Abstract: The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.

Abstract: To provide a thermosetting resin composition having excellent film-forming properties, which can form a cured product having low elastic modulus and having low dielectric constant and low dielectric loss tangent in a high frequency range; and a thermosetting resin composition comprising (A) a vinyl compound represented by the general formula (1), and (B) a rubber and/or a thermoplastic elastomer.

Abstract: The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.

Abstract: A displacement control mechanism used in a variable displacement compressor for controlling a displacement of the compressor includes a first control valve located on a supply passage and a second control valve located on a first bleed passage. The second control valve includes a backpressure chamber having substantially the same pressure atmosphere as a region of the supply passage downstream of the first control valve and a spool including a back surface that is located in the backpressure chamber. The spool reduces an opening degree of the first bleed passage when a pressure in the backpressure chamber is increased. The spool blocks a communication between the backpressure chamber and the first bleed passage via a clearance formed around a cylindrical outer peripheral surface of the spool in the second control valve when the spool sets the first bleed passage at a minimum opening degree.

Abstract: A displacement control mechanism controls displacement of a variable displacement type compressor that forms a refrigerant circulation circuit for an air conditioning apparatus. The displacement is decreased as a pressure in a crank chamber rises while being increased as the pressure in the crank chamber falls. The displacement control mechanism includes a bleed passage, a supply passage, a first control valve and a second control valve. The second control valve includes a back pressure chamber, a valve chamber, a valve body, a spring and a second valve portion. The second valve portion is provided with the back surface of the valve body. The second valve portion closes an opening of an introduction passage in the back pressure chamber when the first valve portion maximizes the opening of the bleed passage.

Abstract: A compressor includes a housing, a compression mechanism, a rotary unit and a sliding bearing. The compression mechanism compresses refrigerant in the housing. The rotary unit drives the compression mechanism. The sliding bearing is supported in the housing while rotatably supporting the rotary unit. The sliding bearing has a base member, porous metal layer and fluoro resin layer. The surface of the base member is coated with the porous metal layer having solid lubricating performance. The surface is coated with the fluoro resin layer through the porous metal layer.

Abstract: A method of producing a shoe for a swash plate type compressor, said shoe being disposed between a swash plate and a piston of said swash plate type compressor, the method comprising: a forming step of forming a steel blank into a shoe product including an end product shoe and a pre size-adjusted shoe; and a nitriding step of effecting a nitriding treatment on said shoe product; and wherein a quenching treatment is not effected after said forming step.

Abstract: Variable displacement compressor may include a swash plate inclinably coupled to a drive shaft. A piston may be disposed within a cylinder bore and an end portion of the piston may be connected to a peripheral edge of the swash plate by a shoe. The piston preferably reciprocates within the cylinder bore in order to compress a refrigerant in response to rotation of the inclined swash plate. The inclination angle of the swash plate can be changed to change the compressor output discharge capacity. A rotor is preferably coupled to the drive shaft so that the rotor rotates together with the rotating drive shaft. A hinge mechanism connects the swash plate with the rotor by means of a guide on a rotary disk of the rotor. The hinge mechanism transmits torque from the drive shaft to the swash plate regardless of the inclination angle of the swash plate.