Abstract: An apparatus for photolithographically transferring, onto a plate-like member a pattern corresponding to picture elements of a liquid crystal display device and a pattern corresponding to driving circuits and so on, by use of a photomask. The surface of the plate-like member is divided into different areas and, each time one of the different areas of the plate-like member is subjected to the pattern transfer operation, the plate-like member is fed stepwise relative to an optical system provided to project an image of the photomask onto the plate-like member. At the same time, the range of the photomask pattern which is to be transferred onto the plate-like member is changed.

Abstract: An apparatus for photolithographically transferring, onto a plate-like member a pattern corresponding to picture elements of a liquid crystal display device and a pattern corresponding to driving circuits and so on, by use of a photomask. The surface of the plate-like member is divided into different areas and, each time one of the different areas of the plate-like member is subjected to the pattern transfer operation, the plate-like member is fed stepwise relative to an optical system provided to project an image of the photomask onto the plate-like member. At the same time, the range of the photomask pattern which is to be transferred onto the plate-like member is changed.

Abstract: An exposure apparatus for exposing in a step-and-scan manner a plate-like member to a pattern with radiation so that images of the pattern are transferred onto different regions on the plate-like member. The apparatus includes a mirror imaging optical system for projecting the image of the pattern onto the plate-like member, a carriage for scanningly moving, at the time of exposure, the plate-like member relative to the mirror imaging system, and a stage movably mounted on the carriage for step-feeding the plate-like member at the time of non-exposure so as to sequentially place the different regions of the plate-like member at an exposure station under the mirror imaging system. A locking system is provided to lock the stage relative to the carriage by use of vacuum, at the time of exposure, whereby unwanted displacement of the plate-like member relative to the carriage at the time of scanning exposure is prevented.

Abstract: An exposure apparatus for exposing in a step-and-scan manner a plate-like member to a pattern with radiation so that images of the pattern are transferred onto different regions on the plate-like member. The exposure apparatus includes a mirror imaging optical system for projecting the image of the pattern onto the plate-like member. Also, the exposure apparatus includes a carriage for scanningly moving, at the time of exposure, the plate-like member relative to the mirror imaging optical system and a stage for step-feeding the plate-like member at the time of non-exposure so as to sequentially place the different regions of the plate-like member at an exposure station under the mirror imaging system. The stage is mounted on the carriage, and the movement of the carriage is guided by linear air-bearings.

Abstract: An exposure apparatus for exposing a plate-like member to a pattern with radiation in a step-and-repeat manner thereby to transfer images of the pattern onto different regions on a surface of the plate-like member. The apparatus includes an X-Y stage for moving the plate-like member in X and Y directions, a .theta.-stage for moving the plate-like member in a .theta. (rotational) direction relative to the X-Y stage, and laser interferometers for measuring an amount of movement of the plate-like member, by the X-Y stage, in each of the X and Y directions by use of a mirror mounted on the .theta.-stage. Placement of the mirror on the .theta.-stage allows correction of yawing if it occurs during movement of the plate-like member by X-Y stage. Also, deviation of the plate-like member in the Y direction if it occurs during movement of the plate-like member by the X-Y stage in the X direction, is detected by the laser interferometers. This allows detection of a positional error of the mirror in the .theta.

Abstract: An alignment apparatus for mask and wafer each having alignment marks provided in a narrow strip like area between circuit patterns is disclosed, which mask and wafer are used in manufacturing semiconductor circuit elements. In the apparatus, the mask and wafer are scanned to obtain scan signals by means of which the amount of relative deviation between the alignment marks on mask and wafer is detected. By means of the detected signal, an alignment is effected between the mask and wafer in the apparatus. For this type of alignment apparatus, there is a problem that since the alignment marks are provided in the narrow strip like area, no coincidence between the scanning position and the strip area is attainable with pre-alignment accuracy. Improvement in the alignment apparatus according to the invention lies in that a reading of alignment marks is initiated after the coincidence is photoelectrically detected.

Abstract: An alignment device of a type, wherein an alignment pattern provided on a mask for fabrication of a semiconductor circuit element and an alignment pattern provided on a wafer are photoelectrically read in a dark field by a flying spot scanning system or a flying image scanning system to detect a relative positional relationship between the mask and the wafer, and a desired positional relationship is obtained by moving at least one of the mask and wafer on the basis of a detected signal. The novel feature of this alignment device resides in that the size of a line forming the alignment pattern along the scanning line is twice or more as large as the size of the scanning spot.

