Patents by Inventor Hidemoto Fukuzawa

Hidemoto Fukuzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5162087
    Abstract: An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in thatsaid insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative,5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, andsaid particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.
    Type: Grant
    Filed: August 30, 1991
    Date of Patent: November 10, 1992
    Assignees: Soken Chemical & Engineering Co., Ltd., Chemitech Corporation
    Inventors: Hidemoto Fukuzawa, Tatsuhiro Imai, Yasuhiro Okada, Noriyuki Ousaka