heat-radiating circuit modules are provided at positions adjacent to the fins on the front surface. A second heat-radiating circuit module is provided within the opening.

Abstract: A magnetic head element has one or more rails formed on the surface thereof. Each rail is formed so as to have a tapered angle of 55-85°. To form such a rail, ion milling is conducted; the rail substrate used is allowed to have an inclination angle to 15-60° and is rotated; and there is used, as the ion milling gas, a fluorinated hydrocarbon (e.g., CH2FCF3) gas alone or a mixed gas of said fluorinated hydrocarbon gas and Ar, SF6 or the like. Accordingly, a magnetic head rail shape gives a small variation in flying height between magnetic bead and magnetic disc.

Abstract: Three pads are disposed on the surface of a magnetic head facing to a storage medium and are brought into contact with the surface of the storage medium through a lubricant layer. The total of areas of the three pads is equal to or larger than 0.0001 mm.sup.2 and equal to or smaller than 0.02 mm.sup.2 and the height of the pads is equal to or higher than 5 .mu.m and equal to or lower than 100 .mu.m. Two pads of the three pads include tapers formed in the front thereof and are disposed in a forward position in a relative movement direction to the storage medium and one remaining pad is disposed in a backward position. The total of areas of the two pads in the forward position is set to be narrower than an area of the pad in the backward position. A writing and reading function unit is provided in the pad in the backward position.

Abstract: A magnetic head element has one or more rails formed on the surface thereof. Each rail is formed so as to have a tapered angle of 55-85.degree.. To form such a rail, ion milling is conducted; the rail substrate used is allowed to have an inclination angle to 15-60.degree. and is rotated; and there is used, as the ion milling gas, a fluorinated hydrocarbon (e.g., CH.sub.2 FCF.sub.3) gas alone or a mixed gas of said fluorinated hydrocarbon gas and Ar, SF.sub.6 or the like. Accordingly, a magnetic head rail shape gives a small variation in flying height between magnetic head and magnetic disc.

Abstract: A magnetic head element has one or more rails formed on the surface thereof. Each rail is formed so as to have a tapered angle of 55.degree.-85.degree.. To form such a rail, ion milling is conducted; the rail substrate used is allowed to have an inclination angle to 15.degree.-60.degree. and is rotated; and there is used, as the ion milling gas, a fluorinated hydrocarbon (e.g. CH.sub.2 FCF.sub.3) gas alone or a mixed gas of said fluorinated hydrocarbon gas and Ar, SF.sub.6 or the like. Accordingly, a magnetic head rail shape gives a small variation in flying height between magnetic head and magnetic disc.

Abstract: A frame structure for a communication system includes a framework for accommodating a communication system and a cover member mounted on the framework. The cover member has an insulating material layer provided between a semiconducting material layer and a conducting material layer, and is mounted so that the conducting material layer will face inside. The semiconducting material layer and the conducting material layer are electrically connected to each other.