Patents by Inventor Hidenori Kimpara

Hidenori Kimpara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4503186
    Abstract: A curable resin composition comprising (a) a polyphenylene resin, (b) a maleimide compound and/or a cyanate ester compound and (c) at least one compound selected from the group consisting of compounds having one or more acryloyl, methacryloyl, acryloxy or methacryloxy groups is disclosed. The curable resin composition can give a cured resin having resistance to heat, solvent and moisture and adhering property.
    Type: Grant
    Filed: March 1, 1982
    Date of Patent: March 5, 1985
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Akitoshi Sugio, Masanobu Masu, Masatugu Matunaga, Hidenori Kimpara
  • Patent number: 4429112
    Abstract: A method for delaying curing rate of a curable resin composition comprising a polyfunctional cyanate ester compound or mixture of a polyfunctional cyanate ester compound and a polyfunctional maleimide compound, characterized in that a specific benzene sulfonic acid is added to said composition is disclosed.
    Type: Grant
    Filed: June 1, 1982
    Date of Patent: January 31, 1984
    Assignee: Mitsubishi Gas Chemical Co., Inc.
    Inventors: Morio Gaku, Syunichi Nagai, Hidenori Kimpara, Satoshi Ayano
  • Patent number: 4104192
    Abstract: An oxygen absorbent comprising a dithionite and at least one compound having water of crystallization or water of hydration is disclosed.
    Type: Grant
    Filed: January 19, 1977
    Date of Patent: August 1, 1978
    Assignee: Mitsubishi Gas Chemical Company Inc.
    Inventors: Yoshio Yoshikawa, Akira Amemiya, Sigeru Kimoto, Hidenori Kimpara