Abstract: A transfer apparatus has a transfer robot for transferring wafers between a process chamber and a pre-pressurizing chamber. The process chamber and pre-pressurizing chamber are arranged in a circle. The transfer robot has multiple arms, arranged hierarchically, for transferring the wafers. The arms are rotatable along the circle and vertically movable.

Abstract: A transfer apparatus has a transfer robot for transferring wafers between a process chamber and a pre-pressurizing chamber. The process chamber and pre-pressurizing chamber are arranged in a circle. The transfer robot has multiple arms, arranged hierarchically, for transferring the wafers. The arms are rotatable along the circle and vertically movable.

Abstract: An apparatus suitable for producing semiconductors. The apparatus includes a processing chamber, a first preparatory chamber, and a second preparatory chamber. Workpieces are transferred to the processing chamber for processing in a vacuum. The first and second preparatory chambers are used for transferring the workpiece between the processing chamber and an exterior exposed to atmospheric pressure without exposing the processing chamber to the atmospheric pressure. The first and second preparatory chambers are aligned vertically, which reduces the floor space occupied by the apparatus.

Abstract: A planer magnetron sputtering apparatus having a magnetic source which is rotated eccentrically around the axis of the target and has a particular arrangement of a plurality of permanent magnets to form the magnetic field. Using this particular arrangement of permanent magnets, the target surface is exposed to the plasma for the same period of time, and this increases the uniformity of the target erosion and deposits the sputtered material uniformly on the substrate, as a result, an increase of the lifetime of the target can be expected.