Patents by Inventor Hideki Tanigami

Hideki Tanigami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6122973
    Abstract: A capacitance-type pressure sensor capable of reducing a variation in reference capacitance. The capacitance-type pressure sensor includes insulating spacer (3b) arranged between a main capacitive electrode (4) and a reference capacitive electrode (5) to couple a base substrate (1) and a diaphragm substrate (2) to each other. The insulating spacer (3b) is patterned so as to restrain a variation in distance between the reference capacitive electrode (5) and a counter electrode (10) arranged on the diaphragm substrate (2). Such construction reduces a variation in capacitance between the reference capacitive electrode (5) and the diaphragm electrode (10), to thereby increase accuracy at which a pressure is measured.
    Type: Grant
    Filed: May 15, 1998
    Date of Patent: September 26, 2000
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Kazuo Nomura, Kiyoshi Tanaka, Satoshi Nakao, Hideki Tanigami, Kazutaka Hayashi
  • Patent number: 5932808
    Abstract: The present invention provides a pressure sensor module which is capable of restraining application of a pressure of increased magnitude to a connector, reducing the number of parts therefor and compacting a structure thereof. A connector body (3a) is provided on a base section thereof with a flange (3g). An annular support (4) which is made of a material hard to be deformed under a high pressure as compared with the connector body (3a) is provided with an annular engagement recess (4b). The annular support (4) is fitted on the connector body (3a) to engage the flange (3g) with the annular engagement recess (4b). The annular support (4) is contacted on one end surface (4a) thereof with a pressure non-sensing side insulating substrate (5a) of a pressure sensing element (5) outside the base section of the connector body (3a).
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: August 3, 1999
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Kazutaka Hayashi, Satoshi Nakao, Kiyoshi Tanaka, Hideki Tanigami, Hideto Ishikawa, Yoshimitsu Motoki