Abstract: A via filling method that provides superior filling properties and superior planarization of the deposited metal layer is provided. This is achieved by a method having a F/R ratio, the ratio of the electric current densities between the forward electrolysis and the reverse electrolysis, is in the range of 1/1 to 1/10 in a PPR electric current method applied with a cycle wherein the forward electrolysis interval is from 1 to 50 msec and the reverse electrolysis interval is from 0.2 to 5 msec.

Abstract: Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an electrolytic copper plating solution. The present invention can prevent the copper layer on the resulting composite material from forming aggregation and, when the plating is intended to fill vias, make it possible to achieve the via-filling without voids. The present invention also relates to a method for controlling the electrolytic copper plating solution by using an amount of a specific decomposition product of the sulfur-containing compound as an index.

Abstract: A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.

Abstract: Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to said electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The method described above can maintain and restore the electrolytic copper plating solution so as to maintain satisfactory appearance of plated copper, fineness of deposited copper film, and via-filling.

Abstract: The present invention offers a non-charging resin composite material and method for manufacturing said resin composite material. In particular, a non-charging resin composite material can be manufactured by using liquid containing metal ions to treat the surface of a resin base treated with ion-exchange group introduction agent, thereby introducing metal ions. By then converting said metal ions, a component containing metal element is introduced at the surface of the resin base in such a small amount that charging of the resin base can be prevented, without increasing the low conductivity intrinsic to the resin base to above a certain level, which has been difficult in the past. With said non-charging resin composite material, damage due to the adhesion of dirt or dust on the base is prevented, as is damage to the base caused by static electricity resulting from charging.

Abstract: Disclosed are (1) a heat-sensitive recording material comprising a support, a heat-sensitive recording layer comprising a leuco dye and a developer, and a protective layer comprising a resin in the form of a film, the protective layer being obtained by coating the heat-sensitive recording layer with a protective layer aqueous coating composition comprising at least resin particles having a core/shell structure and then drying the coating, wherein the resin in the form of a film formed of said resin particles having a core/shell structure is present in an amount of not less than 80 mass % of the total solids of the protective layer, and the protective layer having a gloss (based on JIS P 8142) of not less than 80%, (2) a heat-sensitive recording material comprising an interlayer between the heat-sensitive recording layer and the support of the heat-sensitive recording material (1), as well as processes for preparing these heat-sensitive recording materials.

Abstract: A quartz glass component having a projection on a flat face is manufactured by molding a quartz glass body at a high temperature and under high pressure. The heating temperature is set to a range of from 1800.degree. to 2000.degree. C. and slight pressure is applied by the female die which forms the projection, or pressure in a direction against gravity. The molding die includes a graphite frame surrounding a molding space formed by a female die and a receiving die sandwiching the quartz glass body in the graphite frame. The space between the receiving die and the female die is width-reducible, the compositions of the graphite frame and the two graphite dies are made to differ, the female die and receiving die contacting the quartz glass body during pressure molding have a plurality of gas-permeable micropores such as in sintered graphite for example and are formed by a high-purity graphite material having air permeability.