Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).

Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.

Abstract: An object of the present invention is to provide a photosensitive resin composition or a photosensitive resist for color filters which is superior in heat resistance, water resistance, solvent resistance, chemical resistance, and also transparency, and a method for producing color filters using them. The present invention relates to a photosensitive resin composition comprising a vinyl polymer (A) having at least one cyclocarbonate group and at least one carboxyl group in the molecule and a compound (B) having at least two ethylenically unsaturated double bonds in the molecule as a main component, which can introduce crosslinked structures by photocuring and thermosetting, a photosensitive resist for color filters comprising the photosensitive resin composition and a colorant, and a method for producing a color filter, using the photosensitive resist for color filters.

Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).

Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.

Abstract: Objects of the present invention are the provision of an active energy ray curable composition which can be cured in the absence of a photoinitiator, and which can also be cured at practical light intensities and irradiating energy, and a method for curing the said curable composition; in which the composition comprises a maleimide derivative represented by formula (1): wherein m and n each represent an integer of 1 to 5, and the total of m and n is 6 or smaller, R11 and R12 each represent a linking group selected from the group consisting of {circle around (1)} an alkylene group, {circle around (2)} an alicyclic group, {circle around (3)} an arylalkylene group, and {circle around (4)} a cycloalkylalkyene group, G1 and G2 each represent an ester linkage selected from the group consisting of —COO— and —OCO—, R2 represents a linking chain having an average molecular weight of 100 to 100,000 selected from the group consisting of (A) a (poly)ether linking chain and (B

Abstract: The present invention provides a radiation curable resin composition and method of production therefor; the present composition has wide applications as an ink, coating or the like, is dilutable in water or an organic solvent, and forms a coating which has excellent hardening characteristics and adherence to a substrate, as well as superior resistance to heat, chemicals and boiling, this resin composition may be redissolved with water or an organic solvent prior to hardening; which have a number average weight of 500 to 50,000, characterized in that the aprotic ammonium salt represented by general formula 1 is contained in the resin in the amount of 0.1 to 4.0 mol/kg.

Abstract: An ionizing radiation-curable resin composition which provides a cured product having no yield point in the stress-strain diagram in tension is disclosed. An optical article prepared from the ionizing radiation-curable resin composition and a surface light source using the optical article are also disclosed. The present invention provides an excellent ionizing radiation-curable resin composition, an excellent optical article comprising a cured product of the resin composition, and an excellent surface light source using the optical article, which have high surface hardness and a high refractive index and are free from deformation, permanent sets, and reduction in weather resistance after curing.

Abstract: A radiation-curing resin composition comprising (A) a resin having a carboxylic acid group and an unsaturated double bond and (B) a compound containing a cyclocarbonate group. The composition is excellent in stability and curing properties and provides a cured film excellent in water resistance, solvent resistance, chemical resistance, and heat resistance.

Abstract: Polyurethane polyurea particles are obtained by an interfacial polymerization reaction between a hydrophobic phase which is capable of forming a three-dimensional crosslinked structure by reaction and is a mixture comprising a polyisocyanate compound and a polyhydroxy compound with the isocyanate groups being stoichiometrically excessive, and a polyamine in an amount not more than one equivalent of the stoichiometrically excessive isocyanate groups in the hydrophobic phase, and by polyurethanization reaction inside the particles.

Abstract: A curable resin composition comprising an isocyanuric ring-containing urethane-modified radical-polymerizable compound. The composition can give a protective coating having excellent surface mar resistance and improved secondary adhesion.

Abstract: An activation energy-curable resin composition comprising as an essential ingredient a resin obtained by reacting (a) the reaction product of a novolac epoxy compound and an unsaturated monocarboxylic acid with (b) the reaction product of a diisocyanate and a poly(meth)acrylate having one hydroxyl group for each molecule.

Abstract: A composition for water-base paints, said composition comprising (I) a water-soluble resin, and (II) a water-dispersible polymer containing at least one group selected from the class consisting of hydroxyl and carboxyl groups, said water-soluble resin being obtained by polymerizing 50 to 99.5% by weight of an alkyl ester of an .alpha.,.beta.-monoethylenically unsaturated acid or an alkenyl benzene, 0.5 to 20% by weight of an .alpha.,.beta.-monoethylenically unsaturated acid and 0 to 30% by weight of a hydroxyalkyl ester of an .alpha.,.beta.-monoethylenically unsaturated acid in the presence of at least one unsaturated compound selected from the group consisting of alkyd resins containing a polymerizable unsaturated group, epoxy esters containing a polymerizable unsaturated group, drying oils, fatty acids of drying oils and diene polymers, and water-solubilizing the product with ammonia or an amine.