Abstract: An alignment apparatus by which two points on a first standard line on a first workpiece may be aligned in two regions having as the centers two standard points on a second standard line on a second workpiece optically opposed to the first workpiece and having predetermined areas. The two regions are diamond-shaped. By this, it is possible to reduce the alignment error of the first and second workpieces.

Abstract: An alignment apparatus in which alignment marks on a mask and a wafer for producing a semiconductor circuit element are photoelectrically read and the positional deviation between the two alignment marks is detected and one of the mask and the wafer is parallel-moved in accordance with the detected amount to align the mask and wafer into a predetermined positional relation. This apparatus has the function of correcting any interval error which may be present between the alignment marks.

Abstract: This invention relates to a photo-electrical detecting apparatus for forming a dark-field image of an object on a one-dimensional image sensor and reading said image photo-electrically. The apparatus includes a telecentric objective lens, and a light source image is formed on the clear aperture plane of said lens, said image being in focus in a direction on said plane and out of focus in a perpendicular direction. A line- or band-shaped area of the object is illuminated by the light from said light source image. Thus a dark-field image of the object is formed on said one-dimensional image sensor by providing, on a plane equivalent to said aperture plane, a filter which intercepts the normal reflected light from said object and transmits the scattered light therefrom.

Abstract: A printing apparatus for use in the manufacture of semiconductor circuit elements, comprising a fixed mirror imaging system. A mask holder and wafer holder are respectively provided in an upper horizontal plane and a lower horizontal plane on the optical axis above and below said mirror imaging system, the light emerging from the mask being introduced into said system by a mirror inclined at 45.degree. to the optical axis while the light emerging from said system is directed to the wafer by an another mirror inclined at 45.degree. to the optical axis. The mask holder and wafer holder are integrally movable in the horizontal direction to allow formation of the entire image of mask on the wafer.

Abstract: An improved photoelectric detecting apparatus is disclosed in which a subject surface containing a pattern which diffracts light in a predetermined direction is scanned with spotlight and the diffracted light coming from the pattern is detected by means of photoelectric element so as to read out information of the pattern. The apparatus comprises a first photoelectric element for detecting the light diffracted in the predetermined direction, a second photoelectric element adapted for detecting light diffracted in directions other than the predetermined direction and an operational circuit for operating the signal derived from the first photoelectric element and that derived from the second one. Thus, when there is any diffractive matter such as flaw, dust and the like on the subject surface, diffracted light from the diffractive matter is detected by both the first and second photoelectric elements whereas diffracted light from the pattern is detected only by the first photoelectric element.

Abstract: A method for opposing a sheet-like material to a standard plane with predetermined space therebetween, which method when applied to a non-contact (proximity) printer such as one of IC and LSI construction, can improve the efficiency of the printing operation. The method comprises two sub-steps of a preparation step and a step for actually opposing the sheet-like material to the standard plane; the preparation step is done where no standard plane is present and in the preparation step the space or distance between a sub-standard plane having a predetermined relation with the standard plane and the sheet-like material on a carrier is measured and the measured value is memorized.

Abstract: In the system disclosed, illuminating means form an optical path. An imaging system in the optical path includes a support for a mask, an imaging lens that focuses the image of the mask onto an optical plane, and a support that holds a component having a radiation-sensitive surface at the plane. A filter in the illuminating system blocks out light capable of affecting the radiation-sensitive material but allows passage of some visible light so that the image of the mask can be seen on the component. A half-mirror or beam splitter allows light from the imaging lens to focus on the component but deflects a portion of the light coming from the component toward an analyzer that detects the alignment between the image of the mask and the component. A second half-mirror or beam splitter near the first half-mirror compensates for radial shift of the image relative to the axis of the light path caused by the first half-mirror.

Abstract: A both-side printing device which adjusts the mutual position of patterns to a predetermined relation and prints the patterns on the both sides of a both-side sensitive body of a predetermined thickness, in which the relation of the mutual position of individual patterns to be formed on the both-side sensitive body can be detected prior to the both-side printing by imaging one pattern on a mask of other pattern or on a plane having the other pattern formed thereon, and thereby alignment of the two patterns can be effected.