Abstract: A filter includes a multilayer body including dielectric layers and conductor layers, input and output terminals provided on a surface of the multilayer body, a first conductor pattern that has a planar shape forming at least a part of a closed pattern having an opening, a second conductor pattern that is connected to the input terminal, at least partially overlaps at least a part of the first conductor pattern, has an end portion located within the opening, and extends from an inside of the opening to an outside of the closed pattern, and a third conductor pattern that is connected to the output terminal, at least partially overlaps at least a part of the first conductor pattern, does not overlap the second conductor pattern, has an end portion located within the opening, and extends from the inside of the opening to the outside of the closed pattern.

Abstract: A filter includes an input terminal, an output terminal, a plurality sets of first capacitors that include first ends connected to a plurality sets of first nodes, respectively, at different locations in a path capable of transmitting a high frequency signal from the input terminal to the output terminal, and second ends commonly connected to a second node, a plurality sets of first inductors that include third ends connected to the first nodes, respectively, and the fourth ends commonly connected to a third node, a second inductor that includes a fifth end connected to the second node, and a sixth end grounded, and a third inductor that includes a seventh end connected to the third node, and an eighth end grounded.

Abstract: A filter includes an input terminal, an output terminal, a plurality sets of first capacitors that include first ends connected to a plurality sets of first nodes, respectively, at different locations in a path capable of transmitting a high frequency signal from the input terminal to the output terminal, and second ends commonly connected to a second node, a plurality sets of first inductors that include third ends connected to the first nodes, respectively, and the fourth ends commonly connected to a third node, a second inductor that includes a fifth end connected to the second node, and a sixth end grounded, and a third inductor that includes a seventh end connected to the third node, and an eighth end grounded.

Abstract: A contactor includes: a silicon layer composing a part of beam part with a rear end side provided at a base part and with a front end side sticking out from the base part; SiO2 layer as an insulating layer formed on the silicon layer; and a conductive layer formed on the SiO2 layer.

Abstract: Probes are arranged precisely and at a narrow pitch. Provided is a probe structure receiving and transmitting an electric signal from/to a device. The probe structure includes a contact point that transmits an electric signal, a probe on which the contact point is formed, a probe pad section that is electrically coupled to the contact point, and an insulating section that is provided on the probe and that insulates a bonding wire connected to the probe pad section from the probe. A probe apparatus, a manufacturing method of a probe structure, and a test apparatus are also provided.

Abstract: A contactor includes conductive parts for electrical connection with input/output terminals of an IC device; beam parts with the conductive part provided on their main surfaces; and a base part supporting the beam parts in a cantilever manner, the base part has a support region supporting the beam parts and mark formation regions at which first positioning marks are provided, and weakened parts relatively weaker in strength than other parts of the base part are provided between the support region and mark formation regions.

Abstract: Minute probes are created to correspond to the alignment of the input/output terminals of a device under test. A probe manufacturing method of manufacturing a probe, includes: forming a contact section on a probe main body; and shaping at least one of the contact section and the probe main body by cutting by means of a cutting tool. The contact section is formed on a substrate that is to become the probe main body, and the probe manufacturing method further includes: after shaping at least one of the contact section and the substrate that is to become the probe main body, removing the portion of the substrate excluding the probe main body thereby forming a probe.

Abstract: A contactor (60) comprises: conductive parts (63) for electrical connection with input/output terminals of an IC device; beam parts (62) with the conductive part (63) provided on their main surfaces; and a base part (61) supporting the beam parts (62) in a cantilever manner, the base part (61) has a support region (611) supporting the beam parts (62) and mark formation regions (612) at which first positioning marks (613) are provided, and weakened parts (614) relatively weaker in strength than other parts of the base part (61) are provided between the support region (611) and mark formation regions (612).

Abstract: A contactor includes: a silicon layer composing a part of beam part with a rear end side provided at a base part and with a front end side sticking out from the base part; SiO2 layer as an insulating layer formed on the silicon layer; and a conductive layer formed on the SiO2 layer.

Abstract: A probe card 6 is produced by forming probe pins 2, each having a thin film portion 21, three-dimensionally on a substrate 1 having a concave portion 11 formed thereon, forming bumps 3 at base end portions of the probe pins 2, moving the substrate 1 to the probe card substrate 4 side while supporting the same by a flip-chip bonder, bonding the probe pins 2 to pads 42 on said probe card substrate 4 via the bumps 3, then, moving the substrate 1 to the side separating from the probe card substrate 4 by the flip-chip bonder and rupturing the probe pins 2 at adjacent portions of the thin film portions 21 to mechanically remove the substrate 1 from the probe pins 2.

Abstract: A probe card including a minute and highly accurate probe pin, including a probe pin electrically connecting with the electronic device; and a wiring substrate including a wiring electrically connecting with the probe pin. The probe pin includes: a first end electrically connecting with the wiring; a contact section extending from the first end to a direction away from the wiring substrate, the contact section being formed to oppose the wiring substrate and electrically connecting with the electronic device; a second end extending from the contact section and electrically connecting with the wiring; and a hollow section formed in an area sandwiched between the wiring substrate and the contact section.